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NXP Semiconductors MC9S08QA2CDNE

Part No.:
MC9S08QA2CDNE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixMC9S08QA2CDNE.pdf
Description:
IC MCU 8BIT 2KB FLASH 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:450

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Product details

Overview

MC9S08QA2CDNE from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller in an 8-pin SOIC package, featuring 2 KB flash, 128 B RAM, 10-bit ADC with temperature sensor, analog comparator, TPM timer/PWM, and internal FLL clock source operating from 1.8 V to 3.6 V across –40°C to 85°C. It targets ultra-low-power sensor interface and simple control applications.

For engineers reviewing the MC9S08QA2CDNE datasheet, MC9S08QA2CDNE pinout, MC9S08QA2CDNE application, or MC9S08QA2CDNE equivalent, key selection criteria include its 8-pin SOIC footprint, 2 KB flash/128 B RAM memory configuration, stop3-mode operation capability, internal bandgap-referenced ADC, and single-wire background debug interface compatibility.

Technical Context

The MC9S08QA2CDNE implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and operating at up to 20 MHz bus frequency via its internal clock source (ICS) with FLL and factory-trimmed internal reference (±2% deviation over voltage/temperature). Its ICS enables bus frequencies from 1 MHz to 10 MHz without external crystals.

On-chip peripherals include a 4-channel 10-bit ADC with automatic compare, internal 1.7 mV/°C temperature sensor, and bandgap reference channel - all functional down to 1.8 V and in stop3 mode; the analog comparator supports edge-triggered interrupts and internal tie to TPM input capture, while the single-channel TPM supports PWM, input capture, and output compare.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit CPU with BGND instruction and 32 interrupt/reset vectors
Flash Memory2 KB on-chip flash, readable/programmable/erasable across full 1.8–3.6 V supply range
RAM Size128 bytes of on-chip RAM with security lock against unauthorized access
ADC Resolution10-bit SAR ADC with 4 input channels, internal temperature sensor (1.7 mV/°C), and bandgap reference
Operating Voltage1.8 V to 3.6 V - enables direct battery operation (e.g., single Li-ion or two alkaline cells)
Temperature Range–40°C to +85°C industrial grade - validated for embedded control in non-automotive environments
Low-Power ModesStop1/Stop2/Stop3 modes; real-time counter active in all stop modes using internal 1 kHz clock source

Pinout & Package

MC9S08QA2CDNE is housed in an 8-pin SOIC (Small Outline Integrated Circuit) package with 1.27 mm pitch, JEDEC MS-012AC compliant, suitable for automated PCB assembly and space-constrained designs.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltage inputMain power rail (1.8–3.6 V); powers core, flash, and all peripherals
VSSGround referenceDigital ground return; must be low-impedance connection to minimize noise coupling
PTA0/AD0/TPM1CH0Multi-function I/OConfigurable as GPIO, ADC channel 0 input, or TPM1 channel 0 I/O for PWM/capture
PTA1/AD1/ACMP0Multi-function I/OConfigurable as GPIO, ADC channel 1 input, or analog comparator input 0
PTA2/AD2/ACMP1Multi-function I/OConfigurable as GPIO, ADC channel 2 input, or analog comparator input 1
PTA3/AD3/KBI0Multi-function I/OConfigurable as GPIO, ADC channel 3 input, or keyboard interrupt pin 0
PTA4/BKGDDebug interfaceSingle-wire background debug (SWBDM) programming and in-circuit debugging port
PTA5/RESETReset inputActive-low reset pin; also functions as general-purpose output-only pin after reset release

Key Features

FeatureDesign Value
Internal Clock Source (ICS)FLL-controlled internal oscillator with factory-trimmed reference (0.2% resolution, ±2% deviation) - eliminates need for external crystal in cost-sensitive designs
Stop3 Mode Power EfficiencyReal-time counter remains active using internal 1 kHz clock - enables wake-up timing without external RTC or crystal
ADC Temperature SensingIntegrated 1.7 mV/°C temperature sensor with dedicated ADC channel - enables on-die thermal monitoring without external components
Security ProtectionFlash and RAM contents locked against unauthorized read-out via on-chip security circuitry - protects firmware IP in production units
Single-Wire Debug InterfaceBackground debug mode (BDM) over BKGD pin - reduces debug footprint to one signal, ideal for minimal-pin-count layouts

Applications

Smart Sensor NodeIndustrial Thermostat

Use Scenario: Battery-powered environmental sensor collecting temperature, voltage, and analog inputs in remote locations.

IC Role / Device Role / Timing Role: Central controller managing ADC sampling, temperature compensation, low-power sleep/wake cycles, and serial data reporting.

Use Value: Stop3 mode with active RTC enables precise wake intervals; internal temperature sensor and bandgap reference ensure accurate measurements without calibration components.

Use Scenario: Compact HVAC control unit regulating heating/cooling based on local ambient temperature and user-set thresholds.

IC Role / Device Role / Timing Role: Real-time decision engine executing PID-like logic, driving relay outputs, and monitoring thermistor inputs.

Use Value: 10-bit ADC with automatic compare triggers action at threshold crossings; analog comparator supports fast over-temperature shutdown independent of CPU.

