NXP Semiconductors MC9S08PA8AVWJR

Overview

MC9S08PA8AVWJR from NXP Semiconductors is an 8-bit S08 microcontroller with 8 KB flash, 2 KB RAM, and 256 B EEPROM, operating at up to 20 MHz across –40 °C to 105 °C. It integrates dual SCI (LIN-capable), I²C, SPI, two FTM modules (6+2 channels), 12-bit ADC (12-channel), RTC, and ACMP - deployed in automotive body control modules, industrial sensor nodes, and smart appliance controllers.

For engineers reviewing the MC9S08PA8AVWJR datasheet, MC9S08PA8AVWJR pinout, MC9S08PA8AVWJR application, or MC9S08PA8AVWJR equivalent, this page delivers verified electrical specs, package mapping to 20-pin SOIC, validated peripheral configurations, and real-world use-case guidance for embedded control design under extended temperature and low-power constraints.

Technical Context

The MC9S08PA8AVWJR implements an S08 CPU core with nested interrupt support (up to four levels) and 40 interrupt/reset sources. Its clock system combines a 4–20 MHz external crystal oscillator (XOSC) and an internal clock source (ICS) with FLL-based frequency multiplication, enabling precise 20 MHz bus operation with ≤2% deviation over –40 °C to 105 °C.

System-level protection includes independent watchdog with dedicated LPO clock, programmable low-voltage detection (LVD) with four warning thresholds, illegal opcode/address reset, and flash/RAM access protection. Debug is supported via single-wire background debug interface (BDM) with three breakpoints and on-chip ICE module featuring two comparators and nine trigger modes.

Key Specifications

Pinout & Package

MC9S08PA8AVWJR is packaged in a 20-pin SOIC (Small Outline Integrated Circuit) with 0.300-inch body width and standard JEDEC MS-013AC footprint. Pin assignments follow NXP's MC9S08PA8A variant specification for 20-pin packages, confirmed in Table 1 (Ordering Information) and Figure 9 (Pin Assignments) of Rev. 4 datasheet.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08PA16AVWJR, the MC9S08PA8AVWJR reduces flash capacity by 50% while maintaining identical I/O count, peripheral set, and thermal rating - making it ideal for cost-sensitive, fixed-function control. Against S9KEAZ128AMLH, it trades ARM performance and memory scale for proven S08 toolchain stability, smaller footprint, and lower power in basic deterministic tasks.

Availability

MC9S08PA8AVWJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC9S08PA8AVWJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers, RF, and edge processing.

The MC9S08PA series targets cost-optimized, high-reliability embedded control in harsh environments - designed specifically for automotive body electronics, industrial automation, and white-goods applications demanding extended temperature operation and robust peripheral integration.

FAQ

What is the maximum operating frequency and voltage range for the MC9S08PA8AVWJR?

The MC9S08PA8AVWJR operates at up to 20 MHz bus frequency across a supply voltage range of 2.7 V to 5.5 V, with guaranteed performance over the full industrial temperature range of –40 °C to 105 °C. This specification is confirmed in Section 1 of the MC9S08PA16 Series Data Sheet Rev. 4, which explicitly covers MC9S08PA8(A) variants including MC9S08PA8AVWJR.

Does the MC9S08PA8AVWJR support in-circuit debugging, and what interface is used?

Yes, the MC9S08PA8AVWJR supports in-circuit debugging via a single-wire background debug interface (BDM) with three hardware breakpoints and an on-chip in-circuit emulator (ICE) module containing two comparators and nine trigger modes. This capability is documented in the "Development support" section of the MC9S08PA16 Series Data Sheet Rev. 4, applicable to all MC9S08PA8(A) devices including MC9S08PA8AVWJR.

What package type and pin count does the MC9S08PA8AVWJR use?

The MC9S08PA8AVWJR uses a 20-pin SOIC (Small Outline Integrated Circuit) package with 0.300-inch body width, as specified in the "Package options" section and Table 1 (Ordering Information) of the MC9S08PA16 Series Data Sheet Rev. 4. The 'WJ' suffix in the part number explicitly denotes the 20-pin SOIC variant.

How much flash, RAM, and EEPROM memory does the MC9S08PA8AVWJR include?

The MC9S08PA8AVWJR includes 8 KB of on-chip flash memory, 2 KB of RAM, and 256 bytes of EEPROM - all verified in Table 1 of the MC9S08PA16 Series Data Sheet Rev. 4 under the MC9S08PA8(A) row. Flash supports read/program/erase across full operating voltage and temperature; EEPROM features 2-byte erase sectors and program/erase while executing flash code.

Which communication interfaces are integrated into the MC9S08PA8AVWJR?

The MC9S08PA8AVWJR integrates two SCI modules (both LIN-capable), one I²C module (400 kbps), one SPI module (8-bit, master/slave), and a cyclic redundancy check (CRC) module. These are confirmed in Table 1 and the "Peripherals" section of the MC9S08PA16 Series Data Sheet Rev. 4, which applies identically to the MC9S08PA8AVWJR variant.