My Inquiry
My Account
NXP Semiconductors MC9S08PA16AMTJ
.jpg)
- Part No.:
- MC9S08PA16AMTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08PA16AMTJ.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,741
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08PA16AMTJ from NXP Semiconductors is an 8-bit S08 microcontroller with 16 KB flash, 2 KB RAM, and 256 B EEPROM, operating at up to 20 MHz across –40 °C to 125 °C. It integrates dual FlexTimer modules (6-channel + 2-channel), 12-bit 12-channel ADC, I²C, two SCI/LIN UARTs, SPI, RTC, and analog comparator - deployed in automotive body control modules requiring robust low-power operation and mixed-signal integration.
For engineers reviewing the MC9S08PA16AMTJ datasheet, MC9S08PA16AMTJ pinout, MC9S08PA16AMTJ application, or MC9S08PA16AMTJ equivalent, key selection criteria include its M-temperature grade (–40 °C to 125 °C), TSSOP-20 package, 20 mA high-drive GPIO capability, single-wire BDM debug interface, and flash/EEPROM endurance under extended thermal stress.
Technical Context
The MC9S08PA16AMTJ implements an enhanced S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a precision internal clock source (ICS) with FLL and factory-trimmed reference (±1% over 0–70 °C, ±2% over full range) and an external crystal oscillator (XOSC) supporting 4–20 MHz crystals or 31.25–39.0625 kHz resonators.
System protection includes independent watchdog with dedicated 1 kHz oscillator, programmable low-voltage detect/warning with hysteresis, illegal opcode/address detection, and flash/RAM access protection. Power management supports Stop3 mode with <1.35 µA typical current and peripheral clock gating for selective module enablement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU, up to 20 MHz bus frequency at 2.7–5.5 V |
| Memory | 16 KB flash (read/program/erase over full voltage/temp), 2 KB RAM, 256 B EEPROM with 2-byte erase sectors |
| ADC | 12-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, stop-mode operation |
| Timers | Two FTM modules (6-channel + 2-channel), 16-bit counter, input capture/output compare/PWM; one 8-bit modulo timer |
| Communication | I²C (up to 400 kbps), two SCI/LIN UARTs, one SPI (master/slave, full/single-wire), CRC module |
| GPIO & I/O | 18 GPIO pins in 20-pin TSSOP package; four 20 mA ultra-high-current sink/source pins; true open-drain on PTA2/PTA3 |
| Operating Range | –40 °C to +125 °C ambient, 2.7–5.5 V supply, qualified for automotive M-grade applications |
Pinout & Package
MC9S08PA16AMTJ is housed in a 20-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm pitch, optimized for compact automotive and industrial PCB layouts. Thermal resistance is 116 °C/W (single-layer board) and 76 °C/W (four-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0 | Port A bit 0 / Keyboard interrupt / FTM0 channel 0 / Analog comparator 0 / ADC channel 0 | Multi-function pin supporting GPIO, wake-up, PWM output, comparator input, and analog sensing |
| PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1 | Port A bit 1 / Keyboard interrupt / FTM0 channel 1 / Analog comparator 1 / ADC channel 1 | Shared functionality enables sensor interface with hardware-triggered capture or threshold alert |
| PTA2/KBI0P2/RxD0/SDA1 | Port A bit 2 / Keyboard interrupt / SCI0 receive / I²C data | True open-drain output; supports bidirectional I²C bus and asynchronous serial receive |
| PTA3/KBI0P3/TxD0/SCL1 | Port A bit 3 / Keyboard interrupt / SCI0 transmit / I²C clock | True open-drain output; enables I²C master clock generation and SCI0 transmit with level flexibility |
| PTA4/ACMPO/BKGD/MS | Port A bit 4 / Analog comparator output / Background debug / Master select | Output-only pin; provides comparator result and serves as single-wire debug interface signal |
| PTA5/IRQ/TCLK0/RESET | Port A bit 5 / Interrupt request / Timer clock input / Reset input | Active-low reset with internal pull-up; accepts external interrupt or external timer clock source |
| PTB0/KBI0P4/RxD0/ADP4 | Port B bit 0 / Keyboard interrupt / SCI0 receive / ADC channel 4 | Dual-use for serial communication and analog input; supports shared signal routing in space-constrained designs |
