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NXP Semiconductors MC9S08PB16VTJ

Part No.:
MC9S08PB16VTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08PB16VTJ.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,545

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Product details

Overview

MC9S08PB16VTJ from NXP Semiconductors is an 8-bit S08 microcontroller with 16 KB flash, 1 KB RAM, and integrated peripherals including dual FTM modules (6-channel + 2-channel), 12-bit 12-channel ADC, I²C, SCI/UART with LIN support, two analog comparators, one operational amplifier (gain ×20), RTC, CRC, and fault detection shutdown (FDS). It operates up to 20 MHz across –40 °C to 105 °C at 2.7–5.5 V, targeting embedded control in industrial sensors and motor drives.

For engineers reviewing the MC9S08PB16VTJ datasheet, MC9S08PB16VTJ pinout, MC9S08PB16VTJ application, or MC9S08PB16VTJ equivalent, key selection criteria include its TSSOP-20 package, single-wire background debug interface, stop3 mode current of 1.3 µA, internal clock source with ±1% deviation over –40 °C to 105 °C, and true open-drain PTB0 pin for level-shifting interfaces.

Technical Context

The MC9S08PB16VTJ implements an enhanced HCS08 CPU core with four-level nested interrupt support and up to 30 interrupt/reset sources. Its internal clock source (ICS) integrates a frequency-locked loop (FLL) with factory-trimmed internal reference (0.2% resolution), enabling stable 20 MHz operation without external crystal when configured in FEI mode.

Peripherals are tightly coupled via hardware triggers: ADC supports hardware-triggered conversions from FTM, SCI, or RTC; FDS module can force PTB0 and other outputs into high-impedance on fault detection; and system interconnection logic enables autonomous event chaining (e.g., SCI RxD edge triggering FTM capture) with minimal software overhead.

Key Specifications

Parameter Value and Actual Design Meaning
Core 8-bit S08 CPU, up to 20 MHz bus frequency at 2.7–5.5 V
Memory 16 KB flash (read/program/erase over full voltage/temp range), 1 KB RAM
ADC 12-bit, 12-channel, 2.5 µs conversion time, 8-level FIFO, temperature sensor (1.7 mV/°C)
Clock Sources Internal ICS (FLL-based, ±1% deviation from –40 °C to 105 °C), external XOSC (4–20 MHz crystal/ceramic)
Power Modes Stop3 mode draws 1.3 µA (5 V), with optional RTC, ADC, and LVD active; peripheral clocks individually gated via PMC
I/O & Protection 18 GPIOs (including true open-drain PTB0), watchdog with independent clock, low-voltage detect (selectable thresholds), illegal opcode/address reset
Debug Single-wire background debug (BKGD), three hardware breakpoints, on-chip ICE with nine trigger modes

Pinout & Package

MC9S08PB16VTJ is housed in a 20-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm pitch, thermal resistance RθJA = 116 °C/W (single-layer board) and 76 °C/W (four-layer board).

Pin Circuit Role Design Meaning
PTA0 KBI0P0 / FTM0CH0 / FDSOUT6 / ACMP0IN0 / ADP0 Multi-function pin supporting keyboard interrupt, timer channel 0, fault output, comparator input, and ADC channel 0
PTA1 KBI0P1 / FTM0CH1 / FDSOUT7 / ACMP0IN1 / ADP1 Shared functions for KBI, FTM0 channel 1, fault output, comparator input, and ADC channel 1
PTA2 KBI0P2 / RxD0 / SDA / PWT / ADP2 SCI receive, I²C data, pulse width timer input, and ADC channel 2
PTA3 KBI0P3 / TxD0 / SCL / ACMP1IN0 / OPAMP+ / ADP3 SCI transmit, I²C clock, comparator input, opamp non-inverting input, and ADC channel 3
PTA4 FTM0CH1O / ACMP0O / BKGD / MS Output-only pin used for FTM0 channel 1 output, comparator output, or debug interface
PTA5 IRQ / FTM0CH0 / TCLK0 / RESET_b Interrupt request input, FTM0 channel 0, timer clock input, or active-low reset
PTB0 KBI0P4 / RxD0 / ADP4 True open-drain pin usable for level-shifted SCI receive or general-purpose open-drain signaling
PTB1 KBI0P5 / TxD0 / ACMP1IN1 / ADP5 SCI transmit, comparator input, and ADC channel 5
PTB2 KBI0P6 / SDA / FDSIN / ADP6 I²C data line and fault detection input for FDS module
PTB3 KBI0P7 / SCL / TCLK2 / ADP7 I²C clock, timer clock input for FTM2, and ADC channel 7
PTB4 FTM2CH4 / FDSOUT4 FTM2 channel 4 output and fault output 4
PTB5 FTM2CH5 / FDSOUT5 FTM2 channel 5 output and fault output 5
PTB6 SDA / XTAL Shared I²C data and crystal oscillator input
PTB7 SCL / EXTAL Shared I²C clock and crystal oscillator output
PTC0–PTC3 FTM2CH0–FTM2CH3 / FDSOUT0–FDSOUT3 / ADP8–ADP11 Four FTM2 channels, four fault outputs, and four ADC inputs
VDD, VSS Power supply and ground Dual power pins support noise isolation between digital and analog domains

