NXP Semiconductors MC9S08PL8SCTJ

Overview

MC9S08PL8SCTJ from NXP Semiconductors is an 8-bit S08 core microcontroller designed for cost-sensitive embedded control applications, featuring 8 KB flash, 1 KB RAM, 20 MHz bus operation across 2.7–5.5 V, 12-channel 10-bit ADC with temperature sensor, and dual FlexTimer modules (FTM0 and FTM2) supporting PWM, input capture, and output compare. It operates in industrial temperature range (–40 °C to +85 °C) and targets smart sensors, motor control interfaces, and low-power metering systems.

For engineers reviewing the MC9S08PL8SCTJ datasheet, MC9S08PL8SCTJ pinout, MC9S08PL8SCTJ application, or MC9S08PL8SCTJ equivalent, this page delivers verified technical context, package mapping to 20-pin TSSOP, confirmed peripheral register layout, real-world use-value metrics (e.g., 2.5 µs ADC conversion, 1.7 mV/°C temp sensor linearity), and two validated alternative parts with documented functional and application-level differences.

Technical Context

The MC9S08PL8SCTJ implements an S08 CPU core with nested interrupt support up to four levels and 30 interrupt/reset sources. Its Internal Clock Source (ICS) integrates a frequency-locked loop (FLL) with factory-trimmed internal reference enabling ±0.2% resolution and ≤1.5% deviation over –40 °C to +85 °C.

Peripheral integration includes one SCI (LIN-capable UART), one I²C interface (up to 400 kbps), one analog comparator with 6-bit DAC reference, 16-bit RTC, CRC engine with programmable 16-/32-bit polynomials, and keyboard interrupt module supporting up to eight inputs. All peripherals are accessible via memory-mapped registers at confirmed addresses (e.g., ADC at 0x0010–0x0017, FTM2 at 0x30C0–0x30D6).

Key Specifications

Pinout & Package

MC9S08PL8SCTJ is housed in a 20-pin Thin Shrink Small Outline Package (TSSOP), optimized for high-density PCB layouts with thermal resistance R_θJA = 116 °C/W (single-layer board) and R_θJB = 42 °C/W (junction-to-board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08PL16SCTJ, MC9S08PL8SCTJ delivers identical peripheral functionality and timing behavior at lower flash cost, while S9KEAZ128AMLH trades pin compatibility and sub-µA stop current for higher performance and modern architecture - making MC9S08PL8SCTJ the optimal choice for stable, cost-sensitive, low-power 8-bit control.

Availability

MC9S08PL8SCTJ is available at Aetrix Electronics and suitable for smart sensor nodes, utility metering interfaces, motor control sequencers, and industrial keypad controllers requiring stable component supply across extended production lifecycles.

Supply support for MC9S08PL8SCTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of microcontroller innovation and broad ARM and legacy architecture support.

The MC9S08PL series was engineered specifically for cost-optimized, low-power embedded control in resource-constrained industrial and consumer devices, emphasizing robust peripheral integration, debug accessibility, and long-term supply assurance.

FAQ

What is the maximum operating frequency of the MC9S08PL8SCTJ?

The MC9S08PL8SCTJ supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7 V to 5.5 V) and industrial temperature range (–40 °C to +85 °C). This frequency is achieved using the internal clock source (ICS) with FLL, and is confirmed in Table 2 and Section 6.2.1 of the official datasheet. The MC9S08PL8SCTJ maintains timing compliance at this rate without derating.

Does the MC9S08PL8SCTJ include an integrated temperature sensor?

Yes, the MC9S08PL8SCTJ includes a factory-calibrated on-die temperature sensor with a sensitivity of 1.7 mV/°C, accessible via a dedicated ADC channel (ADP12). This sensor is explicitly listed in the "Peripherals" section and characterized in Section 7.3.1 of the MC9S08PL16S datasheet, which applies identically to MC9S08PL8SCTJ per document scope. It operates in Stop3 mode, enabling temperature monitoring during low-power sleep.

What package type is used for the MC9S08PL8SCTJ?

The MC9S08PL8SCTJ uses a 20-pin Thin Shrink Small Outline Package (TSSOP), designated by the "TJ" suffix in the part number per Section 3.3 of the datasheet. Thermal characteristics for this package-including R_θJA = 116 °C/W (single-layer board) and R_θJB = 42 °C/W-are fully specified in Table 10. Pin assignments match those of MC9S08PL16SCTJ, confirming mechanical and thermal interchangeability.

How many ADC channels does the MC9S08PL8SCTJ support?

The MC9S08PL8SCTJ supports 12 ADC input channels, as confirmed in Table 2 ("Orderable part numbers") and the "Peripherals" section of the MC9S08PL16S datasheet, which explicitly states coverage of both MC9S08PL16S and MC9S08PL8S. Each channel provides 10-bit resolution with 2.5 µs conversion time, and the ADC includes an eight-level FIFO, automatic compare, and hardware trigger capability.

Is the MC9S08PL8SCTJ pin-compatible with the MC9S08PL16SCTJ?

Yes, the MC9S08PL8SCTJ is pin-compatible with the MC9S08PL16SCTJ in the same package variant (e.g., CTJ = 20-pin TSSOP). Both share identical pin assignments, electrical characteristics, peripheral register maps, and timing specifications, differing only in flash memory size (8 KB vs. 16 KB). This compatibility is documented in the datasheet's "Orderable part numbers" table and confirmed by identical "Package" entries and shared signal multiplexing diagrams.