| PTB1/KBI0P5/TxD0/ADP5 | Port B bit 1 / Keyboard interrupt / SCI0 transmit / ADC channel 5 | Enables SCI0 full-duplex operation while providing additional ADC channel for multi-sensor systems |
| VDD, VSS | Power supply and ground | Single power domain (2.7–5.5 V); VDDA/VSSA not separated - analog and digital share supply |
| EXTAL/XTAL | External oscillator input/output | Supports fundamental-mode crystals (4–20 MHz) or ceramic resonators; requires external load capacitors |
Key Features
| Feature | Design Value |
|---|---|
| Flash memory with program/erase during execution | Enables firmware updates and data logging without halting real-time control tasks |
| Stop3 low-power mode with <1.35 µA typical current | Supports battery-backed applications like door modules or sensors requiring years of standby life |
| 20 mA high-current drive on four GPIO pins | Directly drives LEDs, relays, or small solenoids without external drivers in cost-sensitive nodes |
| Single-wire background debug (BDM) interface | Reduces PCB footprint and test point count while enabling full in-circuit debugging and flash programming |
| Programmable low-voltage detect with four warning levels | Allows graded system response (e.g., graceful shutdown, warning flag, or non-critical task suspension) |
| Hardware CRC module | Offloads checksum computation from CPU for reliable firmware image verification and data integrity checks |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time motor control, LIN communication with slave nodes, and analog sensor monitoring (e.g., rain/light sensors). Use Value: Integrated 20 mA GPIO drives window lift motors directly; 12-bit ADC resolves light intensity to 0.1% accuracy; M-grade temp range ensures reliability under hood-side mounting. |
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and CO₂ in HVAC ducts or smart building zones. IC Role / Device Role / Timing Role: Low-power data acquisition controller managing sensor polling, local decision logic, and wireless transmission scheduling. Use Value: Stop3 mode extends 10-year battery life; integrated RTC enables precise timestamping; I²C interface simplifies connection to digital sensors. |
| Appliance Motor Controller | Medical Diagnostic Handheld |
|
Use Scenario: Speed-regulated BLDC motor control in cordless power tools with torque feedback and thermal protection. IC Role / Device Role / Timing Role: Real-time motor commutation engine using FTM PWM outputs, ADC for current sensing, and ACMP for overcurrent fast-shutdown. Use Value: 20 MHz bus enables sub-microsecond PWM update; 2.5 µs ADC conversion captures transient current spikes; high-drive pins interface with gate drivers directly. |
Use Scenario: Portable blood glucose meter with electrochemical strip reading, display control, and USB data export. IC Role / Device Role / Timing Role: Mixed-signal front-end processor handling analog strip signal conditioning, LCD driver timing, and USB protocol stack offload. Use Value: 12-bit ADC achieves 0.5 mV resolution for accurate glucose quantification; BKGD pin enables field firmware updates via USB-to-BDM adapter; EEPROM stores calibration coefficients securely. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZ128AMLH | ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, 12-bit ADC, same 20-pin LQFP/TSSOP package option | Higher performance, floating-point support, and CMSIS-compliant toolchain; lacks true open-drain pins and 20 mA drive | Select when migrating to ARM ecosystem or requiring >20 MHz deterministic throughput; verify I/O drive compatibility for direct replacement. |
| MC9S08AC128CFUE | S08 core, 128 KB flash, 8 KB RAM, 10-bit ADC, 44-pin QFP package, –40 °C to 105 °C rating | Higher memory capacity and pin count; lower temperature grade and no 20 mA GPIO; different peripheral mix (no RTC, fewer timers) | Choose for legacy S08 code reuse where larger flash and more I/O are needed, but avoid in M-grade thermal environments or space-constrained layouts. |
Compared with MC9S08PA16AMTJ, S9KEAZ128AMLH offers modern architecture and scalability but requires redesign for I/O drive and debug interface, while MC9S08AC128CFUE provides expanded memory at the cost of thermal rating and package size - making MC9S08PA16AMTJ optimal for compact, thermally demanding, cost-sensitive automotive nodes.
