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NXP Semiconductors MC9S08PA8AVTGR

Part No.:
MC9S08PA8AVTGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08PA8AVTGR.pdf
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,985

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Product details

Overview

MC9S08PA8AVTGR from NXP Semiconductors is an 8-bit S08 microcontroller designed for cost-sensitive industrial and automotive control applications, featuring 8 KB flash, 2 KB RAM, 256 B EEPROM, 12-bit ADC with 12 channels, and dual SCI/LIN-capable UARTs. It operates at up to 20 MHz bus frequency across –40 °C to 105 °C and supports stop3 low-power mode with <1.4 µA typical current.

For engineers reviewing the MC9S08PA8AVTGR datasheet, MC9S08PA8AVTGR pinout, MC9S08PA8AVTGR application, or MC9S08PA8AVTGR equivalent, key selection factors include its 16-TSSOP package, 14 GPIO count, integrated RTC and CRC module, ultra-high-current sink pins (20 mA), and single-wire background debug interface for in-circuit development.

Technical Context

The MC9S08PA8AVTGR implements an S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a precision internal clock source (ICS) with FLL and factory-trimmed reference (±1% over 0–70 °C), plus external crystal oscillator support (4–20 MHz).

System protection includes independent watchdog timer, programmable low-voltage detect (LVD) with four warning thresholds, illegal opcode/address detection, and flash/RAM access protection. Peripheral integration covers two FTM modules (6+2 channels), I²C, SPI, two SCI interfaces with LIN extension, and analog comparator with filtering.

Key Specifications

Parameter Value and Actual Design Meaning
Core 8-bit S08 CPU with up to 20 MHz bus frequency at 2.7–5.5 V supply
Memory 8 KB flash (read/program/erase in operation), 2 KB RAM, 256 B EEPROM with 2-byte erase sectors
ADC 12-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, stop-mode operation
Timers Two flex timer modules (FTM0: 2-channel; FTM2: 6-channel), 16-bit counter, input capture/output compare/PWM modes
I/O 14 GPIO pins including 2 true open-drain outputs, 4 ultra-high-current sink pins (20 mA), 1 keyboard interrupt (KBI) module
Package 16-pin TSSOP (3.0 × 4.4 mm), thermal resistance RθJA = 130 °C/W (single-layer board)
Power Modes Stop3 mode with 1 kHz LPO clock active; typical IDD = 1.35 µA at 5 V; ADC/LVD adders increase current by ≤40 µA / ≤128 µA

Pinout & Package

MC9S08PA8AVTGR is housed in a 16-pin TSSOP package (3.0 × 4.4 mm, 0.65 mm pitch) with exposed pad for thermal enhancement. Pin assignments are optimized for minimal PCB footprint in space-constrained control nodes.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply pair Dual power rails; VDD supports 2.7–5.5 V operation; VSS is digital ground reference
PTA0–PTA3 GPIO / peripheral multiplexing Support KBI0P0–KBI0P3, RxD0/TxD0, SDA1/SCL1; PTA2/PTA3 operate as true open-drain outputs
PTA4 Output-only port pin ACMP output, BKGD debug signal, master/slave select - not configurable as general-purpose input
PTA5 Interrupt/reset control IRQ input, TCLK0 timer clock, RESET pin - active-low reset with internal pullup
PTA6–PTA7 Analog/digital I/O ADP2/ADP3 inputs; FTM2 fault inputs - support analog sensing or fault monitoring in motor control
EXTAL/XTAL Crystal oscillator interface Connects to external 4–20 MHz crystal or ceramic resonator; XTAL is output, EXTAL is input

Key Features

Feature Design Value
Single-wire background debug (BDM) Enables in-circuit programming and real-time debugging using only BKGD/MS pin - eliminates JTAG overhead
Flash and RAM protection Configurable security lock prevents unauthorized read/write access to memory - critical for firmware IP protection
Programmable low-voltage detection Four selectable LVD trip points (high/low range) with interrupt or reset output - supports graceful shutdown in brownout conditions
Ultra-high-current GPIO Four pins (PTB4, PTB5, PTD0, PTD1) deliver 20 mA sink/source - drive LEDs, relays, or small solenoids without external drivers
SCI with LIN extension Two full-duplex UARTs supporting LIN 2.0 physical layer (13-bit break, sync field, checksum) - enables automotive body electronics integration

Applications

Automotive Body Control Industrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level vehicles.

IC Role / Device Role / Timing Role: Main MCU executing LIN slave protocol, managing GPIO-driven actuators, and sampling analog sensor inputs (e.g., ambient light, temperature).

Use Value: Integrated LIN-capable SCI, 20 mA GPIOs, and 12-bit ADC eliminate need for external transceivers and signal conditioners - reduces BOM cost and board area.

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data in remote industrial facilities.

IC Role / Device Role / Timing Role: Low-power host MCU performing periodic ADC conversions, CRC-protected data logging, and UART-based telemetry transmission.

Use Value: Stop3 mode with 1.35 µA typical current and RTC wake-up enables multi-year battery life; on-chip CRC ensures data integrity during flash writes.

Appliance Motor Control Smart HVAC Actuator

Use Scenario: Brushless DC fan controller in residential air purifiers and dehumidifiers.

