My Inquiry
My Account
NXP Semiconductors MC9S08PB8MTJ
.jpg)
- Part No.:
- MC9S08PB8MTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08PB8MTJ.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:625
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08PB8MTJ from NXP Semiconductors is an 8-bit S08 microcontroller with 8 KB flash, 1 KB RAM, and integrated peripherals including a 12-channel 12-bit ADC, two analog comparators, one operational amplifier, dual flex timer modules (FTM0 and FTM2), SCI/I2C interfaces, RTC, CRC, and fault detection shutdown (FDS). It operates up to 20 MHz across 2.7–5.5 V and –40°C to +125°C, targeting industrial motor control, sensor interface, and embedded metering applications.
For engineers reviewing the MC9S08PB8MTJ datasheet, MC9S08PB8MTJ pinout, MC9S08PB8MTJ application, or MC9S08PB8MTJ equivalent, this page delivers verified technical context, exact package mapping (20-pin TSSOP), validated pin functions, real-world use cases, and two confirmed alternative parts - all derived from NXP's official MC9S08PB16/PB8 datasheet Rev. 2.1 (11/2019) and orderable part number tables.
Technical Context
The MC9S08PB8MTJ implements an S08 CPU core with nested interrupt support (up to four levels) and on-chip ICE debug module featuring three breakpoints and nine trigger modes. Its clock system integrates an internal frequency-locked-loop (ICS) with ±0.2% trimming resolution and ±1.5% deviation over –40°C to 105°C, plus an external crystal oscillator supporting 4–20 MHz or 31.25–39.0625 kHz ranges.
Peripheral interconnect enables hardware-triggered operation: ADC conversions can be initiated by FTM overflow or SCI RxD events; FTM channels support edge- or center-aligned PWM; and the FDS module disables output pins upon configurable fault detection (e.g., overcurrent or thermal event), with independent configuration per channel.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU with up to 20 MHz bus frequency at 2.7–5.5 V |
| Memory | 8 KB flash (read/program/erase over full voltage/temperature range) and 1 KB RAM |
| ADC | 12-channel, 12-bit resolution, 2.5 µs conversion time, FIFO with watermark, and temperature sensor (1.7 mV/°C) |
| Timers | Two 8-bit modulo timers (MTIM0/MTIM1); two FTM modules (FTM0: 2-channel, FTM2: 6-channel), each supporting input capture/output compare/PWM |
| Communication | One SCI (LIN-capable UART), one I²C (up to 400 kbps, multi-master, SMBus-compatible), and one PWT (pulse width/period capture) |
| Analog | Two ACMPs with selectable DAC reference; one OPAMP (fixed gain ×20, 100 mV single-ended input) |
| Package | 20-pin TSSOP (MTJ suffix), thermal resistance RθJA = 116°C/W (single-layer board) |
Pinout & Package
MC9S08PB8MTJ is housed in a 20-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm pitch, JEDEC MO-153 compliant, and moisture sensitivity level (MSL) 3. Pin assignments are validated per NXP's MC9S08PB16/PB8 datasheet Rev. 2.1 (11/2019), Table 2 and Figure 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0/KBI0P0/FTM0CH0/FDSOUT6/ACMP0IN0/ADP0 | Port A bit 0 / Keyboard interrupt / FTM0 channel 0 / Fault output / Comparator input / ADC input | Multi-function GPIO supporting hardware-triggered ADC sampling and fault-safe PWM output |
| PTA1/KBI0P1/FTM0CH1/FDSOUT7/ACMP0IN1/ADP1 | Port A bit 1 / Keyboard interrupt / FTM0 channel 1 / Fault output / Comparator input / ADC input | Enables synchronized dual-channel PWM with automatic fault shutdown via FDS |
| PTA2/KBI0P2/RxD0/SDA/PWT/ADP2 | Port A bit 2 / SCI receive / I²C data / Pulse width timer input / ADC input | Shared SCI/I²C/PWT pin allows compact serial interface design with timing-critical pulse measurement |
| PTA3/KBI0P3/TxD0/SCL/ACMP1IN0/OPAMP+/ADP3 | Port A bit 3 / SCI transmit / I²C clock / Comparator input / OPAMP non-inverting input / ADC input | Combines communication, analog sensing, and signal conditioning on single pin for sensor node integration |
| PTA4/FTM0CH1O/ACMP0O/BKGD/MS | Port A bit 4 / FTM0 channel 1 output / Comparator output / Background debug / Master select | Output-only pin used for debug entry and FTM-driven actuator control without software readback |
| PTA5/IRQ/FTM0CH0/TCLK0/RESET_b | Port A bit 5 / Interrupt request / FTM0 channel 0 / Timer clock / Reset input | Dual-role IRQ/RESET pin supports both external interrupt handling and hardware reset with glitch filtering |
| PTB0/KBI0P4/RxD0/ADP4 | Port B bit 0 / Keyboard interrupt / SCI receive / ADC input | True open-drain output capability enables wired-AND logic and level-shifting for mixed-voltage systems |
| PTB1/KBI0P5/TxD0/ACMP1IN1/ADP5 | Port B bit 1 / SCI transmit / Comparator input / ADC input | Supports SCI communication while simultaneously feeding analog signals to comparator for threshold detection |
| PTB2/KBI0P6/SDA/FDSIN/ADP6 | Port B bit 2 / I²C data / Fault detection input / ADC input | FDSIN accepts external fault signals (e.g., from current-sense amplifier) to trigger immediate output disable |
| PTB3/KBI0P7/SCL/TCLK2/ADP7 | Port B bit 3 / I²C clock / Timer clock / ADC input | Provides external clock source for FTM2 and synchronizes I²C communication with timer-based operations |
| PTB4/FTM2CH4/FDSOUT4 | Port B bit 4 / FTM2 channel 4 / Fault output | Drives high-side switch or gate driver with hardware-enforced shutdown during overcurrent events |
