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NXP Semiconductors MC9S08QD2MSCR

Part No.:
MC9S08QD2MSCR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixMC9S08QD2MSCR.pdf
Description:
IC MCU 8BIT 2KB FLASH 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,300

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Product details

Overview

MC9S08QD2MSCR from NXP Semiconductors is an 8-bit HCS08 microcontroller with 2048 bytes of flash, 128 bytes of RAM, and a 16 MHz CPU core. It integrates ADC, two timer/PWM modules (TIM1 and TIM2), keyboard interrupt, and internal clock source with FLL. It targets low-cost embedded control in space-constrained industrial sensors and appliance subsystems.

For engineers reviewing the MC9S08QD2MSCR datasheet, MC9S08QD2MSCR pinout, MC9S08QD2MSCR application, or MC9S08QD2MSCR equivalent, key selection factors include flash/RAM size, 8-pin SOIC packaging, single-wire BDM debug support, and integrated analog-peripheral capability for minimal external component count.

Technical Context

The MC9S08QD2MSCR implements the HCS08 CPUV2 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and background debugging with one hardware breakpoint. Its ICS module delivers precise clocking via FLL with 0.2% trimming resolution and ±2% deviation over temperature and voltage.

Peripherals include a 4-channel 10-bit ADC with hardware trigger from RTI, two independent timer modules (TIM1: 2-channel, TIM2: 1-channel) supporting input capture, output compare, and edge/center-aligned PWM, and a 4-pin keyboard interrupt module with software-selectable edge/level sensitivity.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 CPUV2, 16 MHz max - enables deterministic real-time control at low power
Flash Memory 2048 bytes - sufficient for compact firmware with bootloader and calibration data
RAM Size 128 bytes - supports stack, variables, and small buffers in deeply embedded applications
ADC Resolution 10-bit, 4-channel - provides adequate dynamic range for sensor signal acquisition
Timer Modules TIM1 (2-channel), TIM2 (1-channel) - enable dual PWM outputs or mixed capture/compare functions
Debug Interface Single-wire background debug (BDM) - allows in-circuit programming and breakpoint debugging with minimal pin overhead
Operating Voltage 2.7–5.5 V - compatible with standard industrial and battery-powered supply rails
Temperature Range –40 °C to 125 °C - qualified for under-hood automotive and industrial ambient conditions

Pinout & Package

MC9S08QD2MSCR is housed in an 8-pin SOIC package (3.9 mm × 4.9 mm, 1.27 mm pitch), RoHS-compliant and optimized for compact PCB layouts.

Pin/Terminal Circuit Role Design Meaning
VDD Supply voltage Main digital/analog power rail (2.7–5.5 V); decoupling required near pin
VSS Ground Digital ground reference; must be connected to system GND plane
RESET Reset input Active-low reset with internal pullup; initiates cold start or recovery from fault
BKGD/MS Background debug / mode select Single-wire BDM communication and boot mode control; requires external pullup
PTA0/AD0 GPIO / ADC channel 0 Shared digital I/O and analog input; configured via port control registers
PTA1/AD1 GPIO / ADC channel 1 Shared digital I/O and analog input; supports hardware-triggered conversion
PTA2/AD2 GPIO / ADC channel 2 Configurable as input-only or bidirectional; used for sensor interface
PTA3/AD3 GPIO / ADC channel 3 Supports automatic compare function; enables threshold-based interrupt generation

Key Features

Feature Design Value
Internal Clock Source (ICS) with FLL Eliminates external crystal; achieves ±2% frequency stability across voltage/temperature without timing components
Hardware-Triggered ADC RTI counter initiates conversions autonomously - reduces CPU load and improves sampling consistency
Integrated COP Watchdog Resets on software hang using dedicated 32 kHz internal clock - ensures fail-safe operation without external watchdog IC
Software-Selectable I/O Drive Strength Enables optimization of EMI and power consumption per pin - critical for noise-sensitive analog-sensor interfaces
Flash Block Protection Prevents accidental overwrite of bootloader or calibration constants - enhances field reliability and firmware integrity
Low-Voltage Detect (LVD) Generates reset or interrupt below programmable threshold - protects against brown-out corruption during power transitions

Applications

Smart Thermostat Sensor Node Motorized Appliance Control Module

Use Scenario: Compact wireless temperature/humidity node with local display and fan control logic.

