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NXP Semiconductors MC9S08PA16VWJ

Part No.:
MC9S08PA16VWJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixMC9S08PA16VWJ.pdf
Description:
IC MCU 8BIT 16KB FLASH 20SOIC
Quantity:
Payment:
Payment
Shipping:
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Inventory:952

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Product details

Overview

MC9S08PA16VWJ from NXP (formerly Freescale) is an 8-bit S08 microcontroller designed for industrial and automotive control applications. It features a 20 MHz bus frequency at 2.7–5.5 V, 16 KB flash memory, 256-byte EEPROM with 2-byte erase sectors, 2 KB RAM, and operates across –40 °C to +105 °C. Its integrated peripherals include dual SCI/UART, I²C, SPI, two FTM modules, 12-bit ADC, analog comparator, RTC, and CRC engine.

For engineers reviewing the MC9S08PA16VWJ datasheet, MC9S08PA16VWJ pinout, MC9S08PA16VWJ application, or MC9S08PA16VWJ equivalent, this page delivers verified technical context, package-specific pin assignments, real-world use cases in motor control and sensor interfacing, and validated alternative parts with documented functional and packaging differences.

Technical Context

The MC9S08PA16VWJ implements an enhanced S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system integrates both an external crystal/ceramic oscillator (31.25 kHz–20 MHz) and an internal clock source (ICS) with frequency-locked-loop (FLL), enabling precise 1% frequency stability from 0–70 °C and 2% over –40–105 °C.

System protection includes independent watchdog timer, low-voltage detection with programmable trip points and hysteresis, illegal opcode/address reset logic, and flash/RAM access protection. Debug support is provided via single-wire background debug interface (BDM) with three breakpoints and on-chip ICE module featuring two comparators and nine trigger modes.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture 8-bit S08 CPU with four-level nested interrupts and up to 40 interrupt/reset sources
Max Bus Frequency 20 MHz at 2.7–5.5 V supply, fully rated over –40 °C to +105 °C operating range
Memory 16 KB flash (read/program/erase in-circuit), 256-byte EEPROM (2-byte erase sector), 2 KB RAM
Analog Peripherals 12-channel 12-bit ADC (2.5 µs conversion), one analog comparator with filtering and dual-edge interrupt
Communication Interfaces Two SCI/UART (LIN-capable), one I²C (400 kbps, SMBus/PMBus), one SPI, two FTM modules (6+2 channels)
Power Management Stop3 mode current ≤4.6 µA (5 V), wait mode current ≤5.95 mA (20 MHz), peripheral clock gating support
Package & Pin Count 20-pin SOIC (WJ suffix), 37 GPIOs including four ultra-high-current sink pins (20 mA)

Pinout & Package

MC9S08PA16VWJ is housed in a 20-pin SOIC (Small Outline Integrated Circuit) package with 0.635 mm pitch, JEDEC MS-013 compliant, and thermal resistance RθJA = 82 °C/W on single-layer board.

Pin/Terminal Circuit Role Design Meaning
VDD Supply voltage input Main power rail (2.7–5.5 V); decoupling capacitor required near pin
VSS Ground reference Digital ground return path; must be connected to PCB ground plane
RESET Active-low reset input Asynchronous reset with internal pullup; accepts 100 ns minimum pulse width
EXTAL External oscillator input Connects to crystal/resonator or external clock source (31.25 kHz–20 MHz)
XTAL External oscillator output Drives crystal/resonator; internal feedback resistor enabled when HGO=0
PTA0–PTA7 Port A general-purpose I/O 8-bit bidirectional port; PTA2/PTA3 are true open-drain outputs
PTB0–PTB7 Port B general-purpose I/O 8-bit bidirectional port; PTB4/PTB5 support ultra-high current sink (20 mA)
PTD0–PTD1 Port D general-purpose I/O 2-bit port; PTD0/PTD1 support ultra-high current sink (20 mA)
BKGD Background debug pin Single-wire BDM interface for programming and in-circuit debugging

Key Features

Feature Design Value
Flash & EEPROM endurance 100,000 program/erase cycles for flash; 100,000 cycles for EEPROM with 2-byte sector erase
ADC operation in stop mode 12-bit ADC remains functional during Stop3 mode, enabling low-power sensor wake-up capability
Ultra-high-current I/O Four pins (PTB4, PTB5, PTD0, PTD1) deliver 20 mA sink/source without external drivers
On-chip system protection Independent watchdog clock, programmable LVD thresholds (4 levels per range), illegal opcode/address reset
Real-time debug trace On-chip ICE module supports two hardware breakpoints, nine trigger modes, and comparator-based event capture

Applications

Motor Control Sensor Interface

Use Scenario: Brushless DC motor commutation in HVAC blowers and industrial fans using Hall-effect or back-EMF sensing.

IC Role / Device Role / Timing Role: MCU executes closed-loop speed control, generates six-step PWM via FTM modules, and reads analog sensor inputs.

Use Value: Integrated 12-bit ADC with hardware trigger and stop-mode operation enables precise rotor position sampling without CPU wake-up overhead.

Use Scenario: Multi-sensor data acquisition in automotive cabin air quality modules (CO₂, humidity, VOC).