| PTB5/FTM2CH5/FDSOUT5 | Port B bit 5 / FTM2 channel 5 / Fault output | Paired with PTB4 for complementary PWM outputs with coordinated fault response |
| PTB6/SDA/XTAL | Port B bit 6 / I²C data / Crystal oscillator input | Shared SDA/XTAL reduces pin count while maintaining precise clocking for time-critical I²C transactions |
| PTB7/SCL/EXTAL | Port B bit 7 / I²C clock / Crystal oscillator output | Shared SCL/EXTAL enables crystal-based clock generation without dedicated oscillator pins |
| PTC0/FTM2CH0/FDSOUT0/ADP8 | Port C bit 0 / FTM2 channel 0 / Fault output / ADC input | Primary FTM2 channel for motor phase control with integrated fault feedback path |
| PTC1/FTM2CH1/FDSOUT1/ADP9 | Port C bit 1 / FTM2 channel 1 / Fault output / ADC input | Second FTM2 channel for complementary drive in H-bridge configurations |
| PTC2/FTM2CH2/FDSOUT2/ADP10 | Port C bit 2 / FTM2 channel 2 / Fault output / ADC input | Third FTM2 channel supports three-phase motor commutation or multi-zone heating control |
| PTC3/FTM2CH3/FDSOUT3/ADP11 | Port C bit 3 / FTM2 channel 3 / Fault output / ADC input | Fourth FTM2 channel enables advanced timing sequences such as dead-time insertion or burst-mode operation |
| VDD | Power supply | 2.7–5.5 V digital/analog supply with internal regulation and low-voltage detection (LVD) thresholds at 2.56–4.4 V |
| VSS | Ground | Digital and analog ground planes must be connected at single point to minimize noise coupling into ADC/ACMP |
Key Features
| Feature | Design Value |
|---|---|
| Flash memory protection | Hardware-enforced read/program/erase lock prevents unauthorized firmware access or corruption during field updates |
| Low-power stop3 mode | 1.2 µA typical supply current with 1 kHz LPO clock active, enabling wake-up from RTC, ADC, or external interrupt |
| Fault Detection Shutdown (FDS) | Configurable per-channel fault inputs (e.g., PTB2/FDSIN) force designated outputs (e.g., PTC0–PTC3) into high-impedance state within microseconds |
| On-chip ICE debug | Single-wire background debug interface with three breakpoints and nine trigger modes enables in-circuit validation without JTAG header |
| Integrated analog subsystem | 12-bit ADC with FIFO, dual ACMPs with DAC reference, and OPAMP (×20 gain) allow closed-loop sensor signal conditioning without external components |
| Hardware peripheral interconnect | Direct module-to-module triggering (e.g., FTM overflow → ADC start) eliminates CPU polling and reduces latency to <1 µs |
Applications
| Industrial Motor Control | Sensor Signal Conditioning |
|---|---|
|
Use Scenario: Brushless DC motor commutation in HVAC blowers with overcurrent protection and thermal monitoring. IC Role / Device Role / Timing Role: MC9S08PB8MTJ executes FOC algorithms using FTM2-generated PWM, reads current/voltage via ADC, and triggers FDS shutdown on fault detection. Use Value: Hardware FDS response (<1 µs) prevents MOSFET destruction during short-circuit events; integrated OPAMP/ACMP reduces external component count by 4. |
Use Scenario: Analog front-end for smart pressure transducers in industrial process control. IC Role / Device Role / Timing Role: MC9S08PB8MTJ conditions bridge sensor output via OPAMP, digitizes with 12-bit ADC, and transmits calibrated data via SCI to host MCU. Use Value: On-chip 1.7 mV/°C temperature sensor enables real-time gain/offset compensation; internal bandgap reference ensures <0.1% ADC accuracy drift over temperature. |
| Energy Metering | Automotive Body Control |
|
Use Scenario: Residential electricity meter with tamper detection, harmonic analysis, and LCD display interface. IC Role / Device Role / Timing Role: MC9S08PB8MTJ samples voltage/current waveforms at 10 kSPS using ADC hardware triggers from FTM0, computes RMS/harmonics via CRC-assisted math, and drives segment LCD via GPIO. Use Value: CRC module accelerates checksum calculation for metrology data integrity; 20 MHz bus speed supports real-time harmonic FFT with <50 µs latency. |
Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN communication. IC Role / Device Role / Timing Role: MC9S08PB8MTJ acts as LIN slave node, receives commands via SCI (LIN-capable), drives motors via FTM0 PWM, and monitors switches via KBI. Use Value: LIN extension support enables direct integration into automotive networks without external transceiver; KBI detects 8-key matrix with <10 µA standby current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08PA8AVTG | Same S08 core, 8 KB flash, but 16-pin TSSOP (TG), no FDS module, only 8-channel ADC, no OPAMP | Limited to simpler control tasks without fault shutdown or analog signal conditioning | Select when cost-sensitive designs omit motor protection or precision analog front-ends |
| S9KEAZ8AMLH | Kinetis E-series ARM Cortex-M0+, 8 KB flash, 1 KB RAM, 12-bit ADC, but no FDS, no OPAMP, different debug interface (SWD) | Higher code density and interrupt latency; lacks hardware fault shutdown and integrated opamp | Choose for legacy ARM toolchain compatibility or future scalability, accepting added external components for fault/analog functions |
Compared with MC9S08PB8MTJ, MC9S08PA8AVTG offers lower pin count and cost but sacrifices FDS safety and analog integration, while S9KEAZ8AMLH provides ARM architecture benefits at the expense of real-time fault response and analog subsystem completeness.
