NXP Semiconductors MC9S08PA4VWJR
- Part No.:
- MC9S08PA4VWJR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
MC9S08PA4VWJR.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 20SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08PA4VWJR from NXP Semiconductors is an 8-bit S08 microcontroller with 4 KB flash, 512 byte RAM, and 128 byte EEPROM, operating up to 20 MHz across 2.7–5.5 V and –40°C to +105°C. It integrates an 8-channel 12-bit ADC, three 2-channel FlexTimer modules, SCI/UART with LIN support, RTC, analog comparator, and keyboard interrupt module - deployed in automotive body control, industrial sensor nodes, and low-power embedded instrumentation.
For engineers reviewing the MC9S08PA4VWJR datasheet, MC9S08PA4VWJR pinout, MC9S08PA4VWJR application, or MC9S08PA4VWJR equivalent, this page delivers verified electrical specs, validated package mapping (20-pin SOIC), confirmed peripheral timing behavior, real-world use-case implementation guidance, and two rigorously cross-checked alternative parts for design continuity.
Technical Context
The MC9S08PA4VWJR uses an S08 CPU core with nested four-level interrupt handling and supports both FEI (internal FLL) and FBE (external crystal) clock modes. Its ICS includes a frequency-locked loop with factory-trimmed internal reference achieving ±1% accuracy from 0°C to 70°C and ±2% over full operating range.
Peripherals are tightly integrated via the System Integration Module (SIM): ADC operates in stop mode with hardware trigger and watermark buffering; FTM modules support edge- and center-aligned PWM, input capture, and output compare; SCI implements NRZ UART with optional 13-bit break and LIN physical layer compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | S08 8-bit CPU with up to 20 MHz bus frequency at 2.7–5.5 V |
| Memory | 4 KB flash (read/program/erase over full voltage/temp), 512 byte RAM, 128 byte EEPROM with 2-byte erase sectors |
| ADC | 8-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, operation in stop mode |
| Timers | Three 2-channel FlexTimer modules (FTM0/FTM1/FTM2), each with 16-bit counter and configurable PWM/capture/compare |
| Clock Sources | External crystal/ceramic resonator (31.25 kHz–20 MHz); internal ICS with FLL and ±1% trimmed reference |
| Power Management | Low-power stop3 mode (1.5 µA @ 5 V), wait mode, peripheral clock gating via PCE register |
| I/O Capability | 18 GPIOs including two ultra-high-current sink pins (20 mA), one output-only pin (PTA4), true open-drain PTB0 |
Pinout & Package
MC9S08PA4VWJR is packaged in a 20-pin SOIC (package code VWJ), with 0.3 inch body width, standard JEDEC MS-013AC footprint, and lead finish matte tin over nickel.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0 | Port A bit 0 multiplexed I/O | Configurable as keyboard interrupt input, FTM0 channel 0, analog comparator positive input, or ADC channel 0 |
| PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1 | Port A bit 1 multiplexed I/O | Supports keyboard interrupt, FTM0 channel 1, analog comparator negative input, or ADC channel 1 |
| PTA2/KBI0P2/FTM0CH0/RxD0/ADP2 | Port A bit 2 multiplexed I/O | Shares FTM0 channel 0 and SCI0 receive; also ADC channel 2 |
| PTA3/KBI0P3/FTM0CH1/TxD0/ADP3 | Port A bit 3 multiplexed I/O | Shares FTM0 channel 1 and SCI0 transmit; also ADC channel 3 |
| PTA4/ACMPO/BKGD/MS | Port A bit 4 / debug / master select | Output-only pin used for background debug communication and system master/slave selection |
| PTA5/IRQ/FTM1CH0/RESET | Port A bit 5 / interrupt / reset | Active-low reset input with IRQ capability and FTM1 channel 0 function |
| PTB0/KBI0P4/RxD0/TCLK0/ADP4 | Port B bit 0 multiplexed I/O | True open-drain output supporting RxD0, timer clock input, and ADC channel 4 |
| PTB1/KBI0P5/TxD0/ADP5 | Port B bit 1 multiplexed I/O | SCI0 transmit output and ADC channel 5 |
| PTB2/KBI0P6/ADP6 | Port B bit 2 I/O | Keyboard interrupt input and ADC channel 6 |
| PTB3/KBI0P7/TCLK1/ADP7 | Port B bit 3 multiplexed I/O | Timer clock input and ADC channel 7 |
| PTB4/FTM1CH03 | Port B bit 4 high-drive output | Ultra-high-current sink/source pin (20 mA) assigned to FTM1 channel 0 |
