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NXP Semiconductors MC9S08PB16MTG

Part No.:
MC9S08PB16MTG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08PB16MTG.pdf
Description:
IC MCU 8BIT 16KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,810

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Product details

Overview

MC9S08PB16MTG from NXP Semiconductors is an 8-bit S08 core microcontroller with 16 KB flash, 1 KB RAM, and operation up to 20 MHz across 2.7–5.5 V supply and –40 °C to 125 °C temperature range. It integrates a 12-channel 12-bit ADC (2.5 µs conversion), dual analog comparators with DAC reference, one operational amplifier (gain ×20), two FTM modules (6+2 channels), SCI/I²C/UART/LIN interfaces, RTC, CRC, and fault detection shutdown (FDS). It serves in industrial sensor nodes and motor control subsystems requiring deterministic real-time response and mixed-signal integration.

For engineers reviewing the MC9S08PB16MTG datasheet, MC9S08PB16MTG pinout, MC9S08PB16MTG application, or MC9S08PB16MTG equivalent, this page delivers verified technical context, package-specific pin mapping, functional alternatives with documented differences, and supply-chain support for production deployment in automotive-qualified embedded systems.

Technical Context

The MC9S08PB16MTG implements an enhanced HCS08 CPU core with four-level nested interrupt handling and up to 30 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference achieving ±0.2% resolution and ±1.5% deviation over –40 °C to 105 °C.

Peripherals include two flex timer modules (FTM0: 2-channel, FTM2: 6-channel), each supporting input capture, output compare, and edge-/center-aligned PWM; a pulse width timer (PWT); and a fault detection shutdown (FDS) module with independently configurable fault inputs and programmable output states (0, 1, high-Z).

Key Specifications

ParameterValue and Actual Design Meaning
Core8-bit S08 CPU with four-level nested interrupt support and 30 interrupt/reset sources
Memory16 KB on-chip flash (read/program/erase over full voltage/temperature), 1 KB RAM
Max Bus Frequency20 MHz at 2.7–5.5 V supply, –40 °C to 125 °C operating range
ADC12-channel, 12-bit resolution, 2.5 µs conversion time, eight-level FIFO, hardware trigger support
TimersTwo 8-bit modulo timers (MTIM), two FTM modules (FTM0: 2-channel, FTM2: 6-channel), 16-bit counters
CommunicationOne SCI/I²C/LIN-capable UART, one I²C interface (up to 400 kbps, multi-master, SMBus)
Analog PeripheralsTwo ACMPs with 6-bit DAC reference, one OPAMP (fixed gain ×20, 100 mV SE input), 1.7 mV/°C temp sensor
Package16-pin TSSOP (MTG suffix), thermal resistance RθJA = 130 °C/W (single-layer board)

Pinout & Package

MC9S08PB16MTG is housed in a 16-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm pitch, JEDEC MO-153 compliant, and moisture sensitivity level (MSL) 3.

Pin/TerminalCircuit RoleDesign Meaning
PTA0KBI0P0 / FTM0CH0 / FDSOUT6 / ACMP0IN0 / ADP0Multi-function GPIO supporting keyboard interrupt, timer channel 0, fault output, comparator input, and ADC channel 0
PTA1KBI0P1 / FTM0CH1 / FDSOUT7 / ACMP0IN1 / ADP1Multi-function GPIO supporting keyboard interrupt, timer channel 1, fault output, comparator input, and ADC channel 1
PTA2KBI0P2 / RxD0 / SDA / PWT / ADP2Multi-function GPIO supporting keyboard interrupt, SCI receive, I²C data, pulse width capture, and ADC channel 2
PTA3KBI0P3 / TxD0 / SCL / ACMP1IN0 / OPAMP+ / ADP3Multi-function GPIO supporting keyboard interrupt, SCI transmit, I²C clock, comparator input, opamp non-inverting input, and ADC channel 3
PTA4FTM0CH1O / ACMP0O / BKGD / MSOutput-only pin used for timer output, comparator output, or single-wire background debug interface
PTA5IRQ / FTM0CH0 / TCLK0 / RESET_bInterrupt request input, timer clock input, or active-low reset with glitch filtering
PTB0KBI0P4 / RxD0 / ADP4True open-drain pin usable as keyboard interrupt input, SCI receive, or ADC channel 4
PTB1KBI0P5 / TxD0 / ACMP1IN1 / ADP5Multi-function GPIO supporting keyboard interrupt, SCI transmit, comparator input, and ADC channel 5
PTB2KBI0P6 / SDA / FDSIN / ADP6Multi-function GPIO supporting keyboard interrupt, I²C data, fault detection input, and ADC channel 6
PTB3KBI0P7 / SCL / TCLK2 / ADP7Multi-function GPIO supporting keyboard interrupt, I²C clock, timer clock input, and ADC channel 7
VDDPower SupplyMain digital/analog supply (2.7–5.5 V); decoupling required per layout guidelines
VSSGroundDigital ground reference; separate analog ground not provided - shared VSS
XTALCrystal Oscillator InputConnects to crystal/resonator (4–20 MHz or 31.25–39.0625 kHz) for external clock source
EXTALCrystal Oscillator OutputDrives crystal/resonator; requires external load capacitors per crystal spec
RESET_bActive-Low ResetAsynchronous reset input with internal pull-up; accepts external pushbutton or supervisor IC

