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NXP Semiconductors MC9S08PB8VTG

Part No.:
MC9S08PB8VTG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08PB8VTG.pdf
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,310

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Product details

Overview

MC9S08PB8VTG from NXP Semiconductors is an 8-bit S08 core microcontroller with 8 KB flash, 1 KB RAM, and operation up to 20 MHz across 2.7–5.5 V supply and –40 °C to 105 °C temperature range. It integrates a 12-channel 12-bit ADC (2.5 µs conversion), two analog comparators, one fixed-gain ×20 opamp, dual flex timer modules (FTM0 and FTM2), SCI/I²C/UART/LIN interfaces, real-time clock, CRC engine, and fault detection shutdown (FDS) - deployed in industrial sensor nodes and motor control subsystems.

For engineers reviewing the MC9S08PB8VTG datasheet, MC9S08PB8VTG pinout, MC9S08PB8VTG application, or MC9S08PB8VTG equivalent, this page delivers verified technical context, package-specific pin assignments, functional peripheral mapping, and validated alternative options for cost-optimized, temperature-resilient embedded control designs requiring compact footprint and low-power stop modes.

Technical Context

The MC9S08PB8VTG implements an enhanced HCS08 CPU core with four-level nested interrupt support and up to 30 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference (±0.2% resolution, ±1.5% deviation over –40 °C to 105 °C), enabling stable 20 MHz bus operation without external crystal.

Peripheral integration includes a 12-bit ADC with eight-level FIFO and hardware trigger, dual FTM modules (2-channel FTM0 + 6-channel FTM2), single-wire background debug interface, and system-level interconnect logic supporting hardware-triggered events between SCI, RTC, ADC, and timers - optimized for infrared communication, baudrate detection, and metering calibration.

Key Specifications

Parameter Value and Actual Design Meaning
Core 8-bit S08 CPU with four-level nested interrupts and 30 interrupt/reset sources
Flash / RAM 8 KB flash (read/program/erase over full voltage/temperature); 1 KB RAM with access protection
Max Bus Frequency 20 MHz at 2.7–5.5 V supply, –40 °C to 105 °C operating range
ADC 12-channel, 12-bit resolution; 2.5 µs conversion time; FIFO with watermark; supports stop-mode operation
Clock Sources Internal ICS (FLL-based, ±1.5% accuracy over –40 °C to 105 °C); external XOSC (4–20 MHz crystal/ceramic)
Peripherals SCI/I²C/UART/LIN; two ACMPs; one ×20 OPAMP; RTC; CRC-16/32; PWT; KBI; FDS; MTIM0/MTIM1
Power Modes Low-power stop mode; reduced-power wait mode; peripheral clock gating via PMC register

Pinout & Package

MC9S08PB8VTG is housed in a 16-pin TSSOP package (JEDEC MO-153AC) with 0.65 mm pitch, 5.0 mm × 4.4 mm body, and thermal resistance RθJA = 130 °C/W (single-layer board).

Pin/Terminal Circuit Role Design Meaning
PTA0/KBI0P0/FTM0CH0/FDSOUT6/ACMP0IN0/ADP0 Multi-function GPIO Configurable as keyboard interrupt input, FTM0 channel 0, fault output, comparator input, or ADC channel 0
PTA1/KBI0P1/FTM0CH1/FDSOUT7/ACMP0IN1/ADP1 Multi-function GPIO Supports FTM0 channel 1 output, fault output, comparator input, or ADC channel 1
PTA2/KBI0P2/RxD0/SDA/PWT/ADP2 Serial & timing I/O SCI receive, I²C data, pulse width timer input, or ADC channel 2
PTA3/KBI0P3/TxD0/SCL/ACMP1IN0/OPAMP+/ADP3 Serial & analog I/O SCI transmit, I²C clock, comparator input, opamp non-inverting input, or ADC channel 3
PTB0/KBI0P4/RxD0/ADP4 True open-drain I/O SCI receive or ADC channel 4; operates as true open drain when configured as output
PTB1/KBI0P5/TxD0/ACMP1IN1/ADP5 Serial & analog I/O SCI transmit, comparator input, or ADC channel 5
PTB2/KBI0P6/SDA/FDSIN/ADP6 I²C & fault input I²C data line or fault detection input for FDS module; also ADC channel 6
PTB3/KBI0P7/SCL/TCLK2/ADP7 I²C & timer clock I²C clock or external timer clock input; also ADC channel 7
VDD / VSS Power rails Single 2.7–5.5 V supply; ground reference for digital/analog domains
RESET_b Active-low reset Asynchronous reset input with internal pullup; accepts 1.5×tcyc minimum pulse width
BKGD/MS Debug interface Single-wire background debug pin; must be held low during power-up to enter BDM mode
EXTAL / XTAL Crystal oscillator External crystal connection points for XOSC module (4–20 MHz range)

Key Features

Feature Design Value
On-chip ICE debug module Two comparators and nine trigger modes enable precise in-circuit debugging without external emulator
Fault Detection Shutdown (FDS) Configurable fault response on up to 4 pins (FDSOUT0–FDSOUT3); outputs can be set to 0, 1, or high-Z on fault
ADC temperature sensor Integrated 1.7 mV/°C sensor with internal bandgap reference enables accurate ambient temperature monitoring
Low-voltage detection (LVD) Selectable trip points (high/low ranges) with interrupt or reset output; hysteresis of 100 mV (high) or 40 mV (low)
System protection Watchdog with independent clock, illegal opcode/address detection, and CRC-16/32 polynomial generator

Applications

Industrial Sensor Node Motor Control Subsystem

Use Scenario: Compact environmental monitoring unit measuring temperature, humidity, and pressure in HVAC ducts or factory enclosures.

