NXP Semiconductors MC9S08PB8MTGR

Overview

MC9S08PB8MTGR from NXP Semiconductors is an 8-bit S08 microcontroller with 8 KB flash, 1 KB RAM, and integrated peripherals including a 12-channel 12-bit ADC, two analog comparators, one operational amplifier, dual flex timer modules (FTM0 and FTM2), SCI/I2C/UART interfaces, real-time clock (RTC), and fault detection shutdown (FDS). It operates up to 20 MHz across 2.7–5.5 V and –40 °C to 125 °C, targeting embedded control in automotive body electronics and industrial sensor nodes.

For engineers reviewing the MC9S08PB8MTGR datasheet, MC9S08PB8MTGR pinout, MC9S08PB8MTGR application, or MC9S08PB8MTGR equivalent, this page delivers verified technical context, package mapping to 16-pin TSSOP, validated pin functions, key electrical specs including LVD thresholds and supply current in Stop3 mode, and two confirmed alternative parts for functional migration paths.

Technical Context

The MC9S08PB8MTGR implements an S08 CPU core with nested interrupt support (up to four levels) and on-chip ICE debug module enabling single-wire background debugging. Its internal clock source (ICS) integrates a frequency-locked loop (FLL) with factory-trimmed internal reference achieving ±0.2% resolution and ±1.5% deviation over –40 °C to 105 °C.

Peripheral interconnect supports hardware-triggered operation: ADC conversions can be initiated by FTM overflow or SCI RxD events; RTC capture is synchronized to ACMP output; and FDS shutdown logic responds to configurable fault inputs (e.g., ACMP0/1 outputs) with programmable pin states (0, 1, or high-Z).

Key Specifications

Pinout & Package

MC9S08PB8MTGR is housed in a 16-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm pitch, thermal resistance R_θJA = 130 °C/W (single-layer board) and moisture sensitivity level (MSL) 3 per J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08PB8MTGR, S9S08PB8MTJR offers identical functionality in reel format for automated assembly, while MC9S08PA8AVTG sacrifices FDS, opamp, and RTC to reduce BOM count-making it viable only where those features are unnecessary and register compatibility is not required.

Availability

MC9S08PB8MTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, appliance motor control, and smart metering applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MC9S08PB8MTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in microcontrollers, RF, and analog technologies.

The MC9S08PB8MTGR belongs to NXP's S08 PB-series microcontrollers, designed specifically for cost-sensitive, functionally safe embedded control in harsh environments-emphasizing integrated analog peripherals, low-power operation, and robust system-level protection features.

FAQ

What is the maximum operating frequency and voltage range for the MC9S08PB8MTGR?

The MC9S08PB8MTGR operates at up to 20 MHz bus frequency across a supply voltage range of 2.7 V to 5.5 V, with guaranteed performance over its full operating temperature range of –40 °C to 125 °C. Its internal ICS clock source achieves ±1.5% accuracy over that temperature span, and the device supports both FEI (internal) and FBE (external crystal) clock modes for flexible system design.

Does the MC9S08PB8MTGR support hardware debugging, and what interface is used?

Yes, the MC9S08PB8MTGR supports in-circuit debugging via a single-wire background debug interface (BDM) using the BKGD/MS pin. It includes on-chip ICE debug logic with two comparators and nine trigger modes, enabling three breakpoint settings during live debugging. This eliminates the need for external debug probes in most development scenarios and ensures full visibility into CPU state, memory, and peripheral registers.

How does the Fault Detection Shutdown (FDS) feature work on the MC9S08PB8MTGR?

The MC9S08PB8MTGR's FDS module monitors up to four configurable fault inputs (e.g., ACMP outputs) and drives designated output pins (FDSOUT0–FDSOUT3) into a user-defined safe state-0, 1, or high-impedance-upon fault detection. Each fault source can be enabled independently, and the response behavior is fully programmable via FDS control registers, making it suitable for motor driver shutdown, overtemperature cutoff, or overcurrent protection in safety-critical subsystems.

What analog peripherals are integrated into the MC9S08PB8MTGR?

The MC9S08PB8MTGR integrates a 12-channel 12-bit ADC with 2.5 µs conversion time and FIFO, two analog comparators (ACMP0/ACMP1) with selectable 6-bit DAC references, one fixed-gain ×20 operational amplifier (OPAMP) with 100 mV input range, and an on-chip temperature sensor (1.7 mV/°C). All analog blocks operate in Stop3 mode, enabling ultra-low-power sensor wake-up and measurement without full MCU activation.

Is the MC9S08PB8MTGR pin-compatible with the MC9S08PB16 series?

No, the MC9S08PB8MTGR is not pin-compatible with MC9S08PB16 variants. While both share the same 16-pin TSSOP package option (TG suffix), the MC9S08PB8MTGR maps only 14 GPIOs (vs. 18 on PB16), omits FTM2 channels 4–5 and associated pins (PTB4/PTB5), and reassigns certain peripheral functions due to reduced pin count. Pin compatibility exists only within the same flash-size family (e.g., MC9S08PB8MTGR ↔ MC9S08PB8VTG).