Portable Medical MonitorIoT Edge Controller

Use Scenario: Handheld pulse oximeter or blood glucose meter requiring low-voltage operation and analog signal conditioning.

IC Role / Device Role / Timing Role: Signal acquisition processor digitizing analog biosensor outputs and managing display backlight timing via TPM PWM.

Use Value: Operates down to 1.8 V - compatible with coin-cell or single Li-ion batteries; ADC and ACMP function fully in stop3 mode for event-driven wake-up.

Use Scenario: Gateway node aggregating sensor data from multiple analog sources before forwarding via UART or wireless module.

IC Role / Device Role / Timing Role: Pre-processing hub performing local filtering, threshold detection, and duty-cycled wake/sleep scheduling.

Use Value: KBI module detects button presses or switch closures; TPM generates precise timing for sensor polling intervals without CPU overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08QG4CDTE4 KB flash, 256 B RAM, same 8-pin TSSOP package, identical peripheral set but higher memory capacitySupports larger firmware images and more complex state machines; no change in pin count or debug interfaceSelect when firmware size exceeds 2 KB or future scalability is required without PCB redesign
STM8L051F3P6ARM-based 8-bit core, 8 KB flash, 1 KB RAM, 12-bit ADC, ultra-low-power stop mode (300 nA), different instruction set and toolchainLower active and standby current; requires migration from HCS08 assembly/C to STM8 C toolchainSelect for new designs prioritizing lowest possible power consumption and longer battery life over legacy code reuse

Compared with MC9S08QA2CDNE, MC9S08QG4CDTE offers double flash/RAM in identical packaging for incremental firmware growth, while STM8L051F3P6 delivers significantly lower power and higher ADC resolution at the cost of architecture migration and toolchain requalification.

Availability

MC9S08QA2CDNE is available at Aetrix Electronics and suitable for smart sensor nodes, industrial thermostats, portable medical monitors, and IoT edge controllers requiring stable component supply and long-term manufacturability.

Supply support for MC9S08QA2CDNE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now headquartered in Eindhoven, Netherlands, with leadership in secure connectivity and embedded processing.

The MC9S08QA2CDNE belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, ultra-low-power embedded control applications where minimal pin count, integrated analog peripherals, and robust debug support are critical.

FAQ

What is the maximum operating frequency of the MC9S08QA2CDNE?

The MC9S08QA2CDNE supports a maximum bus frequency of 10 MHz when using its internal clock source (ICS) with FLL enabled. At 3.6 V supply and 25°C, it can achieve up to 20 MHz CPU operation - however, the documented maximum guaranteed bus frequency across full voltage (1.8–3.6 V) and temperature (–40°C to +85°C) ranges is 10 MHz per the MC9S08QA4RM reference manual covering the QA2 variant.

Does the MC9S08QA2CDNE support in-circuit debugging?

Yes, the MC9S08QA2CDNE supports single-wire background debug mode (BDM) via the PTA4/BKGD pin. This allows full in-circuit programming, breakpoint setting, register inspection, and memory read/write during development - all using only one dedicated debug signal, which simplifies board layout and reduces connector count compared to multi-wire JTAG interfaces.

What analog peripherals are integrated into the MC9S08QA2CDNE?

The MC9S08QA2CDNE integrates a 4-channel 10-bit ADC with internal temperature sensor (1.7 mV/°C), bandgap reference channel, and automatic compare function; an analog comparator (ACMP) with selectable interrupt edges and internal tie to TPM input capture; and dedicated analog power (VDDAD/VSSAD) and reference (VREFH/VREFL) pins - all operational down to 1.8 V and in stop3 mode.

Is the MC9S08QA2CDNE pin-compatible with other HCS08 devices?

The MC9S08QA2CDNE shares the same 8-pin SOIC pinout with MC9S08QA4CDNE and MC9S08QG4CDTE, including identical VDD/VSS placement, BKGD/RESET positions, and multi-function I/O assignments. However, differences in flash size and peripheral enablement require firmware validation - it is not a drop-in replacement for higher-memory variants without software review.

What low-power modes does the MC9S08QA2CDNE support?

The MC9S08QA2CDNE supports three stop modes (Stop1, Stop2, Stop3) and wait mode. Stop3 is the deepest low-power state, drawing sub-1 µA current while maintaining RTC operation using the internal 1 kHz clock source. All analog peripherals - ADC, ACMP, and TPM - retain functionality in Stop3, enabling event-driven wake-up without external components.

MC9S08QA2CDNE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
-
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
160 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QA2CDNE FAQ

1.How can I place an order for MC9S08QA2CDNE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QA2CDNE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QA2CDNE reliable?

The price and inventory of MC9S08QA2CDNE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QA2CDNE is usually 5 days.

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MC9S08QA2CDNE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QA2CDNE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QA2CDNE?

For technical support, including MC9S08QA2CDNE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QA2CDNE requirements.

6.How does Aetrix verify that MC9S08QA2CDNE is sourced from the original manufacturer or authorized distributors?

All MC9S08QA2CDNE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QA2CDNE meets industry standards.

7.What is the process for return or replacement of MC9S08QA2CDNE?

All MC9S08QA2CDNE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QA2CDNE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QA2CDNE part is unused and in its original packaging.

Return procedure for MC9S08QA2CDNE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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