| PTB5/FTM1CH13 | Port B bit 5 high-drive output | Ultra-high-current sink/source pin (20 mA) assigned to FTM1 channel 1 |
| PTB6/XTAL | Crystal oscillator input | Connects to crystal or resonator high-side terminal in external oscillator mode |
| PTB7/EXTAL | Crystal oscillator output | Connects to crystal or resonator low-side terminal; also accepts external square-wave clock |
| VDD, VSS | Power supply rails | Primary digital supply (2.7–5.5 V) and ground; separate analog supply pins (VDDA/VSSA) required for ADC/ACMP |
| VREFH, VREFL | Analog reference inputs | High and low reference for ADC and ACMP; can be tied to VDDA/VSSA or driven externally |
| IRQ | Interrupt request input | Edge-triggered interrupt source independent of port configuration on PTA5 |
| BKGD/MS | Background debug interface | Single-wire debug communication line; must be held low during power-up to enter BDM mode |
| RESET | Reset input | Active-low asynchronous reset with internal pullup; triggers illegal opcode/address detection reset |
Key Features
| Feature | Design Value |
|---|---|
| Flash and RAM access protection | Hardware-enforced memory security preventing unauthorized read/write/erase of protected regions |
| On-chip ICE debug module | Two comparators and nine trigger modes enable precise breakpoint and trace-based in-circuit debugging |
| Low-voltage detection (LVD) | Selectable trip points (2.56–4.8 V) with reset or interrupt output and hysteresis for stable brown-out recovery |
| Watchdog with independent clock | Dedicated 1 kHz LPO oscillator ensures watchdog remains functional even when main clocks fail |
| Peripheral clock gating | PCE register allows disabling clocks to unused peripherals in stop3 mode while retaining RTC and ACMP functionality |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time motor control, LIN communication with slave nodes, and ADC-based switch monitoring. Use Value: Integrated LIN-capable SCI, 20 mA drive pins for direct solenoid control, and stop3 mode (1.5 µA) extend battery life during vehicle sleep states. |
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data in remote locations. IC Role / Device Role / Timing Role: Data acquisition controller managing 8-channel ADC sampling, RTC-timed wake-up, and SCI-based wireless transmission. Use Value: ADC operation in stop mode enables low-power periodic sensing; 128 byte EEPROM stores calibration offsets without external components. |
| Smart Appliance Interface Panel | Medical Diagnostic Handheld |
Use Scenario: User interface and subsystem coordination in washing machines, dishwashers, and HVAC controllers. IC Role / Device Role / Timing Role: Front-end processor handling keypad scanning (KBI), display backlight PWM (FTM), and fault reporting via SCI. Use Value: 8-key KBI module reduces external debounce circuitry; FTM center-aligned PWM minimizes EMI in motor-driven displays. |
Use Scenario: Portable blood glucose meter or pulse oximeter requiring precision analog measurement and compact form factor. IC Role / Device Role / Timing Role: Signal conditioning and digitization hub using internal bandgap reference, 12-bit ADC, and ACMP for threshold detection. Use Value: Factory-trimmed bandgap (1.16 V ±20 mV) ensures accurate ADC scaling; ACMP with filtering supports noise-immune signal edge detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08PA8VWJR | 8 KB flash, same 20-pin SOIC package, identical peripheral set and pinout | Supports larger firmware images and more complex state machines without layout change | Select when future firmware growth or bootloader space requirements exceed 4 KB |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 48 MHz max, different architecture and toolchain | Higher performance for real-time control loops or protocol stacks; requires PCB redesign and software migration | Choose for new designs needing scalable processing headroom beyond S08 limitations |
Compared with MC9S08PA4VWJR, MC9S08PA8VWJR offers double flash capacity with zero hardware change, while S9KEAZ128AMLH provides ARM-based scalability at the cost of architectural discontinuity and layout revision.
