NXP Semiconductors MC9S08QD2CSCR

Overview

MC9S08QD2CSCR from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller designed for cost-sensitive, low-power embedded control applications. It features a 16 MHz CPU, 2048 bytes of on-chip Flash, 128 bytes of RAM, and integrated peripherals including a 4-channel 10-bit ADC, two timer/PWM modules (TIM1 and TIM2), and a 4-pin keyboard interrupt module. It operates in industrial temperature range (–40 °C to 85 °C) and targets sensor interface and simple motor control systems.

For engineers reviewing the MC9S08QD2CSCR datasheet, MC9S08QD2CSCR pinout, MC9S08QD2CSCR application, or MC9S08QD2CSCR equivalent, key selection criteria include Flash/RAM size, ICS-based clock stability (±2% over voltage/temperature), single-wire BDM debug support, 8-pin SOIC packaging, and peripheral set alignment with legacy HCS08-based designs requiring minimal footprint and power.

Technical Context

The MC9S08QD2CSCR implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and background debugging via single-wire BDM interface. Its Internal Clock Source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference, enabling ±0.2% resolution and ±2% deviation across operating voltage and temperature.

Peripherals are tightly coupled to the CPU: the 10-bit ADC supports hardware triggering by RTI and includes internal bandgap reference and temperature sensor; TIM1 provides dual-channel PWM with edge- or center-aligned modes; TIM2 adds a third independent PWM channel; KBI enables configurable edge/level detection on four pins with software-selectable pullups.

Key Specifications

Pinout & Package

MC9S08QD2CSCR is housed in an 8-pin Small Outline Integrated Circuit (SOIC) package, RoHS-compliant, with 1.27 mm pitch and standard JEDEC MS-012AC dimensions. Pin functions are validated per MC9S08QD4 Series Data Sheet Rev. 7 (2022), Section 2.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08QD4CSCR and S9S08QD2ACSCR, the MC9S08QD2CSCR offers the lowest-cost, smallest-memory option in the QD2 family while retaining full peripheral functionality and debug capability - ideal for price-sensitive, thermally moderate embedded control where memory headroom is not required.

Availability

MC9S08QD2CSCR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart appliance control units, and low-cost motor starter modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MC9S08QD2CSCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08QD2CSCR belongs to NXP's legacy HCS08 microcontroller family, designed for cost-effective, low-power embedded control in space- and budget-constrained systems where simplicity, reliability, and toolchain maturity are prioritized over high performance.

FAQ

What is the maximum operating frequency of the MC9S08QD2CSCR?

The MC9S08QD2CSCR features an HCS08 CPU core with a maximum bus frequency of 16 MHz. This is achieved using the on-chip Internal Clock Source (ICS) with Frequency-Locked Loop (FLL), which derives the system clock from a trimmed internal reference - eliminating the need for an external crystal while maintaining ±2% accuracy across voltage and temperature ranges. The MC9S08QD2CSCR does not support external oscillator inputs beyond the optional 32 kHz LPO for COP watchdog.

Does the MC9S08QD2CSCR support in-system programming via its debug interface?

Yes, the MC9S08QD2CSCR supports full in-system programming and debugging through its single-wire Background Debug Mode (BDM) interface. Using standard BDM tools (e.g., P&E Multilink), users can erase, program, and verify Flash memory, set breakpoints, and inspect registers without removing the device from the target board. This capability is enabled by the on-chip debug module, which shares the BKGD/MS pin and requires no additional pins or hardware.

What are the power supply requirements for the MC9S08QD2CSCR?

The MC9S08QD2CSCR operates from a single supply rail of 2.7 V to 5.5 V, supporting both 3.3 V and 5 V system designs. It includes integrated low-voltage detection (LVD) with programmable trip points and reset/interrupt generation, ensuring reliable operation during brown-out conditions. The device draws less than 100 µA in Stop3 mode, making it suitable for battery-powered applications where ultra-low standby current is critical.

Can the MC9S08QD2CSCR ADC measure temperature directly?

Yes, the MC9S08QD2CSCR integrates a calibrated on-die temperature sensor accessible as a dedicated ADC channel. When enabled, this channel provides a voltage proportional to die temperature, referenced to the internal bandgap (1.25 V). The datasheet provides a linear equation (T°C = 0.64 × (ADCRH:ADCRL) – 320) for conversion, allowing accurate ambient or junction temperature monitoring without external sensors or signal conditioning.

Is the MC9S08QD2CSCR pin-compatible with other devices in the QD series?

Yes, the MC9S08QD2CSCR is pin-compatible with MC9S08QD4CSCR and S9S08QD2ACSCR in the 8-pin SOIC package. All share identical pin assignments, electrical characteristics, and peripheral register maps. This allows direct substitution within the same footprint - for example, upgrading to MC9S08QD4CSCR for more Flash or selecting S9S08QD2ACSCR for automotive qualification - without PCB redesign or firmware changes.