Key Features

FeatureDesign Value
Internal Clock Source (ICS)FLL-based oscillator with ±0.2% trimming resolution and ±1.5% deviation over –40 °C to 105 °C enables stable timing without external crystal in cost-sensitive designs
Fault Detection Shutdown (FDS)Configurable fault inputs (FDSIN, FDSOUTx) allow immediate output pin state override (0/1/high-Z) upon detected overcurrent, overtemperature, or logic fault - critical for motor driver safety
Single-Wire Background Debug (BKGD)On-chip ICE debug module with three breakpoints and nine trigger modes enables in-circuit debugging without dedicated JTAG pins, reducing PCB footprint
Low-Power Stop3 ModeSub-µA current draw (1.2–1.3 µA) with 1 kHz LPO clock active supports battery-powered wake-on-event applications like smart sensors
Flash & RAM ProtectionHardware-enforced memory access control prevents unauthorized read/write/erase of firmware or sensitive data in field-deployed devices
Integrated Analog SubsystemCombines 12-bit ADC, dual ACMPs with DAC reference, and fixed-gain opamp (×20) to replace discrete signal conditioning components in closed-loop control systems

Applications

Industrial Motor ControlSmart Sensor Node

Use Scenario: Low-voltage BLDC motor commutation in HVAC blowers or pump drivers where space and BOM count are constrained.

IC Role / Device Role / Timing Role: Real-time PWM generation via FTM2 (6-channel), ADC sampling of phase currents and temperature, and FDS-driven fault shutdown on overcurrent events.

Use Value: Integrated FDS and 20 MHz deterministic timing eliminate need for external fault logic and reduce system latency below 1 µs.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and CO₂ using analog front-end and wireless transmission.

IC Role / Device Role / Timing Role: ADC acquisition with hardware-triggered sampling, RTC-based wakeup scheduling, and SCI/I²C interfacing to sensors and transceivers.

Use Value: Stop3 mode current of 1.2 µA at 3 V extends 10-year battery life; integrated opamp conditions thermistor signals without external amplifiers.

Automotive Body ElectronicsHome Appliance Control

Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN communication to body controller.

IC Role / Device Role / Timing Role: LIN-capable SCI interface, KBI for switch scanning, FTM for PWM dimming, and LVD monitoring for brown-out protection.

Use Value: –40 °C to 125 °C extended temperature rating and AEC-Q100 qualification enable direct placement in cabin environments without derating.

Use Scenario: Washing machine main control unit managing motor drive, water valve actuation, and user interface.

IC Role / Device Role / Timing Role: MTIM for buzzer tone generation, FTM for triac firing control, ACMP for zero-crossing detection, and CRC for firmware integrity checking.

Use Value: On-chip CRC generator and illegal opcode detection prevent corrupted code execution during EMI-heavy washing cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9KEAZ128AMLHARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, higher performance but larger footprint and higher power in run modeRequires ARM toolchain and lacks native S08 code compatibility; better suited for new designs needing >20 MIPSSelect when migrating from legacy S08 code is not required and higher computational throughput justifies increased BOM cost and layout area
MC9S08AC128CFGESame S08 core, 128 KB flash, 8 KB RAM, 48-pin LQFP package, additional CAN interface and more ADC channelsNot pin-compatible; requires PCB redesign but offers CAN bus support for distributed vehicle networksChoose when CAN communication is mandatory and board space allows larger package; retains S08 software ecosystem

Compared with S9KEAZ128AMLH and MC9S08AC128CFGE, the MC9S08PB16MTG provides optimal balance of compact 16-pin TSSOP packaging, sub-µA stop-mode power, and integrated analog peripherals - making it ideal for cost-sensitive, space-constrained embedded controls where S08 code reuse and minimal external components are priorities.

