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NXP Semiconductors MC9S08PB8VTJ

Part No.:
MC9S08PB8VTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08PB8VTJ.pdf
Description:
IC MCU 8BIT 8KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:740

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Product details

Overview

MC9S08PB8VTJ from NXP Semiconductors is an 8-bit S08 microcontroller with 8 KB flash, 1 KB RAM, and integrated peripherals including a 12-channel 12-bit ADC, two analog comparators, one operational amplifier, dual flex timer modules (FTM0 and FTM2), SCI/I2C/UART interfaces, real-time clock (RTC), and fault detection shutdown (FDS). It operates up to 20 MHz across 2.7–5.5 V and –40 °C to +105 °C, targeting embedded control in industrial sensors and motor drive subsystems.

For engineers reviewing the MC9S08PB8VTJ datasheet, MC9S08PB8VTJ pinout, MC9S08PB8VTJ application, or MC9S08PB8VTJ equivalent, key selection criteria include its 20-pin TSSOP package, 8 KB flash memory size, support for stop3 low-power mode with sub-µA current, integrated 1 kHz LPO oscillator, and hardware-triggered ADC with FIFO-critical for deterministic timing in battery-powered edge nodes.

Technical Context

The MC9S08PB8VTJ implements an enhanced HCS08 CPU core with four-level nested interrupt handling and up to 30 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference (±0.2% resolution, ±1% deviation over 0–70 °C), enabling stable bus operation without external crystal when paired with the 31.25 kHz–20 MHz XOSC module.

Peripheral integration includes dual FTM modules (FTM0: 2-channel; FTM2: 6-channel), each supporting input capture, output compare, and PWM modes; an ADC with 2.5 µs conversion time, eight-level FIFO, and optional hardware trigger; and FDS logic that forces configurable output states (0, 1, or high-Z) upon fault detection-enabling safe shutdown in motor control and power management applications.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture8-bit S08 CPU with four-level nested interrupt support and 30 interrupt/reset sources
Flash Memory8 KB program/erase flash, readable over full voltage (2.7–5.5 V) and temperature (–40 to +105 °C)
RAM Size1 KB on-chip RAM with access protection
Max Bus Frequency20 MHz at 2.7–5.5 V, enabling real-time response in closed-loop control
ADC Resolution & Speed12-bit, 12-channel ADC with 2.5 µs conversion time and eight-level FIFO for burst sampling
Low-Power Stop ModeStop3 mode draws ≤1.3 µA (5 V) with 1 kHz LPO clock active, supporting wake-on-comparator or RTC event
Operating Temperature–40 °C to +105 °C (V-grade), qualified for industrial ambient environments
Package20-pin TSSOP (VTJ suffix), 0.65 mm pitch, JEDEC MO-153 compliant

Pinout & Package

MC9S08PB8VTJ is housed in a 20-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm lead pitch, optimized for compact industrial PCB layouts and reflow-compatible assembly. Thermal resistance is 116 °C/W (single-layer board) and 76 °C/W (four-layer board).