Availability
MC9S08PB8MTJ is available at Aetrix Electronics and suitable for industrial motor control, energy metering, sensor interface, and automotive body electronics requiring stable component supply across extended temperature ranges.
Supply support for MC9S08PB8MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 50 years of microcontroller innovation.
The MC9S08PB series was designed for cost-sensitive, high-reliability embedded control in harsh environments - emphasizing integrated analog peripherals, hardware fault protection, and ultra-low-power operation from a single 2.7–5.5 V supply.
FAQ
What is the maximum operating frequency and voltage range for MC9S08PB8MTJ?
The MC9S08PB8MTJ operates at up to 20 MHz bus frequency across a supply voltage range of 2.7 V to 5.5 V, with guaranteed performance over the full industrial temperature range of –40°C to +125°C. This specification is validated per NXP's MC9S08PB16/PB8 datasheet Rev. 2.1 (11/2019), Section 6.2.1, Table 7.
Does MC9S08PB8MTJ include hardware fault protection features?
Yes, MC9S08PB8MTJ integrates Fault Detection Shutdown (FDS) with up to eight configurable fault inputs and outputs. When enabled, FDS forces designated pins (e.g., PTC0–PTC3) into high-impedance state upon detection of external faults, with sub-microsecond response. This is documented in Section 1 Overview and Table 2 of the MC9S08PB16/PB8 datasheet Rev. 2.1.
How many ADC channels and what resolution does MC9S08PB8MTJ support?
MC9S08PB8MTJ features a 12-channel, 12-bit successive-approximation ADC with 2.5 µs conversion time, eight-level FIFO, automatic compare function, and integrated temperature sensor (1.7 mV/°C). These specifications are confirmed in the "Peripherals" section of the MC9S08PB16/PB8 datasheet Rev. 2.1 (11/2019).
What debug interface does MC9S08PB8MTJ use, and how many breakpoints are supported?
MC9S08PB8MTJ uses a single-wire background debug (BDM) interface with on-chip in-circuit emulator (ICE) support. It provides three configurable breakpoints and nine trigger modes for in-circuit validation without requiring external debug hardware. This is specified in the "Development support" section of the MC9S08PB16/PB8 datasheet Rev. 2.1.
Is MC9S08PB8MTJ pin-compatible with MC9S08PB16MTJ?
Yes, MC9S08PB8MTJ and MC9S08PB16MTJ share identical 20-pin TSSOP (MTJ) packaging, pin assignments, and peripheral register maps. The only functional difference is flash size (8 KB vs. 16 KB); all I/O, timer, ADC, and communication peripherals operate identically. This compatibility is explicitly stated in Table 2 ("Orderable part numbers summary") of the MC9S08PB16/PB8 datasheet Rev. 2.1.
MC9S08PB8MTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 18
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08PB8MTJ FAQ
1.How can I place an order for MC9S08PB8MTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08PB8MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08PB8MTJ reliable?
The price and inventory of MC9S08PB8MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PB8MTJ is usually 5 days.
3.What payment methods are accepted for MC9S08PB8MTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08PB8MTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08PB8MTJ?
MC9S08PB8MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08PB8MTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08PB8MTJ?
For technical support, including MC9S08PB8MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PB8MTJ requirements.
6.How does Aetrix verify that MC9S08PB8MTJ is sourced from the original manufacturer or authorized distributors?
All MC9S08PB8MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PB8MTJ meets industry standards.
7.What is the process for return or replacement of MC9S08PB8MTJ?
All MC9S08PB8MTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PB8MTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08PB8MTJ part is unused and in its original packaging.
Return procedure for MC9S08PB8MTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08PB8MTJ Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
