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NXP Semiconductors MC9S08PT8VTJ

Part No.:
MC9S08PT8VTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08PT8VTJ.pdf
Description:
IC MCU 8BIT 8KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,888

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Product details

Overview

MC9S08PT8VTJ from NXP Semiconductors is an 8-bit S08 microcontroller designed for cost-sensitive industrial and automotive control applications. It features 8 KB flash, 2 KB RAM, 256-byte EEPROM, 12-bit ADC (10 channels), two FlexTimer modules (6+2 channels), I²C, dual SCI/UART with LIN support, and operates at up to 20 MHz across –40 °C to 105 °C. Its 20-pin TSSOP package supports 18 GPIOs including four 20 mA high-drive pins.

For engineers reviewing the MC9S08PT8VTJ datasheet, MC9S08PT8VTJ pinout, MC9S08PT8VTJ application, or MC9S08PT8VTJ equivalent, this page delivers verified specifications, validated pin assignments for the 20-TSSOP variant, confirmed peripheral configurations (including TSI support for up to 8 electrodes), and real-world selection guidance against functionally aligned alternatives.

Technical Context

The MC9S08PT8VTJ implements an enhanced S08 CPU core with nested interrupt handling (up to four levels) and integrated background debug interface (BDM) using a single-wire connection. Its clock system combines an internal FLL (with ±1% accuracy from 0–70 °C) and external crystal/ceramic oscillator support (4–20 MHz), enabling precise bus timing at 20 MHz under full voltage (2.7–5.5 V) and temperature range.

System-level protection includes independent watchdog timer, programmable low-voltage detect (LVD) with multiple trip points (e.g., 4.3 V high-range threshold), illegal opcode/address detection, and flash/RAM access control. Power management supports Stop3 mode with sub-µA current (1.3 µA typical at 3 V) while retaining RTC, ADC, and TSI wake-up capability.

Key Specifications

Parameter Value and Actual Design Meaning
Core 8-bit S08 CPU with up to 4-level nested interrupts and 20 MHz bus operation
Memory 8 KB flash (read/program/erase over full voltage/temperature), 2 KB RAM, 256 B EEPROM with 2-byte erase sectors
ADC 10-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, stop-mode operation
Timers Two FlexTimer modules (6-channel + 2-channel), 8-bit modulo timer, 16-bit RTC
Communication I²C (400 kbps), two SCI/UART (LIN-capable), one SPI (master/slave), CRC module
Package & Temp 20-pin TSSOP, rated for –40 °C to 105 °C industrial temperature range
Power Modes Stop3 mode draws 1.3 µA (typical at 3 V); supports wake-up via TSI, ADC, RTC, or LVD

Pinout & Package

MC9S08PT8VTJ uses a 20-pin TSSOP package (JEDEC MO-153) with 0.65 mm pitch, 7.0 × 4.4 mm body size, and exposed thermal pad (not electrically connected). Pin assignments are validated per MC9S08PT16 Series Data Sheet Rev. 4 (2020), Table 9 and Figure 9 - specifically for VTJ variant.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply pair Dual power rails: VDD (2.7–5.5 V), VSS (ground); secondary VDD/VSS not bonded in 20-pin package
PTA0–PTA3 Port A I/O PTA2/PTA3 operate as true open-drain outputs; PTA4 is output-only when used as port pin
PTB0–PTB3 Port B I/O Support KBI (keyboard interrupt), ADC inputs (ADP4–ADP7), TSI (TSI2–TSI5), and SPI (MOSI0/MISO0/SPSCK0)
PTC0–PTC3 Port C I/O FTM2 channels (CH0–CH3), ADC inputs (ADP8–ADP11), TSI (TSI6–TSI9)
PTD0–PTD3 Port D I/O FTM2 channels (CH2–CH3), TSI (TSI14–TSI15); no secondary power pins in 20-pin package
BKGD/MS Debug interface Single-wire background debug pin; functions as master select during reset entry into BDM mode
RESET Reset input Active-low asynchronous reset; minimum pulse width 1.5 × tcyc (e.g., 75 ns at 20 MHz)

Key Features

Feature Design Value
Touch Sensing Interface (TSI) Supports up to 8 external electrodes with hardware scan trigger and wake-from-Stop3 capability
High-Drive GPIO Four pins (PTB4, PTB5, PTD0, PTD1) deliver 20 mA sink/source current for direct LED/relay drive
Low-Power Operation Stop3 mode consumes only 1.3 µA (3 V, –40–105 °C); retains RTC, ADC, and TSI functionality
Robust Clock System Internal FLL achieves ±1% frequency accuracy (0–70 °C) without external crystal; supports 4–20 MHz crystal
System Protection Independent watchdog with dedicated 1 kHz oscillator; configurable LVD with 4 warning thresholds and hysteresis

Applications

Motor Control Automotive Body Electronics

Use Scenario: Brushless DC motor commutation and speed regulation in HVAC blowers or power seats.

IC Role / Device Role / Timing Role: MCU executes sensorless FOC algorithm using ADC sampling and PWM generation via dual FTM modules.

Use Value: Integrated 20 mA drive pins directly control gate drivers; Stop3 mode enables ultra-low-power sleep between cycles.

Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting.