Pin/Terminal Circuit Role Design Meaning
PTA0/KBI0P0/FTM0CH0/FDSOUT6/ACMP0IN0/ADP0Multi-function I/OConfigurable as keyboard interrupt input, FTM0 channel 0, FDS output 6, comparator 0 positive input, or ADC channel 0
PTA1/KBI0P1/FTM0CH1/FDSOUT7/ACMP0IN1/ADP1Multi-function I/OSupports FTM0 channel 1 output, FDS output 7, comparator 0 negative input, or ADC channel 1
PTA2/KBI0P2/RxD0/SDA/PWT/ADP2Multi-function I/OSCI0 receive, I2C data line, pulse width timer input, or ADC channel 2
PTA3/KBI0P3/TxD0/SCL/ACMP1IN0/OPAMP+/ADP3Multi-function I/OSCI0 transmit, I2C clock, comparator 1 positive input, opamp non-inverting input, or ADC channel 3
PTA4/FTM0CH1O/ACMP0O/BKGD/MSOutput-only / debugFTM0 channel 1 output only; also serves as background debug pin (BKGD) and master select (MS)
PTA5/IRQ/FTM0CH0/TCLK0/RESET_bInterrupt / resetActive-low reset input with glitch filtering; also supports IRQ interrupt, FTM0 channel 0, or timer clock input
PTB0/KBI0P4/RxD0/ADP4True open-drain I/OSCI0 receive with true open-drain capability-supports wired-AND bus topologies without external pull-up
PTB1/KBI0P5/TxD0/ACMP1IN1/ADP5Multi-function I/OSCI0 transmit, comparator 1 negative input, or ADC channel 5
PTB2/KBI0P6/SDA/FDSIN/ADP6Fault input / I2CI2C data line or FDS fault input 0-triggers immediate output state change per FDS configuration
PTB3/KBI0P7/SCL/TCLK2/ADP7I2C / timer clockI2C clock line or external timer clock input for FTM2
PTB4/FTM2CH4/FDSOUT4FTM2 / FDS outputFTM2 channel 4 output or FDS output 4-configurable for PWM or fault-driven shutdown
PTB5/FTM2CH5/FDSOUT5FTM2 / FDS outputFTM2 channel 5 output or FDS output 5-supports complementary PWM generation with dead-time control
PTB6/SDA/XTALOscillator / I2CCrystal oscillator input (XTAL) or I2C data line-shared function requires careful pinmux planning
PTB7/SCL/EXTALOscillator / I2CCrystal oscillator output (EXTAL) or I2C clock line-dual-use critical for clock source selection
PTC0/FTM2CH0/FDSOUT0/ADP8FTM2 / FDS outputFTM2 channel 0 output or FDS output 0-primary PWM output for motor phase A
PTC1/FTM2CH1/FDSOUT1/ADP9FTM2 / FDS outputFTM2 channel 1 output or FDS output 1-supports phase B PWM in three-phase drive
PTC2/FTM2CH2/FDSOUT2/ADP10FTM2 / FDS outputFTM2 channel 2 output or FDS output 2-enables phase C PWM or auxiliary control signal
PTC3/FTM2CH3/FDSOUT3/ADP11FTM2 / FDS outputFTM2 channel 3 output or FDS output 3-used for brake control or enable signals in safety-critical paths
VDD / VSSPower / groundDual supply pins support separate analog/digital domains; VDDA not isolated-requires clean layout for ADC accuracy

Key Features

Feature Design Value
Integrated Fault Detection Shutdown (FDS)Eight configurable FDS outputs (4 on PB8 variant) with independent fault-source enable and programmable output state (0/1/high-Z) for fail-safe motor control
Hardware-Triggered ADC with FIFOEight-level FIFO with watermark interrupt and automatic compare enables burst acquisition synchronized to FTM or PWT events-reducing CPU load in sensor sampling
Single-Wire Background Debug (BDM)On-chip ICE debug module with three breakpoints and nine trigger modes allows in-circuit debugging without dedicated JTAG pins-saving PCB space
Factory-Trimmed Internal Clock Source (ICS)FLL-based ICS with ±0.2% resolution and ±1% deviation over 0–70 °C eliminates need for external crystal in cost-sensitive applications
True Open-Drain Output (PTB0)PTB0 operates as true open-drain (not weak-pull) supporting I2C bus arbitration and wired-AND logic without external components
Low-Voltage Detection with Programmable ThresholdsFour selectable warning levels (VLVW1H–VLVW4H) and dual detect ranges (high/low) enable precise brown-out response for battery-backed systems

Applications

Industrial Motor Control Smart Sensor Node

Use Scenario: Brushless DC (BLDC) motor commutation in HVAC blowers and pump drives requiring precise timing and fault response.

IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms via FTM-generated PWM, ADC-sampled current feedback, and FDS-triggered shutdown on overcurrent.

Use Value: Integrated FDS outputs reduce external protection circuitry; 2.5 µs ADC conversion enables 200 kHz current loop sampling within 10 µs control cycle.

Use Scenario: Battery-powered environmental sensor aggregating temperature, humidity, and CO₂ with local preprocessing before wireless transmission.

IC Role / Device Role / Timing Role: System-on-chip managing sensor interface, low-power scheduling, CRC-protected data logging, and wake-on-event via KBI or RTC alarm.

Use Value: Stop3 mode current ≤1.3 µA extends 10-year battery life; on-chip 1.16 V bandgap reference ensures ADC accuracy without external voltage reference.

Energy Metering Subsystem Industrial PLC I/O Module

Use Scenario: Metrology front-end in residential electricity meters measuring voltage/current waveforms and computing RMS, harmonics, and energy.

IC Role / Device Role / Timing Role: ADC acquisition engine with hardware-triggered sampling synchronized to zero-crossing detection from ACMP, feeding data to host MCU via SCI.

Use Value: 12-bit ADC with 2.5 µs conversion and FIFO supports 16 kSPS sampling; internal temperature sensor (1.7 mV/°C) enables thermal drift compensation.

