NXP Semiconductors MC9S08PB8MTG
- Part No.:
- MC9S08PB8MTG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08PB8MTG.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08PB8MTG from NXP Semiconductors is an 8-bit S08 microcontroller with 8 KB flash, 1 KB RAM, and integrated peripherals including 8-channel 12-bit ADC, two analog comparators, one operational amplifier, dual flex timer modules (FTM0 and FTM2), SCI/I2C/UART interfaces, real-time clock (RTC), and pulse width timer (PWT). It operates up to 20 MHz across 2.7–5.5 V and –40 °C to 125 °C, targeting embedded control in automotive body electronics and industrial sensor nodes.
For engineers reviewing the MC9S08PB8MTG datasheet, MC9S08PB8MTG pinout, MC9S08PB8MTG application, or MC9S08PB8MTG equivalent, this page delivers verified technical context, package mapping to 16-pin TSSOP, validated pin functions, key electrical specs including LVD thresholds and supply current in Stop3 mode, and two confirmed alternative parts for design continuity.
Technical Context
The MC9S08PB8MTG implements an S08 CPU core with nested interrupt support (up to four levels) and 30 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference achieving ±0.2% resolution and ±1.5% deviation over –40 °C to 105 °C.
Peripherals include a 12-bit ADC with 8-channel input, eight-level FIFO, and temperature sensor (1.7 mV/°C); two FTM modules (FTM0: 2-channel, FTM2: 6-channel) supporting PWM, input capture, and output compare; and fault detection shutdown (FDS) with configurable output behavior on PTB0–PTB3 and PTC0–PTC3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU with up to 20 MHz bus frequency at 2.7–5.5 V |
| Memory | 8 KB flash (read/program/erase over full voltage/temperature range) and 1 KB RAM |
| ADC | 8-channel, 12-bit resolution, 2.5 µs conversion time, FIFO with watermark, operation in Stop3 mode |
| Timers | Two 8-bit modulo timers (MTIM0/MTIM1), one 16-bit pulse width timer (PWT), FTM0 (2-ch) and FTM2 (6-ch) |
| Clock Sources | Internal Clock Source (ICS) with FLL; external crystal/ceramic oscillator (XOSC) supporting 31.25 kHz–20 MHz |
| Supply Current | 1.2 µA typical in Stop3 mode (no clocks active except 1 kHz LPO); 85 µA with ADC enabled in Stop3 |
| Operating Range | –40 °C to 125 °C ambient temperature; 2.7–5.5 V supply voltage |
Pinout & Package
MC9S08PB8MTG is housed in a 16-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm pitch, thermal resistance RθJA = 130 °C/W (single-layer board) and 87 °C/W (four-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0/KBI0P0/FTM0CH0/FDSOUT6/ACMP0IN0/ADP0 | Multi-function I/O | Configurable as keyboard interrupt input, FTM0 channel 0, fault output, comparator input, or ADC channel 0 |
| PTA1/KBI0P1/FTM0CH1/FDSOUT7/ACMP0IN1/ADP1 | Multi-function I/O | Supports FTM0 channel 1, fault output, comparator input, or ADC channel 1 |
| PTA2/KBI0P2/RxD0/SDA/PWT/ADP2 | Multi-function I/O | SCI receive, I2C data, pulse width capture, or ADC channel 2 |
| PTA3/KBI0P3/TxD0/SCL/ACMP1IN0/OPAMP+/ADP3 | Multi-function I/O | SCI transmit, I2C clock, comparator input, opamp non-inverting input, or ADC channel 3 |
| PTB0/KBI0P4/RxD0/ADP4 | True open-drain I/O | SCI receive or ADC channel 4; operates as true open drain when configured as output |
| PTB1/KBI0P5/TxD0/ACMP1IN1/ADP5 | Multi-function I/O | SCI transmit, comparator input, or ADC channel 5 |
| PTB2/KBI0P6/SDA/FDSIN/ADP6 | Multi-function I/O | I2C data, fault input, or ADC channel 6 |
| PTB3/KBI0P7/SCL/TCLK2/ADP7 | Multi-function I/O | I2C clock, timer clock input, or ADC channel 7 |
| VDD | Power supply | Primary digital/analog supply (2.7–5.5 V); decoupling required per layout guidelines |
| VSS | Ground | Digital and analog ground reference; separate routing recommended for noise-sensitive analog paths |
| EXTAL/XTAL | Oscillator inputs | External crystal/ceramic resonator connection points for XOSC module (4 MHz–20 MHz or 31.25 kHz–39.0625 kHz) |
| BKGD/MS | Debug interface | Single-wire background debug pin; used for programming, debugging, and forced reset entry |
| RESET_b | Reset input | Active-low asynchronous reset; supports external pull-up and watchdog/LVD assertion |
| IRQ | Interrupt request | Edge-triggered external interrupt input; synchronized in run mode, asynchronous in stop |
| PTA4/FTM0CH1O/ACMP0O/BKGD/MS | Output-only pin | FTM0 channel 1 output, comparator 0 output, or debug signal; not usable as general-purpose input |
Key Features
| Feature | Design Value |
|---|---|
| Flash protection | On-chip flash and RAM access protection prevents unauthorized read/write during debug or runtime |
| Low-power modes | Stop3 mode draws only 1.2 µA (typical); peripheral clocks can be selectively disabled via PMC register |
| System safety | Independent watchdog clock, low-voltage detection with programmable trip points (e.g., VLVDH = 4.2–4.4 V), illegal opcode/address reset |
| Analog integration | On-chip 1.16 V bandgap reference, 6-bit DAC for comparator reference, and 1.7 mV/°C temperature sensor enable self-calibration |
| Debug capability | Single-wire BDM interface with three hardware breakpoints and on-chip ICE module supporting nine trigger modes |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN/LIN gateway logic, ADC-based switch monitoring, and PWM-driven motor control via FTM modules. Use Value: Integrated FDS and LVD ensure fail-safe shutdown during power faults; 125 °C rating supports under-hood placement without derating. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and vibration in factory equipment. IC Role / Device Role / Timing Role: Low-power sensor aggregator using Stop3 mode between readings, ADC for analog sensors, RTC for timestamping, and SCI for UART telemetry. Use Value: 1.2 µA Stop3 current extends battery life; on-chip temperature sensor and bandgap reference eliminate external calibration components. |
| Smart Appliance Motor Controller | Medical Diagnostic Handheld |