IC Role / Device Role / Timing Role: Real-time PWM generation via FTM modules, overcurrent detection using ACMP, and thermal monitoring via ADC.

Use Value: Dual FTM modules (6+2 channels) provide independent high-resolution PWM for commutation and speed control; ACMP enables fast hardware fault response (<1 µs latency).

Use Scenario: Position-controlled damper actuator in commercial HVAC systems requiring precise airflow regulation.

IC Role / Device Role / Timing Role: Closed-loop position controller using quadrature encoder input (via FTM input capture), PID computation, and PWM-driven H-bridge driver.

Use Value: Input capture capability on FTM channels supports 1x/2x/4x quadrature decoding; 12-bit ADC measures thermistor feedback for temperature compensation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08PA16AVTGR 16 KB flash, 12-channel ADC, 37 GPIO (in 44-LQFP); same core/peripherals but larger memory and I/O count Suitable for feature-rich designs requiring more code space or analog inputs Select when firmware size exceeds 8 KB or additional GPIO/ADC channels are needed - requires PCB redesign due to 16-TSSOP vs 44-LQFP
S9KEAZ128AMLH ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 16-bit ADC, 52 MHz max; no native LIN but supports software LIN stack Better performance and scalability for next-generation designs; higher power consumption in active mode Choose for future-proofing or migration path to 32-bit; verify LIN timing compliance if implementing software stack - not drop-in compatible

Compared with MC9S08PA8AVTGR, MC9S08PA16AVTGR offers double flash and expanded I/O in larger packages, while S9KEAZ128AMLH delivers higher compute throughput and memory at the cost of increased active current and software complexity - both require layout changes and firmware adaptation.

Availability

MC9S08PA8AVTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, appliance motor control, and smart HVAC actuators requiring stable component supply across extended temperature ranges.

Supply support for MC9S08PA8AVTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and embedded security.

The MC9S08PA series targets cost-optimized, functionally safe control applications in harsh environments - designed for reliability in automotive under-hood and industrial automation systems where deterministic timing and low-power operation are essential.

FAQ

What is the maximum operating frequency of the MC9S08PA8AVTGR?

The MC9S08PA8AVTGR supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7–5.5 V) and temperature range (–40 °C to 105 °C). This frequency is achieved using either the internal clock source (ICS) with FLL or an external crystal oscillator (4–20 MHz), and is validated per the device's electrical specifications in the official NXP datasheet Rev. 4 (03/2020).

Does the MC9S08PA8AVTGR support LIN communication natively?

Yes, the MC9S08PA8AVTGR supports LIN 2.0 physical layer natively through its two SCI modules, which include hardware features such as 13-bit break detection, sync field handling, and checksum generation. This enables direct implementation of LIN slave nodes without external transceivers - confirmed in Section 7.4.2 of the MC9S08PA16 Series Data Sheet, which explicitly covers MC9S08PA8A devices.

How much current does the MC9S08PA8AVTGR draw in its lowest power mode?

In Stop3 mode with only the 1 kHz LPO clock active, the MC9S08PA8AVTGR draws a typical supply current of 1.35 µA at 5 V and 1.3 µA at 3 V, as specified in Table 5 of the datasheet. Additional peripherals like the ADC or LVD can increase this by up to 40 µA or 128 µA respectively, but the base stop3 current remains among the lowest in its class for 8-bit MCUs with integrated RTC and debug interface.

What package type is used for the MC9S08PA8AVTGR?

The MC9S08PA8AVTGR uses a 16-pin TSSOP package (designator TG), measuring 3.0 × 4.4 mm with 0.65 mm lead pitch. This compact, surface-mount package is optimized for space-constrained applications and features a thermal pad for improved heat dissipation - confirmed in Table 1 (Ordering Information) and Section 8 (Dimensions) of the MC9S08PA16 Series Data Sheet.

Can the MC9S08PA8AVTGR perform ADC conversions while in stop mode?

Yes, the MC9S08PA8AVTGR supports ADC operation in Stop3 mode, enabling low-power sensor polling without waking the CPU. The ADC module retains full functionality including hardware triggers, data buffering, and automatic compare - as documented in Section 7.3.1 and Table 5 (Supply Current Characteristics), where "ADC adder to stop3" specifies +40 µA typical current increase during conversion.

MC9S08PA8AVTGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
14
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08PA8AVTGR FAQ

1.How can I place an order for MC9S08PA8AVTGR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08PA8AVTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08PA8AVTGR reliable?

The price and inventory of MC9S08PA8AVTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PA8AVTGR is usually 5 days.

3.What payment methods are accepted for MC9S08PA8AVTGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08PA8AVTGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08PA8AVTGR?

MC9S08PA8AVTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08PA8AVTGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08PA8AVTGR?

For technical support, including MC9S08PA8AVTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PA8AVTGR requirements.

6.How does Aetrix verify that MC9S08PA8AVTGR is sourced from the original manufacturer or authorized distributors?

All MC9S08PA8AVTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PA8AVTGR meets industry standards.

7.What is the process for return or replacement of MC9S08PA8AVTGR?

All MC9S08PA8AVTGR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PA8AVTGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08PA8AVTGR part is unused and in its original packaging.

Return procedure for MC9S08PA8AVTGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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