Use Scenario: Digital input/output expansion module in modular PLCs handling discrete signals from limit switches, solenoids, and indicator lamps.

IC Role / Device Role / Timing Role: Local intelligence node performing debounce, state monitoring, and fault reporting via I2C to main controller.

Use Value: Eight KBI inputs with programmable edge detection eliminate external debouncing RC networks; FDS logic provides hardware-level output disable on watchdog timeout or LVD event.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08PB16VTJ16 KB flash (vs. 8 KB), identical pinout, same peripherals and packageSupports larger firmware images and more complex control algorithms without layout changeSelect when future firmware growth or additional feature sets (e.g., expanded communication stacks) are anticipated
S9KEAZ128AMLHARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, higher performance but different architecture and toolchainRequires migration from S08 assembly/C to ARM GCC; supports USB, CAN, and advanced power modes not available in PB8Choose for new designs needing scalability beyond 8-bit performance or protocol requirements like CAN FD

Compared with MC9S08PB16VTJ, the MC9S08PB8VTJ offers identical peripheral set and pin compatibility at lower memory cost-ideal for fixed-function control where code footprint stays under 8 KB. Versus S9KEAZ128AMLH, it avoids ARM toolchain complexity and delivers deterministic real-time latency suited to hard real-time loops below 20 MHz.

Availability

MC9S08PB8VTJ is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, energy metering subsystems, and PLC I/O modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC9S08PB8VTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and mixed-signal integration.

The MC9S08PB series targets cost-sensitive, reliability-critical embedded control applications-designed for industrial automation, appliance control, and motor drive subsystems where robustness, low-power operation, and integrated analog peripherals are essential.

FAQ

What is the maximum operating frequency of the MC9S08PB8VTJ?

The MC9S08PB8VTJ supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7–5.5 V) and temperature range (–40 °C to +105 °C). This is achieved using either the internal clock source (ICS) with FLL or an external crystal/ceramic resonator via the XOSC module. The 20 MHz limit applies to both flash and RAM execution modes, with timing validated per Table 7 in the datasheet.

Does the MC9S08PB8VTJ support hardware debugging during development?

Yes, the MC9S08PB8VTJ includes a single-wire background debug interface (BDM) with on-chip in-circuit emulator (ICE) functionality. It supports up to three breakpoints, nine trigger modes, and real-time register/memory access-enabling full in-circuit debugging without requiring additional debug headers or pins beyond the BKGD/MS pin (PTA4). This reduces PCB complexity versus multi-pin JTAG solutions.

How many ADC channels does the MC9S08PB8VTJ have, and what is their resolution?

The MC9S08PB8VTJ integrates a 12-channel, 12-bit successive approximation ADC with 2.5 µs conversion time, eight-level data FIFO, and optional hardware triggering. All 12 channels are accessible via dedicated ADPn pins (ADP0–ADP11), and the module supports operation in stop3 mode-allowing low-power periodic sampling without waking the CPU core.

What low-power modes are available on the MC9S08PB8VTJ?

The MC9S08PB8VTJ offers multiple low-power modes: reduced-power wait mode and stop3 mode. In stop3 mode, all clocks halt except the 1 kHz low-power oscillator (LPO), achieving ≤1.3 µA typical supply current at 5 V. Wake-up sources include RTC alarm, keyboard interrupt (KBI), comparator output, or external pin interrupt-making it suitable for battery-operated sensing applications.

Is the MC9S08PB8VTJ pin-compatible with other members of the PB family?

Yes, the MC9S08PB8VTJ is pin-compatible with the MC9S08PB16VTJ-both use the 20-pin TSSOP (VTJ) package and share identical pin assignments and multiplexing. This allows direct substitution where firmware fits within 8 KB flash, or seamless migration to 16 KB flash for feature expansion without PCB redesign.

MC9S08PB8VTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
18
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08PB8VTJ FAQ

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Please submit a Request for Quotation (RFQ) for MC9S08PB8VTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08PB8VTJ?

For technical support, including MC9S08PB8VTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PB8VTJ requirements.

6.How does Aetrix verify that MC9S08PB8VTJ is sourced from the original manufacturer or authorized distributors?

All MC9S08PB8VTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PB8VTJ meets industry standards.

7.What is the process for return or replacement of MC9S08PB8VTJ?

All MC9S08PB8VTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PB8VTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08PB8VTJ part is unused and in its original packaging.

Return procedure for MC9S08PB8VTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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