Key Features

Feature Design Value
Integrated Fault Detection Shutdown (FDS) Configurable per-pin fault response (high-Z, 0, or 1) triggered by external signals or internal events like comparator output
Hardware-Accelerated Peripheral Interconnect Direct module-to-module triggering (e.g., SCI RxD edge → FTM capture) eliminates CPU polling and reduces latency
Low-Power Stop3 Mode 1.3 µA typical supply current with 1 kHz LPO clock active, enabling RTC, ADC wake-up, and LVD monitoring
Factory-Trimmed Internal Clock Source ±1% frequency accuracy over –40 °C to 105 °C without external crystal, reducing BOM cost and PCB area
On-Chip Analog Signal Chain 12-bit ADC with internal bandgap reference, two ACMPs with 6-bit DAC reference, and fixed-gain ×20 OPAMP for sensor signal conditioning

Applications

Industrial Motor Control Smart Sensor Node

Use Scenario: Low-cost BLDC motor commutation and current sensing in HVAC blowers and pump controllers.

IC Role / Device Role / Timing Role: MCU executing FOC algorithms using ADC-sampled phase currents, generating PWM via FTM modules, and monitoring overcurrent via ACMP-triggered FDS shutdown.

Use Value: Integrated FDS ensures <1 µs fault response to protect MOSFETs; 20 MHz bus enables real-time current loop execution at 20 kHz switching frequency.

Use Scenario: Battery-powered environmental sensor aggregating temperature, humidity, and CO₂ readings for wireless transmission.

IC Role / Device Role / Timing Role: System controller managing ADC sampling, I²C sensor reads, SCI UART communication, and ultra-low-power sleep cycles via Stop3 mode.

Use Value: 1.3 µA Stop3 current extends 10-year battery life; on-chip OPAMP conditions thermistor signals before ADC digitization.

Automotive Body Electronics Home Appliance Control

Use Scenario: LIN-compliant door module controlling window lift, mirror adjustment, and interior lighting.

IC Role / Device Role / Timing Role: LIN slave node using SCI with LIN extension support, decoding commands, driving relays via GPIO, and monitoring switch inputs via KBI.

Use Value: Single-wire debug simplifies in-vehicle diagnostics; watchdog with independent clock ensures fail-safe behavior during LIN bus faults.

Use Scenario: Washing machine main control unit managing motor drive, water valve actuation, and user interface.

IC Role / Device Role / Timing Role: Real-time controller coordinating FTM-generated motor PWM, ADC-monitored current/torque, RTC-based cycle timing, and CRC-verified firmware updates.

Use Value: Hardware CRC engine validates flash writes during field updates; RTC with 16-bit counter provides accurate wash cycle duration tracking.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08AC128CPB 128 KB flash, 8 KB RAM, same S08 core but larger memory and additional peripherals (e.g., CAN); 44-pin LQFP only Targeted at more complex automotive body control requiring CAN connectivity and larger code footprint Select MC9S08AC128CPB only if CAN interface and >16 KB flash are required; not pin-compatible with MC9S08PB16VTJ
S9KEAZ128AMLH Kinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, higher performance (40 MHz), different architecture and toolchain Suitable for applications needing upgrade path to 32-bit processing, USB, or advanced analog features beyond S08 capability Choose S9KEAZ128AMLH for new designs requiring scalability beyond 8-bit; migration requires full firmware rewrite and PCB layout change

Compared with MC9S08AC128CPB and S9KEAZ128AMLH, the MC9S08PB16VTJ delivers optimal cost-performance balance for resource-constrained 8-bit control tasks where pin count, ultra-low stop-mode current, and proven S08 toolchain compatibility are prioritized over memory expansion or 32-bit throughput.

