NXP Semiconductors MC9S08PA16AVLCR

Overview

MC9S08PA16AVLCR from NXP Semiconductors is an 8-bit S08 microcontroller with 16 KB flash, 2 KB RAM, and 256 B EEPROM, operating at up to 20 MHz across –40 °C to 105 °C. It integrates dual FlexTimer modules (6-channel + 2-channel), 12-bit 12-channel ADC, two SCI/LIN UARTs, I²C, SPI, RTC, and analog comparator - deployed in automotive body control modules, industrial sensor nodes, and smart appliance motor controllers.

For engineers reviewing the MC9S08PA16AVLCR datasheet, MC9S08PA16AVLCR pinout, MC9S08PA16AVLCR application, or MC9S08PA16AVLCR equivalent, key selection criteria include its 32-pin LQFP package, 20 mA high-drive GPIO capability, stop3-mode current of 1.3 µA, integrated background debug interface, and support for LIN-compliant serial communication in automotive subsystems.

Technical Context

This MCU implements the HCS08 core with four-level nested interrupt handling and up to 40 interrupt/reset sources. Its clock system combines a 4–20 MHz external crystal oscillator (XOSC) and an internal clock source (ICS) with FLL-based frequency multiplication and factory-trimmed reference enabling ±1% accuracy from 0 °C to 70 °C.

System protection includes independent watchdog timer, programmable low-voltage detect (LVD) with four warning thresholds, illegal opcode/address detection, and flash/RAM access protection. Peripherals are managed via the System Integration Module (SIM), supporting peripheral clock gating to reduce active and stop-mode power consumption.

Key Specifications

Pinout & Package

MC9S08PA16AVLCR is housed in a 32-pin LQFP package (7 × 7 mm, 0.8 mm pitch) with exposed thermal pad. Pin assignments support multiplexed functions including GPIO, analog inputs, timer channels, serial interfaces, and debug signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with S9KEAZ128AMLH and MC9S08AC128CPUE, MC9S08PA16AVLCR delivers optimal balance of LIN integration, ultra-low stop-mode current, and compact 32-pin LQFP packaging for cost-sensitive automotive and industrial edge nodes - without requiring architectural or layout changes.

Availability

MC9S08PA16AVLCR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance motor control, and portable medical diagnostics requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08PA16AVLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and mixed-signal systems-on-chip.

The MC9S08PA16 series belongs to NXP's legacy S08 portfolio, designed specifically for cost-optimized, low-power embedded control in harsh environments - emphasizing robustness, LIN compliance, and minimal external component count.

FAQ

What is the maximum operating frequency and voltage range for MC9S08PA16AVLCR?

The MC9S08PA16AVLCR operates at up to 20 MHz bus frequency across a supply voltage range of 2.7 V to 5.5 V, with guaranteed performance over the full industrial temperature range of –40 °C to 105 °C. Its internal clock source (ICS) with FLL achieves ±1% accuracy from 0 °C to 70 °C and ±2% across the full range, enabling reliable timing without external crystals in many applications. The MC9S08PA16AVLCR supports both FEI and FBE clock modes for flexible system design.

Does MC9S08PA16AVLCR support LIN communication, and how is it implemented?

Yes, MC9S08PA16AVLCR supports LIN 2.x physical layer functionality through its two SCI modules (SCI0 and SCI1), which include optional 13-bit break detection, sync field handling, and LIN-compliant baud rate generation. Each SCI can operate in LIN master or slave mode, and the MCU's integrated timer modules allow precise timing of LIN frame intervals. The MC9S08PA16AVLCR does not require external LIN transceivers for basic implementation, reducing BOM cost and board space in automotive body electronics.

How much current does MC9S08PA16AVLCR consume in its lowest power mode?

In Stop3 mode - the deepest low-power state - MC9S08PA16AVLCR draws only 1.35 µA at 5 V and 1.3 µA at 3 V, with the 1 kHz LPO clock active to maintain RTC and wake-up capability. This mode retains full RAM and register contents while disabling all other clocks. Additional peripherals like ADC or LVD add predictable current increments (e.g., +40 µA for ADC, +128 µA for LVD), allowing precise budgeting for battery-powered applications. The MC9S08PA16AVLCR achieves this efficiency via selective peripheral clock gating and optimized power management circuitry.

What debug interface does MC9S08PA16AVLCR provide, and what are its capabilities?

MC9S08PA16AVLCR features a single-wire Background Debug Mode (BDM) interface using the BKGD/MS pin, supporting in-circuit debugging without halting real-time operation. It provides three hardware breakpoints, on-chip in-circuit emulator (ICE) with two comparators and nine trigger modes, and full memory/register visibility. The MC9S08PA16AVLCR debug architecture allows live variable inspection, flash programming, and non-intrusive trace - essential for rapid development of safety-critical automotive and industrial firmware.

Which GPIO pins on MC9S08PA16AVLCR support 20 mA drive strength, and why is this important?

MC9S08PA16AVLCR has four dedicated high-drive GPIO pins: PTD0, PTD1, PTB4, and PTB5 - each capable of sourcing or sinking up to 20 mA continuously. This eliminates the need for external driver transistors when interfacing with LEDs, small relays, or buzzer circuits in automotive and appliance applications. The MC9S08PA16AVLCR datasheet specifies VOL ≤ 0.8 V and VOH ≥ VDD − 0.8 V under these loads, ensuring reliable logic levels and minimizing heat dissipation on the die.