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NXP Semiconductors MC9S08QA4CDNE

Part No.:
MC9S08QA4CDNE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixMC9S08QA4CDNE.pdf
Description:
IC MCU 8BIT 4KB FLASH 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,095

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Product details

Overview

MC9S08QA4CDNE from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller in an 8-pin DFN package, featuring 4 KB flash, 256 B RAM, 10-bit ADC with temperature sensor, analog comparator, TPM timer, and internal clock source with FLL. It operates from 1.8 V to 3.6 V at up to 20 MHz across –40°C to +85°C, targeting ultra-low-power embedded control in space-constrained applications.

For engineers reviewing the MC9S08QA4CDNE datasheet, MC9S08QA4CDNE pinout, MC9S08QA4CDNE application, or MC9S08QA4CDNE equivalent, key selection criteria include its 8-pin DFN footprint, stop3-mode operation with ADC/ACMP active, internal bandgap-referenced analog peripherals, and single-wire background debug interface for minimal debug footprint.

Technical Context

The MC9S08QA4CDNE implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and operating at bus frequencies from 1 MHz to 10 MHz via its internal clock source (ICS) with frequency-locked loop (FLL) and factory-trimmed internal reference (±2% deviation over voltage/temperature).

Its on-chip analog subsystem includes a 4-channel 10-bit ADC with automatic compare, internal 1.7 mV/°C temperature sensor, and bandgap reference channel - all functional in stop3 mode - alongside an analog comparator with edge-selectable interrupt and internal tie to TPM input capture.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with BGND instruction and 32 interrupt/reset vectors
Flash Memory4 KB flash with read/program/erase over full voltage (1.8–3.6 V) and temperature (–40°C to +85°C)
RAM256 B on-chip RAM with security lock to prevent unauthorized access
ADC4-channel, 10-bit resolution; includes internal temperature sensor (1.7 mV/°C) and bandgap reference channel; fully operational in stop3 mode
Internal ClockICS module with FLL; supports 1–10 MHz bus frequency; ±2% accuracy over voltage/temperature with 0.2% trimming resolution
Power ModesTwo very low-power stop modes (stop1/stop2/stop3); real-time counter active in run/wait/stop with internal clock sources
Debug InterfaceSingle-wire background debug (BDM) with one hardware breakpoint for in-circuit debugging

Pinout & Package

MC9S08QA4CDNE is housed in an 8-pin DFN (Dual Flat No-lead) package, 3 mm × 3 mm, 0.5 mm pitch, thermally enhanced with exposed pad. Pinout conforms to SOIC/DIP/DFN pin-compatible assignment per MC9S08QA4 datasheet.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltageMain digital/analog supply (1.8–3.6 V); decoupling required near pin
VSSGroundDigital and analog common ground reference
PTA0/AD0/ACMP0GPIO / ADC input / Comparator inputMulti-function pin supporting analog input (ADC channel 0), comparator input (ACMP0), and general-purpose I/O
PTA1/AD1/ACMP1GPIO / ADC input / Comparator inputMulti-function pin supporting analog input (ADC channel 1), comparator input (ACMP1), and general-purpose I/O
PTA2/AD2/TPM1CH0GPIO / ADC input / TPM input captureSupports ADC channel 2, TPM1 channel 0 input capture, and GPIO; ACMP output can be internally routed here
PTA3/AD3/KBI0GPIO / ADC input / Keyboard interruptADC channel 3 input, keyboard interrupt (KBI) pin 0, and configurable GPIO with software-selectable edge/level polarity
PTA4/BKGDBackground debugSingle-wire BDM interface for programming and debugging; also functions as general-purpose input-only pin when BDM disabled
PTA5/RESETReset inputActive-low reset input; internal pullup; resets MCU and clears status registers

Key Features

FeatureDesign Value
Stop3 Mode OperationEnables ADC, ACMP, and RTI to remain fully functional while CPU and most peripherals are halted - critical for battery-powered wake-on-event sensing
Integrated Temperature SensingOn-die 1.7 mV/°C sensor calibrated against internal bandgap reference eliminates need for external thermal components in ambient monitoring
Internal Clock Source (ICS)FLL-controlled ICS delivers stable 1–10 MHz bus clocks without external crystal, reducing BOM count and PCB area in cost-sensitive designs
Security CircuitryFlash and RAM protection prevents unauthorized read-out of firmware or sensitive data - essential for IP-protected embedded firmware
Single-Wire DebugBDM interface uses only PTA4 pin for full programming, erasing, and breakpoint debugging - preserves I/O count in pin-limited 8-pin layouts

Applications

Smart Sensor NodeLow-Power Industrial Monitor

Use Scenario: Battery-operated environmental sensor measuring temperature and analog signals in remote locations.

IC Role / Device Role / Timing Role: Primary controller executing sensor acquisition, local threshold comparison, and wake-on-event logic using ADC and ACMP in stop3 mode.

Use Value: Enables >5-year battery life via sub-μA stop3 current and autonomous analog event detection without CPU wake-up.

Use Scenario: DIN-rail mounted condition monitor tracking voltage, current, or vibration in industrial equipment.

IC Role / Device Role / Timing Role: Standalone measurement node performing periodic ADC sampling, real-time interrupt-driven timing, and watchdog-secured firmware execution.