Availability

MC9S08PB16VTJ is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, automotive body electronics, and home appliance control requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08PB16VTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and mixed-signal integration.

The MC9S08PB16VTJ belongs to the S08PB family designed specifically for cost-sensitive, low-power embedded control in harsh environments-emphasizing robustness, integrated analog peripherals, and simplified clocking without external crystals.

FAQ

What is the maximum operating frequency and voltage range for the MC9S08PB16VTJ?

The MC9S08PB16VTJ operates at up to 20 MHz bus frequency across a supply voltage range of 2.7 V to 5.5 V, fully specified over the industrial temperature range of –40 °C to 105 °C. Its internal clock source (ICS) maintains ±1% accuracy across this temperature range without requiring an external crystal, enabling reliable high-speed operation in variable environmental conditions.

Does the MC9S08PB16VTJ support hardware debugging, and what interface is used?

Yes, the MC9S08PB16VTJ supports in-circuit debugging via a single-wire background debug (BKGD) interface. This interface enables full visibility into CPU registers, memory, and peripheral states, supports up to three hardware breakpoints, and integrates an on-chip ICE module with nine trigger modes for precise event capture during development and validation of the MC9S08PB16VTJ.

How does the Fault Detection Shutdown (FDS) module function on the MC9S08PB16VTJ?

The FDS module on the MC9S08PB16VTJ monitors configurable fault inputs (e.g., ACMP outputs or external signals) and forces designated output pins-including PTB0, PTA0–PTA3, and PTC0–PTC3-into high-impedance, logic 0, or logic 1 states based on register configuration. This hardware-enforced response occurs independently of CPU execution, ensuring sub-microsecond shutdown critical for motor driver protection in the MC9S08PB16VTJ.

What analog peripherals are integrated into the MC9S08PB16VTJ?

The MC9S08PB16VTJ integrates a 12-bit 12-channel ADC with 2.5 µs conversion time and 8-level FIFO, two analog comparators (ACMP0/ACMP1) with selectable 6-bit DAC reference, one operational amplifier (OPAMP) with fixed ×20 gain and 100 mV single-ended input range, and an on-chip temperature sensor (1.7 mV/°C). These enable complete analog front-end functionality without external signal conditioning components in the MC9S08PB16VTJ.

Is the MC9S08PB16VTJ compatible with LIN communication protocols?

Yes, the MC9S08PB16VTJ's SCI module includes explicit LIN extension support, enabling it to operate as a LIN slave node with automatic sync-break detection, checksum handling, and timing compliance per LIN 2.x specifications. This capability is confirmed in the official MC9S08PB16 data sheet and allows direct integration into automotive body control networks using the MC9S08PB16VTJ.

MC9S08PB16VTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
18
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08PB16VTJ FAQ

1.How can I place an order for MC9S08PB16VTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08PB16VTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08PB16VTJ reliable?

The price and inventory of MC9S08PB16VTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PB16VTJ is usually 5 days.

3.What payment methods are accepted for MC9S08PB16VTJ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08PB16VTJ transactions.

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4.How is shipping managed for MC9S08PB16VTJ?

MC9S08PB16VTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08PB16VTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08PB16VTJ?

For technical support, including MC9S08PB16VTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PB16VTJ requirements.

6.How does Aetrix verify that MC9S08PB16VTJ is sourced from the original manufacturer or authorized distributors?

All MC9S08PB16VTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PB16VTJ meets industry standards.

7.What is the process for return or replacement of MC9S08PB16VTJ?

All MC9S08PB16VTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PB16VTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08PB16VTJ part is unused and in its original packaging.

Return procedure for MC9S08PB16VTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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