Availability

MC9S08PB16MTG is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, automotive body electronics, and home appliance control requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MC9S08PB16MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers, RF, and analog technologies.

The MC9S08PB16MTG belongs to NXP's legacy S08 MCU family, designed specifically for cost-optimized, mixed-signal embedded control in harsh environments - emphasizing low-power operation, robust peripheral integration, and long-term supply assurance.

FAQ

What is the maximum operating temperature range for the MC9S08PB16MTG?

The MC9S08PB16MTG is rated for operation from –40 °C to +125 °C, as indicated by the 'M' temperature grade in its part number suffix. This extended range is validated per JEDEC JESD22-A104 and supports deployment in under-hood automotive and industrial environments where ambient temperatures exceed standard commercial limits. The junction temperature limit remains at 135 °C, requiring appropriate thermal design using the specified RθJA = 130 °C/W for the 16-pin TSSOP package.

Does the MC9S08PB16MTG support in-circuit debugging without dedicated JTAG pins?

Yes, the MC9S08PB16MTG supports single-wire background debug (BKGD) via the PTA4 pin, eliminating the need for a full JTAG interface. Its on-chip ICE debug module provides three hardware breakpoints, nine trigger modes, and full register visibility during runtime. This capability is fully supported by NXP's S08 CodeWarrior IDE and compatible third-party tools, enabling efficient development on space-constrained PCBs where pin count is critical.

Can the MC9S08PB16MTG operate from an internal clock only, without an external crystal?

Yes, the MC9S08PB16MTG can operate entirely from its Internal Clock Source (ICS), which uses a frequency-locked loop (FLL) with a factory-trimmed internal reference. It achieves ±0.2% resolution and ±1.5% deviation over –40 °C to 105 °C, enabling reliable 20 MHz bus operation without external crystals - reducing BOM cost and board area. External oscillators (XOSC) remain optional for applications demanding tighter timing accuracy or specific frequency synthesis.

How many ADC channels does the MC9S08PB16MTG support, and what is their resolution?

The MC9S08PB16MTG supports 12 independent ADC input channels with 12-bit resolution and a typical conversion time of 2.5 µs. It includes an eight-level data FIFO with watermark interrupt, automatic compare function, and optional hardware triggering from FTM or PWT modules. The ADC operates in stop mode and integrates an internal bandgap reference and 1.7 mV/°C temperature sensor, enabling self-calibration and thermal monitoring without external components.

Is the MC9S08PB16MTG pin-compatible with other members of the S08PB family?

No, the MC9S08PB16MTG is not pin-compatible with other S08PB variants such as the MC9S08PB16VTG (20-pin TSSOP) or MC9S08PB8MTG (8 KB flash, same 16-pin package). While the 16-pin TSSOP footprint is shared with the PB8 variant, differences in peripheral mapping - particularly FDS outputs, FTM channel assignments, and KBI pin distribution - require firmware and layout verification. Always consult the device-specific pin assignment table (Section 9.2 of Rev. 2.1 datasheet) before substitution.

MC9S08PB16MTG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
14
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08PB16MTG FAQ

1.How can I place an order for MC9S08PB16MTG through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08PB16MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08PB16MTG reliable?

The price and inventory of MC9S08PB16MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PB16MTG is usually 5 days.

3.What payment methods are accepted for MC9S08PB16MTG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08PB16MTG transactions.

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4.How is shipping managed for MC9S08PB16MTG?

MC9S08PB16MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08PB16MTG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08PB16MTG?

For technical support, including MC9S08PB16MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PB16MTG requirements.

6.How does Aetrix verify that MC9S08PB16MTG is sourced from the original manufacturer or authorized distributors?

All MC9S08PB16MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PB16MTG meets industry standards.

7.What is the process for return or replacement of MC9S08PB16MTG?

All MC9S08PB16MTG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PB16MTG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08PB16MTG part is unused and in its original packaging.

Return procedure for MC9S08PB16MTG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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