IC Role / Device Role / Timing Role: Central controller executing sensor polling, ADC acquisition, LIN bus communication, and watchdog-managed fault recovery.

Use Value: Integrated 12-bit ADC with FIFO and stop-mode operation enables low-power periodic sampling; LIN-capable SCI reduces wiring complexity in distributed systems.

Use Scenario: Brushless DC motor commutation control in small appliances using hall-effect feedback and PWM drive signals.

IC Role / Device Role / Timing Role: Real-time PWM generation via FTM0/FTM2, current sensing via ADC, and fault shutdown via FDS upon overcurrent detection.

Use Value: Dual FTM modules provide six PWM channels with edge- or center-aligned modes; FDS responds within one bus cycle to disable outputs on fault.

Smart Meter Interface Home Appliance Control Panel

Use Scenario: Energy meter front-end handling pulse counting, tariff switching, and secure data logging via I²C EEPROM.

IC Role / Device Role / Timing Role: RTC-synchronized timestamping, CRC-32 checksum validation, and I²C master communication with external memory.

Use Value: Hardware RTC with 1 kHz LPO clock maintains time during stop3 mode (1.3 µA typical); CRC engine offloads software overhead for firmware integrity checks.

Use Scenario: Keypad-driven user interface for washing machines with LED indicators, buzzer feedback, and safety interlocks.

IC Role / Device Role / Timing Role: Keyboard interrupt scanning (KBI0), LED/PWM dimming via FTM, and buzzer tone generation via PWT.

Use Value: Eight KBI inputs support matrix keypad decoding without CPU polling; PWT captures button press duration for long-press detection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08PB16VTG 16 KB flash (vs. 8 KB), same 16-pin TSSOP package, identical peripherals and pinout Required where firmware size exceeds 8 KB or future code expansion is anticipated Select MC9S08PB16VTG if application demands larger program memory while retaining identical PCB layout and peripheral configuration
S9KEAZ128AMLH ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, higher performance but different architecture and toolchain Used in next-generation designs requiring higher throughput or RTOS support Choose S9KEAZ128AMLH only when migrating to ARM ecosystem; not drop-in compatible due to core, memory map, and peripheral register differences

Compared with MC9S08PB8VTG, MC9S08PB16VTG offers double flash capacity in identical packaging for seamless scalability, while S9KEAZ128AMLH provides ARM-based performance uplift at the cost of architectural discontinuity and redesign effort.

Availability

MC9S08PB8VTG is available at Aetrix Electronics and suitable for industrial sensor nodes, motor control subsystems, smart meter interfaces, and home appliance control panels requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC9S08PB8VTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The MC9S08PB series targets cost-sensitive, temperature-resilient embedded control applications - emphasizing low-power operation, integrated analog peripherals, and robust debug capabilities for rapid development of industrial and consumer devices.

FAQ

What is the maximum operating frequency of the MC9S08PB8VTG?

The MC9S08PB8VTG supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7–5.5 V) and temperature range (–40 °C to 105 °C). This is achieved using the internal ICS with FLL, which maintains stability without requiring an external crystal for basic operation.

Does the MC9S08PB8VTG support in-circuit debugging?

Yes, the MC9S08PB8VTG includes a single-wire background debug interface (BKGD/MS pin) with on-chip in-circuit emulator (ICE) functionality. It supports three hardware breakpoints and nine trigger modes, enabling full visibility into program flow and register states during live operation.

How many ADC channels does the MC9S08PB8VTG have, and what is their resolution?

The MC9S08PB8VTG features an 8-channel, 12-bit successive approximation ADC with 2.5 µs conversion time. It includes an eight-level FIFO, automatic compare function, optional hardware trigger, and supports operation in stop3 mode - all confirmed in the MC9S08PB16/PB8 datasheet Rev. 2.1.

What package type is used for the MC9S08PB8VTG?

The MC9S08PB8VTG is supplied in a 16-pin TSSOP package (JEDEC MO-153AC), with 0.65 mm lead pitch and 5.0 mm × 4.4 mm body dimensions. Thermal resistance is RθJA = 130 °C/W on a single-layer board, as specified in Table 10 of the official datasheet.

Can the MC9S08PB8VTG operate in low-power stop mode?

Yes, the MC9S08PB8VTG supports a low-power stop3 mode with typical current consumption of 1.3 µA at 5 V (1.2 µA at 3 V). In this mode, only the 1 kHz LPO clock remains active, while the ADC, LVD, and RTC retain limited functionality - enabling ultra-low-power wake-on-event operation.

MC9S08PB8VTG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
14
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08PB8VTG FAQ

1.How can I place an order for MC9S08PB8VTG through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08PB8VTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08PB8VTG reliable?

The price and inventory of MC9S08PB8VTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PB8VTG is usually 5 days.

3.What payment methods are accepted for MC9S08PB8VTG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08PB8VTG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08PB8VTG?

MC9S08PB8VTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08PB8VTG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08PB8VTG?

For technical support, including MC9S08PB8VTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PB8VTG requirements.

6.How does Aetrix verify that MC9S08PB8VTG is sourced from the original manufacturer or authorized distributors?

All MC9S08PB8VTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PB8VTG meets industry standards.

7.What is the process for return or replacement of MC9S08PB8VTG?

All MC9S08PB8VTG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PB8VTG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08PB8VTG part is unused and in its original packaging.

Return procedure for MC9S08PB8VTG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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