Use Scenario: Closed-loop speed and position control of BLDC motors in washing machines and HVAC blowers. IC Role / Device Role / Timing Role: Real-time PWM generation (FTM2 6-channel center-aligned mode), ADC feedback sampling, and fault detection (FDS) for overcurrent/overtemperature events. Use Value: FDS outputs directly drive external gate drivers; configurable fault response (high-Z, 0, or 1) enables safe motor coasting or braking. | Use Scenario: Portable blood glucose meter requiring precise analog measurement and secure firmware updates. IC Role / Device Role / Timing Role: ADC acquisition of electrochemical sensor signals, OPAMP x20 gain stage, ACMP for threshold detection, and BDM-enabled field firmware upgrade. Use Value: 12-bit ADC with FIFO and automatic compare reduces CPU load; flash protection prevents tampering with calibration constants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08PB16MTG | 16 KB flash (vs. 8 KB), identical pinout, same 16-pin TSSOP package and peripheral set | Supports larger firmware images and more complex state machines without layout change | Select when future firmware growth or additional feature integration is anticipated |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, different architecture and instruction set | Requires full software porting; offers higher performance and enhanced peripheral flexibility (e.g., more UARTs, DMA) | Choose for new designs needing scalable performance or ARM ecosystem compatibility |
Compared with MC9S08PB8MTG, MC9S08PB16MTG provides direct flash capacity headroom within identical hardware constraints, while S9KEAZ128AMLH represents a next-generation architectural upgrade requiring firmware rework but delivering significantly higher compute throughput and memory scalability.
Availability
MC9S08PB8MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance motor controllers, and medical diagnostic handhelds requiring stable component supply across extended temperature ranges.
Supply support for MC9S08PB8MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S08PB series targets cost-sensitive, high-reliability embedded control applications with integrated analog peripherals, robust system protection, and extended temperature operation - designed specifically for automotive body electronics and industrial automation.
FAQ
What is the maximum operating frequency and voltage range for the MC9S08PB8MTG?
The MC9S08PB8MTG operates at up to 20 MHz bus frequency across a supply voltage range of 2.7 V to 5.5 V, with full specification compliance over the –40 °C to 125 °C ambient temperature range. This ensures reliable timing performance in automotive and industrial environments where voltage transients and thermal extremes are common. The internal clock source (ICS) maintains stability via its frequency-locked loop (FLL) and factory-trimmed reference.
How many ADC channels does the MC9S08PB8MTG support, and what is its resolution?
The MC9S08PB8MTG supports 8-channel, 12-bit analog-to-digital conversion with 2.5 µs conversion time, eight-level FIFO, automatic compare function, and optional hardware triggering. It includes an internal bandgap reference channel and a 1.7 mV/°C temperature sensor, and retains ADC functionality even in Stop3 low-power mode - enabling precise sensor monitoring without waking the CPU.
Does the MC9S08PB8MTG include built-in system protection features?
Yes, the MC9S08PB8MTG integrates multiple system protection mechanisms: a watchdog timer with independent clock source, low-voltage detection (LVD) with selectable reset or interrupt trip points (e.g., VLVDH = 4.2–4.4 V), illegal opcode detection, and illegal address detection - all triggering hardware reset to prevent erratic operation during power faults or code corruption.
What debug interface does the MC9S08PB8MTG use, and what capabilities does it offer?
The MC9S08PB8MTG uses a single-wire background debug (BDM) interface via the BKGD/MS pin. It supports three hardware breakpoints, on-chip in-circuit emulator (ICE) with two comparators and nine trigger modes, and full flash programming/debugging without requiring dedicated JTAG pins - simplifying PCB layout and reducing system cost while maintaining robust development visibility.
What package type and pin count does the MC9S08PB8MTG use?
The MC9S08PB8MTG is packaged in a 16-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm lead pitch. This compact footprint supports high-density PCB layouts and provides thermal resistance of 130 °C/W (single-layer board) and 87 °C/W (four-layer board), making it suitable for space-constrained and thermally demanding applications such as automotive modules and portable medical devices.
MC9S08PB8MTG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 14
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08PB8MTG FAQ
1.How can I place an order for MC9S08PB8MTG through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08PB8MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08PB8MTG reliable?
The price and inventory of MC9S08PB8MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PB8MTG is usually 5 days.
3.What payment methods are accepted for MC9S08PB8MTG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08PB8MTG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08PB8MTG?
MC9S08PB8MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08PB8MTG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08PB8MTG?
For technical support, including MC9S08PB8MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PB8MTG requirements.
6.How does Aetrix verify that MC9S08PB8MTG is sourced from the original manufacturer or authorized distributors?
All MC9S08PB8MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PB8MTG meets industry standards.
7.What is the process for return or replacement of MC9S08PB8MTG?
All MC9S08PB8MTG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PB8MTG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08PB8MTG part is unused and in its original packaging.
Return procedure for MC9S08PB8MTG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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