Use Value: Delivers deterministic timing and fault resilience via COP watchdog, LVD reset, and illegal opcode detection in unattended deployments.

Consumer Appliance ControlMedical Wearable Interface

Use Scenario: Compact white-goods control (e.g., coffee maker, humidifier) requiring basic I/O, PWM fan control, and thermal feedback.

IC Role / Device Role / Timing Role: System manager handling user input (KBI), heater/fan PWM (TPM), and temperature regulation (ADC + ACMP).

Use Value: Integrates all required analog/digital functions in 8-pin DFN, eliminating external comparators, timers, and voltage references.

Use Scenario: Disposable or reusable wearable patch monitoring skin temperature and bio-signal thresholds.

IC Role / Device Role / Timing Role: Ultra-low-power signal conditioner and decision engine using internal temperature sensor and ACMP for local alarm triggering.

Use Value: Meets ISO 13485 design constraints with on-chip security, validated stop3 operation, and no external clock components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08QG4CDTE8-pin TSSOP package; identical core/peripherals but different pinout and no exposed thermal padPreferred where hand-soldering or legacy TSSOP footprint is required; lacks DFN thermal performanceSelect MC9S08QG4CDTE only if board layout mandates TSSOP or reflow compatibility with existing tooling
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+; 128 KB flash, 16 KB RAM, higher performance, larger 64-pin LQFP packageTargets scalable designs needing future firmware expansion, USB, or CAN - not pin-compatible or drop-inChoose S9KEAZ128AMLH when migrating beyond 4 KB flash or requiring ARM ecosystem support, not for direct replacement

Compared with MC9S08QA4CDNE, MC9S08QG4CDTE offers identical functionality in a different package with trade-offs in thermal dissipation and solderability, while S9KEAZ128AMLH provides architectural scalability at the cost of size, power, and toolchain migration - neither is pin-compatible nor functionally interchangeable without redesign.

Availability

MC9S08QA4CDNE is available at Aetrix Electronics and suitable for smart sensor nodes, low-power industrial monitors, and consumer appliance controls requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for MC9S08QA4CDNE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08QA4CDNE belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, space-constrained embedded control applications demanding ultra-low-power operation and integrated analog functionality.

FAQ

What is the maximum operating frequency of the MC9S08QA4CDNE?

The MC9S08QA4CDNE supports a maximum bus frequency of 10 MHz via its internal clock source (ICS) with frequency-locked loop (FLL). At 3.6 V supply, the HCS08 CPU core can execute instructions at up to 20 MHz, though actual throughput depends on bus frequency and instruction cycle count. This specification is verified across the full –40°C to +85°C temperature range and 1.8–3.6 V supply voltage.

Does the MC9S08QA4CDNE support analog-to-digital conversion in low-power modes?

Yes, the MC9S08QA4CDNE supports full ADC operation-including 4-channel sampling, automatic compare, and use of the internal temperature sensor-in stop3 mode. This capability enables wake-on-analog-event functionality with typical stop3 current below 1 μA, making it ideal for battery-powered sensing applications where continuous CPU operation is unnecessary.

What debug interface does the MC9S08QA4CDNE provide?

The MC9S08QA4CDNE features a single-wire background debug (BDM) interface accessible through the PTA4/BKGD pin. It supports in-circuit programming, erasing, and debugging with one hardware breakpoint. No external debug adapter is required beyond a compatible BDM pod, and the interface remains functional even when other I/O pins are repurposed, preserving design flexibility in the 8-pin DFN package.

Is the MC9S08QA4CDNE pin-compatible with other members of the QA-series?

Yes, the MC9S08QA4CDNE shares identical pin assignments with MC9S08QA2CDNE and MC9S08QG4CDTE within the same 8-pin DFN or TSSOP packages. However, differences in flash size (4 KB vs. 2 KB) and memory mapping require firmware validation; electrical and mechanical pin compatibility is confirmed per Freescale's MC9S08QA4 datasheet and pinout diagrams.

What protection features does the MC9S08QA4CDNE include for firmware security?

The MC9S08QA4CDNE integrates flash block protection and security circuitry that prevents unauthorized read-out of both flash and RAM contents. Once enabled, this lock disables background debug access and inhibits external attempts to extract firmware - a requirement for protecting proprietary algorithms in deployed devices. Configuration is controlled via FOPT and FPROT registers per the reference manual.

MC9S08QA4CDNE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
-
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QA4CDNE FAQ

1.How can I place an order for MC9S08QA4CDNE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QA4CDNE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QA4CDNE reliable?

The price and inventory of MC9S08QA4CDNE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QA4CDNE is usually 5 days.

3.What payment methods are accepted for MC9S08QA4CDNE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QA4CDNE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08QA4CDNE?

MC9S08QA4CDNE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QA4CDNE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QA4CDNE?

For technical support, including MC9S08QA4CDNE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QA4CDNE requirements.

6.How does Aetrix verify that MC9S08QA4CDNE is sourced from the original manufacturer or authorized distributors?

All MC9S08QA4CDNE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QA4CDNE meets industry standards.

7.What is the process for return or replacement of MC9S08QA4CDNE?

All MC9S08QA4CDNE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QA4CDNE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QA4CDNE part is unused and in its original packaging.

Return procedure for MC9S08QA4CDNE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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