IC Role / Device Role / Timing Role: Central controller managing I²C sensor polling, ADC conversions, and UART diagnostics reporting.

Use Value: Dual SCI interfaces allow simultaneous LIN diagnostics and CAN gateway bridging; 20 mA I/O drives LED indicators directly.

Industrial PLC I/O Automotive Body Control

Use Scenario: Digital input conditioning and relay driver control in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Handles opto-isolated digital inputs, executes ladder logic, and drives high-side/low-side MOSFETs via GPIO.

Use Value: Four 20 mA sink pins directly drive indicator LEDs or small relays; KBI module supports matrix keypad scanning without CPU polling.

Use Scenario: Door module control integrating window lift, mirror adjustment, and interior lighting functions.

IC Role / Device Role / Timing Role: Real-time coordinator of PWM dimming, LIN communication with master ECU, and fault-safe shutdown sequencing.

Use Value: RTC and low-power Stop3 mode (<4.6 µA) enable battery-conscious sleep states while maintaining timekeeping and wake-on-event capability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08PA16VLD 44-pin LQFP package; adds 7 GPIOs and extra peripheral routing flexibility vs. 20-pin SOIC Preferred for designs requiring >37 I/O or complex signal routing; higher thermal performance (RθJA = 76 °C/W) Select when board layout allows larger footprint and additional I/O or thermal margin is needed.
S9S08PA16VWJ Same pinout and electrical specs; rebranded post-NXP acquisition with identical mask revision (Rev. 2+) No functional or qualification difference; qualified for same automotive/industrial temperature range Drop-in replacement with identical form, fit, and function; recommended for new designs per NXP documentation.

Compared with MC9S08PA16VWJ, MC9S08PA16VLD offers expanded I/O and thermal headroom in LQFP, while S9S08PA16VWJ provides identical functionality under updated NXP branding-both validated for direct use in legacy or new designs requiring guaranteed availability and long-term support.

Availability

MC9S08PA16VWJ is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, sensor fusion modules, and programmable logic controller I/O subsystems requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for MC9S08PA16VWJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation dating to its Freescale acquisition.

The MC9S08PA16VWJ belongs to the S08PA family-designed specifically for cost-sensitive, high-reliability embedded control in harsh environments, emphasizing low-power operation, robust system protection, and seamless debug integration.

FAQ

What is the maximum operating bus frequency of the MC9S08PA16VWJ?

The MC9S08PA16VWJ supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7–5.5 V) and temperature range (–40 °C to +105 °C). This frequency is achievable in FEI, FEE, and FBE clock modes when configured with appropriate oscillator settings and internal FLL tuning. The device maintains timing compliance under worst-case conditions without derating.

Does the MC9S08PA16VWJ support in-application programming (IAP) of flash memory?

Yes, the MC9S08PA16VWJ supports full in-application programming of its 16 KB flash memory-including read, program, and erase operations-while executing code from other flash regions. This capability enables field firmware updates and data logging without halting main application execution, and is guaranteed across the full 2.7–5.5 V supply and –40–105 °C temperature range.

Which pins on the MC9S08PA16VWJ support 20 mA sink/source current?

The MC9S08PA16VWJ designates four pins for ultra-high-current operation: PTB4, PTB5, PTD0, and PTD1. Each supports 20 mA sink or source current at 5 V, enabling direct drive of LEDs, small relays, or optocouplers without external buffer circuitry. These pins retain standard GPIO functionality and are configurable via PORTB and PORTD data direction registers.

Can the MC9S08PA16VWJ operate its ADC during low-power Stop3 mode?

Yes, the MC9S08PA16VWJ's 12-bit ADC remains fully operational in Stop3 mode, allowing analog measurements to trigger wake-up events without exiting low-power state. When enabled, ADC adds only 40 µA to the base Stop3 current (4.6 µA at 5 V), making it suitable for battery-powered sensor nodes requiring periodic environmental sampling with minimal energy overhead.

What debug interface does the MC9S08PA16VWJ provide, and is external hardware required?

The MC9S08PA16VWJ uses a single-wire background debug (BDM) interface accessible via the BKGD pin. It requires an external BDM pod (e.g., PE Micro Cyclone or NXP DEMO9S08PA16) for programming and real-time debugging. No JTAG header is present; all debug functions-including breakpoint setting, register inspection, and memory read/write-are supported through this dedicated wire with no additional pins needed.

MC9S08PA16VWJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
18
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08PA16VWJ FAQ

1.How can I place an order for MC9S08PA16VWJ through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08PA16VWJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MC9S08PA16VWJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PA16VWJ is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08PA16VWJ?

For technical support, including MC9S08PA16VWJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PA16VWJ requirements.

6.How does Aetrix verify that MC9S08PA16VWJ is sourced from the original manufacturer or authorized distributors?

All MC9S08PA16VWJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PA16VWJ meets industry standards.

7.What is the process for return or replacement of MC9S08PA16VWJ?

All MC9S08PA16VWJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PA16VWJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08PA16VWJ part is unused and in its original packaging.

Return procedure for MC9S08PA16VWJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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