Availability
MC9S08PA4VWJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08PA4VWJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MC9S08PA4VWJR belongs to the S08PA family - designed specifically for cost-sensitive, low-power embedded control applications where robust analog integration, LIN compatibility, and extended temperature operation are essential.
FAQ
What is the maximum operating frequency and voltage range for the MC9S08PA4VWJR?
The MC9S08PA4VWJR operates at up to 20 MHz bus frequency across a supply voltage range of 2.7 V to 5.5 V, fully specified over the –40°C to +105°C ambient temperature range. Its internal ICS with FLL achieves this speed using either an external crystal (4–20 MHz) or internal reference, and all flash/RAM/EEPROM operations are guaranteed across this full voltage and temperature envelope. This makes MC9S08PA4VWJR suitable for automotive under-hood and industrial environments where wide voltage tolerance and thermal resilience are critical.
Does the MC9S08PA4VWJR support LIN communication, and how is it implemented?
Yes, the MC9S08PA4VWJR supports LIN communication through its SCI0 module, which includes optional 13-bit break detection and non-return-to-zero (NRZ) framing compliant with LIN 2.x physical layer requirements. The SCI is configured in UART mode with programmable baud rate generation and supports automatic wakeup on dominant bus level. No external transceiver is required for basic node functionality, though a LIN transceiver (e.g., TJA1020) is needed for bus-level compliance. This capability is confirmed in the "Peripherals" section of the MC9S08PA4 datasheet Rev. 10.
How many high-current drive pins does the MC9S08PA4VWJR have, and what is their rating?
The MC9S08PA4VWJR has two dedicated high-current drive pins: PTB4 and PTB5, each capable of sourcing or sinking up to 20 mA continuously. These pins are explicitly designated in the datasheet as "ultra-high current sink pins" and maintain VOL ≤ 0.8 V and VOH ≥ VDD – 0.8 V at 20 mA load under 5 V operation. They are intended for direct driving of LEDs, small relays, or solenoids without external buffers - a key differentiator for space-constrained automotive and appliance control designs using MC9S08PA4VWJR.
Can the MC9S08PA4VWJR perform ADC conversions while in low-power stop mode?
Yes, the MC9S08PA4VWJR supports ADC operation in stop3 mode when configured with ADLPC = 1, ADLSMP = 1, ADCO = 1, MODE = 10B, and ADICLK = 11B. In this configuration, the ADC consumes only 96.0 µA @ 5 V (88.3 µA @ 3 V) while performing conversions - enabling periodic sensor sampling without exiting low-power state. This feature is documented in Table 5, item 7 of the MC9S08PA4 datasheet Rev. 10 and is critical for battery-operated applications relying on MC9S08PA4VWJR for energy-efficient data acquisition.
What debug interface does the MC9S08PA4VWJR provide, and what are its capabilities?
The MC9S08PA4VWJR features a single-wire background debug interface (BDM) accessible via the BKGD/MS pin, supporting in-circuit debugging without halting real-time operation. It includes breakpoint capability (up to three active breakpoints), on-chip ICE with two comparators and nine trigger modes, and full register visibility. Debug entry requires holding BKGD/MS low during power-up or issuing a forced reset - a method validated in Section 6.2.1 timing specifications. This BDM implementation is standardized across the S08 family and fully supported by CodeWarrior Development Studio for HCS08.
MC9S08PA4VWJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-SOIC (0.295", 7.50mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 18
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128 x 8
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08PA4VWJR FAQ
1.How can I place an order for MC9S08PA4VWJR through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08PA4VWJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08PA4VWJR reliable?
The price and inventory of MC9S08PA4VWJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PA4VWJR is usually 5 days.
3.What payment methods are accepted for MC9S08PA4VWJR?
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MC9S08PA4VWJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08PA4VWJR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08PA4VWJR?
For technical support, including MC9S08PA4VWJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PA4VWJR requirements.
6.How does Aetrix verify that MC9S08PA4VWJR is sourced from the original manufacturer or authorized distributors?
All MC9S08PA4VWJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PA4VWJR meets industry standards.
7.What is the process for return or replacement of MC9S08PA4VWJR?
All MC9S08PA4VWJR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PA4VWJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08PA4VWJR part is unused and in its original packaging.
Return procedure for MC9S08PA4VWJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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