NXP Semiconductors MC9S08PB16MTJ

Overview

MC9S08PB16MTJ from NXP Semiconductors is an 8-bit S08 core microcontroller with 16 KB flash, 1 KB RAM, and integrated peripherals including 12-channel 12-bit ADC, dual analog comparators, one operational amplifier, two FTM modules (6+2 channels), SCI/I²C/UART/LIN interface, RTC, CRC, and fault detection shutdown (FDS). It operates up to 20 MHz across 2.7–5.5 V and –40 °C to +125 °C, targeting industrial motor control and embedded metering applications.

For engineers reviewing the MC9S08PB16MTJ datasheet, MC9S08PB16MTJ pinout, MC9S08PB16MTJ application, or MC9S08PB16MTJ equivalent, key selection considerations include its 20-pin TSSOP package, -40 °C to +125 °C extended temperature rating, on-chip ICS with FLL and ±2% frequency deviation over full range, true open-drain PTB0 pin, and single-wire background debug interface for in-circuit development.

Technical Context

The MC9S08PB16MTJ implements an enhanced HCS08 CPU core with four-level nested interrupt support and up to 30 interrupt/reset sources. Its internal clock source (ICS) integrates a frequency-locked loop (FLL) with factory-trimmed internal reference (0.2% resolution), delivering up to 20 MHz bus frequency with ±2% deviation across –40 °C to +125 °C.

System-level interconnect enables hardware-triggered peripheral coordination-e.g., ADC hardware trigger from FTM overflow or SCI RxD edge detection-reducing software overhead in time-critical tasks like infrared communication, baud rate detection, and low-end motor control. The FDS module supports configurable fault response on eight output pins, including high-impedance, logic 0, or logic 1 states upon fault detection.

Key Specifications

Pinout & Package

MC9S08PB16MTJ is housed in a 20-pin TSSOP package (JEDEC MO-153AC) with 0.65 mm pitch, 6.5 mm × 4.4 mm body size, and exposed pad not electrically connected. Pin functions are multiplexed across GPIO, peripheral signals, and debug interface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with S9KEAZ128AMLH and MC9S08AC128CPBE, the MC9S08PB16MTJ delivers optimal balance of analog integration (OPAMP, ACMP, FDS), compact 20-pin TSSOP packaging, and extended temperature support for cost-sensitive industrial control-without requiring ARM toolchain adoption or external signal conditioning components.

Availability

MC9S08PB16MTJ is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, automotive body electronics, and industrial sensor node applications requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MC9S08PB16MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08PB16MTJ belongs to NXP's legacy S08 microcontroller family, designed specifically for cost-optimized, low-power embedded control in harsh environments-emphasizing analog integration, robust clock systems, and hardware-assisted safety features like FDS and LVD.

FAQ

What is the maximum operating temperature range supported by the MC9S08PB16MTJ?

The MC9S08PB16MTJ supports an operating temperature range of –40 °C to +125 °C, as indicated by the 'M' suffix in its part number. This extended range is validated per JEDEC JESD22-A103 and enables reliable deployment in under-hood automotive and industrial control environments where ambient temperatures exceed standard commercial limits. The junction temperature limit is –40 °C to +135 °C, with thermal resistance R_θJA = 116 °C/W on a single-layer PCB.

Does the MC9S08PB16MTJ support in-circuit debugging, and what interface is used?

Yes, the MC9S08PB16MTJ supports in-circuit debugging via a single-wire background debug (BKGD) interface using the PTA4 pin. This interface enables full read/write memory access, three breakpoint settings, and on-chip in-circuit emulator (ICE) functionality with two comparators and nine trigger modes-eliminating the need for external debug probes during development and production programming.

What analog peripherals are integrated into the MC9S08PB16MTJ?

The MC9S08PB16MTJ integrates a 12-channel 12-bit ADC with 2.5 µs conversion time and eight-level FIFO, two analog comparators (ACMP0/ACMP1) with selectable 6-bit DAC reference, one operational amplifier (OPAMP) with fixed x20 gain and 100 mV single-ended input range, and an on-chip 1.7 mV/°C temperature sensor. All analog blocks operate in Stop3 mode, enabling low-power sensor monitoring.

How does the Fault Detection Shutdown (FDS) module function on the MC9S08PB16MTJ?

The FDS module on the MC9S08PB16MTJ monitors up to eight configurable fault inputs and drives corresponding FDSOUT pins (e.g., FDSOUT0–FDSOUT7) into user-defined states-logic 0, logic 1, or high-impedance-upon fault detection. Fault sources (e.g., overtemperature, overcurrent) can be enabled individually, and the response is hardware-automated without CPU intervention, ensuring sub-microsecond shutdown critical for motor driver protection.

What clock sources are available for the MC9S08PB16MTJ, and how accurate is the internal oscillator?

The MC9S08PB16MTJ offers two primary clock sources: the Internal Clock Source (ICS) with FLL (±2% deviation across –40 °C to +125 °C) and an external Pierce oscillator (XOSC) supporting crystals/resonators from 31.25 kHz to 20 MHz. The ICS uses factory-trimmed internal reference (0.2% resolution) and supports bus frequencies up to 20 MHz, while XOSC provides higher stability for timing-critical communications like LIN or UART.