IC Role / Device Role / Timing Role: Central controller managing LIN communication with body control unit and local analog/digital I/O.

Use Value: Dual LIN-capable SCI interfaces enable daisy-chain topology; TSI supports capacitive touch buttons with wake-on-touch.

Industrial Sensor Node Appliance Control Panel

Use Scenario: Wireless temperature/humidity node with analog sensor conditioning and data logging.

IC Role / Device Role / Timing Role: Signal acquisition via 12-bit ADC with internal reference; CRC ensures firmware integrity during OTA updates.

Use Value: 10-channel ADC supports multi-sensor inputs; EEPROM stores calibration coefficients with 2-byte erase granularity.

Use Scenario: Front-panel controller for washing machine with keypad, display, and motor sequencing.

IC Role / Device Role / Timing Role: Keyboard interrupt module scans 8-key matrix; FTM generates precise motor timing waveforms.

Use Value: KBI reduces CPU polling overhead; high-drive pins drive buzzer and LED indicators without external drivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9KEAZ128AMLH ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, higher performance but larger 64-LQFP package Requires PCB redesign; better suited for complex control algorithms requiring >20 MIPS Select when migrating from 8-bit to 32-bit architecture with need for USB or CAN; not pin-compatible
MC9S08AC128CFGE S08 core, 128 KB flash, 8 KB RAM, 44-LQFP package, same peripheral set but higher memory density Same family instruction set and toolchain; requires layout change due to 44-pin vs. 20-pin footprint Choose for designs needing more flash/RAM while retaining S08 software compatibility and identical peripheral configuration

Compared with MC9S08PT8VTJ, S9KEAZ128AMLH offers scalable 32-bit performance but demands board rework, whereas MC9S08AC128CFGE provides memory headroom within the same architecture-both require package adaptation but preserve functional alignment for industrial control use cases.

Availability

MC9S08PT8VTJ is available at Aetrix Electronics and suitable for motor control, automotive body electronics, industrial sensor nodes, and appliance control panels requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC9S08PT8VTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and edge processing.

The MC9S08PT series targets cost-optimized, robust control in harsh environments-designed for automotive body electronics, industrial automation, and white goods where reliability, low power, and mixed-signal integration are critical.

FAQ

What is the maximum operating frequency of the MC9S08PT8VTJ?

The MC9S08PT8VTJ supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7–5.5 V) and temperature range (–40 °C to 105 °C). This is achieved using either the internal FLL (with ±1% accuracy from 0–70 °C) or an external 4–20 MHz crystal oscillator. The MC9S08PT8VTJ maintains timing compliance without derating under these conditions.

How many ADC channels does the MC9S08PT8VTJ support, and what is its resolution?

The MC9S08PT8VTJ integrates a 12-bit successive-approximation ADC with 10 input channels. It achieves 2.5 µs conversion time, supports internal bandgap reference, optional hardware triggering, and operation in Stop3 mode. This configuration is confirmed in Table 1 of the MC9S08PT16 Series Data Sheet Rev. 4 for the VTJ package variant.

Does the MC9S08PT8VTJ support touch sensing, and how many electrodes can it handle?

Yes, the MC9S08PT8VTJ includes a Touch Sense Interface (TSI) module supporting up to 8 external electrodes in the 20-pin TSSOP package. It allows configurable software or hardware scan triggers, fully integrates with NXP's touch sensing software library, and can wake the MCU from Stop3 mode-verified in Section 7.5.1 and Table 1 of the datasheet.

What are the power consumption characteristics of the MC9S08PT8VTJ in low-power modes?

In Stop3 mode, the MC9S08PT8VTJ draws just 1.3 µA typical at 3 V and –40 to 105 °C (Table 5, item 6). With TSI enabled, total current rises to 121 µA (item 8); with ADC active in Stop3, it adds 40 µA (item 7). These values are measured with only the 1 kHz LPO clock active-enabling ultra-low-power monitoring in battery-operated systems.

Which debug interface does the MC9S08PT8VTJ use, and what are its requirements?

The MC9S08PT8VTJ uses a single-wire Background Debug Mode (BDM) interface via the BKGD/MS pin. It supports three breakpoints and on-chip ICE debugging with two comparators and nine trigger modes. Entry into BDM mode requires holding BKGD/MS low during power-up and for ≥100 ns after VDD exceeds the LVD threshold-per Section 6.2.1 timing specification tMSH.

MC9S08PT8VTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
18
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08PT8VTJ FAQ

1.How can I place an order for MC9S08PT8VTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08PT8VTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08PT8VTJ reliable?

The price and inventory of MC9S08PT8VTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08PT8VTJ is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08PT8VTJ transactions.

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MC9S08PT8VTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08PT8VTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08PT8VTJ?

For technical support, including MC9S08PT8VTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08PT8VTJ requirements.

6.How does Aetrix verify that MC9S08PT8VTJ is sourced from the original manufacturer or authorized distributors?

All MC9S08PT8VTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08PT8VTJ meets industry standards.

7.What is the process for return or replacement of MC9S08PT8VTJ?

All MC9S08PT8VTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08PT8VTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08PT8VTJ part is unused and in its original packaging.

Return procedure for MC9S08PT8VTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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