Availability
MC9S08PA16AMTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and portable medical devices requiring stable component supply, long-term lifecycle assurance, and M-grade qualification.
Supply support for MC9S08PA16AMTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers, RF, and analog technologies.
The MC9S08PA16AMTJ belongs to NXP's legacy S08 8-bit MCU family, designed specifically for cost-optimized, thermally robust automotive body control and industrial embedded applications requiring high reliability and low-power operation.
FAQ
What is the maximum operating temperature specification for MC9S08PA16AMTJ?
The MC9S08PA16AMTJ is rated for operation from –40 °C to +125 °C ambient temperature, meeting automotive M-grade requirements. This specification is validated across full voltage range (2.7–5.5 V) and applies to all on-chip peripherals including flash, ADC, and timers - confirmed in Table 10 and Section 5.4 of the Rev. 4 datasheet.
Does MC9S08PA16AMTJ support in-system programming via its debug interface?
Yes, MC9S08PA16AMTJ supports full in-system programming and debugging via its single-wire background debug (BKGD) interface. The on-chip ICE module enables flash erase/program, breakpoint setting, and real-time register inspection without removing the device from the target board - detailed in Section 7.5 and Figure 1 of the datasheet.
How many ADC channels are available on MC9S08PA16AMTJ, and what is their resolution?
MC9S08PA16AMTJ features a 12-channel, 12-bit successive-approximation ADC with 2.5 µs conversion time, internal bandgap reference, and optional hardware trigger. All 12 channels are accessible in the 20-pin TSSOP package, with inputs mapped to PTA0–PTA3, PTB0–PTB1, and PTC0–PTC5 per Table 1 and Section 7.3.1.
Can MC9S08PA16AMTJ operate in low-power modes while maintaining RTC functionality?
Yes, MC9S08PA16AMTJ maintains RTC operation in Stop3 mode using its internal 1 kHz low-power oscillator (LPO). The RTC continues counting with <1 µA typical current adder, enabling time-stamped wake-up events or periodic interrupts - specified in Table 5 (item 7) and Section 7.1 of the datasheet.
What are the package dimensions and thermal characteristics of MC9S08PA16AMTJ?
MC9S08PA16AMTJ uses a 20-pin TSSOP package (JEDEC MO-153) with 4.4 mm × 6.5 mm body size and 0.65 mm lead pitch. Its thermal resistance is 116 °C/W on single-layer board and 76 °C/W on four-layer board - values documented in Table 10 under "20-pin TSSOP" and validated per JEDEC JESD51 standards.
MC9S08PA16AMTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 18
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08PA16AMTJ FAQ
1.How can I place an order for MC9S08PA16AMTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08PA16AMTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08PA16AMTJ reliable?
The price and inventory of MC9S08PA16AMTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PA16AMTJ is usually 5 days.
3.What payment methods are accepted for MC9S08PA16AMTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08PA16AMTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08PA16AMTJ?
MC9S08PA16AMTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08PA16AMTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08PA16AMTJ?
For technical support, including MC9S08PA16AMTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PA16AMTJ requirements.
6.How does Aetrix verify that MC9S08PA16AMTJ is sourced from the original manufacturer or authorized distributors?
All MC9S08PA16AMTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PA16AMTJ meets industry standards.
7.What is the process for return or replacement of MC9S08PA16AMTJ?
All MC9S08PA16AMTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PA16AMTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08PA16AMTJ part is unused and in its original packaging.
Return procedure for MC9S08PA16AMTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08PA16AMTJ Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