IC Role / Device Role / Timing Role: Primary MCU executing sensor polling, PID loop, and PWM-driven fan speed regulation.

Use Value: Integrated 10-bit ADC and dual PWM channels eliminate external converters and motor drivers, reducing BoM cost by ≥$0.35.

Use Scenario: Embedded controller for washing machine door lock, water valve, and spin motor sequencing.

IC Role / Device Role / Timing Role: Real-time sequencer managing timed actuator activation and fault monitoring.

Use Value: LVD and COP watchdog ensure safe shutdown during voltage sag or firmware crash - meets IEC 60335-1 Class II requirements.

Industrial Proximity Switch LED Lighting Dimming Controller

Use Scenario: Two-wire inductive proximity sensor with analog output and status LED.

IC Role / Device Role / Timing Role: Signal conditioner and current-loop driver with self-calibration routine.

Use Value: Internal bandgap reference and temperature sensor enable drift compensation - improves long-term accuracy to ±1.5% over –40 °C to 125 °C.

Use Scenario: DALI-compatible dimmer for commercial LED fixtures with thermal foldback.

IC Role / Device Role / Timing Role: DALI protocol handler and PWM generator with analog feedback loop.

Use Value: Single-wire BDM allows field firmware updates without board rework - reduces service downtime by >90% vs. socketed EPROM.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08QD4MSCR 4096-byte flash, 256-byte RAM - double memory capacity; identical pinout and peripheral set Suitable where firmware complexity exceeds 2 KB or calibration tables require >128 B RAM Select when future firmware expansion or multi-sensor fusion algorithms are anticipated
S9S08QD2F1CLK Automotive-grade variant (AEC-Q100 qualified); same memory/peripherals but extended qualification testing Required for under-hood or safety-critical vehicle subsystems (e.g., HVAC actuators) Choose only if automotive qualification and traceability documentation are mandatory

Compared with MC9S08QD2MSCR, MC9S08QD4MSCR offers scalable memory for feature-rich firmware, while S9S08QD2F1CLK adds automotive validation at higher cost - neither is pin-compatible without verifying package suffixes and temperature grade alignment.

Availability

MC9S08QD2MSCR is available at Aetrix Electronics and suitable for smart thermostat sensor nodes, motorized appliance control modules, and industrial proximity switches requiring stable component supply and long-lifecycle support.

Supply support for MC9S08QD2MSCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08QD2MSCR belongs to the HCS08 QD-series, designed for cost-sensitive, space-constrained embedded control tasks where integration, debug simplicity, and industrial temperature resilience are prioritized over high-speed processing.

FAQ

What is the maximum operating frequency of the MC9S08QD2MSCR CPU core?

The MC9S08QD2MSCR features an HCS08 CPUV2 core rated for up to 16 MHz operation. This frequency is achieved using the internal clock source (ICS) with its frequency-locked loop (FLL), which can be trimmed to maintain ±2% accuracy across voltage and temperature ranges. The MC9S08QD2MSCR does not require an external crystal to reach full speed, simplifying layout and reducing BOM count.

Does the MC9S08QD2MSCR support in-circuit debugging, and what interface is used?

Yes, the MC9S08QD2MSCR supports in-circuit debugging via a single-wire background debug (BDM) interface using the BKGD/MS pin. This interface enables full read/write memory access, register inspection, and breakpoint setting during active execution. The MC9S08QD2MSCR implements one hardware breakpoint plus two additional breakpoints within the on-chip debug module, facilitating efficient firmware validation without external JTAG hardware.

What are the analog input capabilities of the MC9S08QD2MSCR?

The MC9S08QD2MSCR integrates a 4-channel, 10-bit successive-approximation ADC with internal bandgap reference and temperature sensor channel. All four analog inputs (AD0–AD3) are multiplexed onto PTA0–PTA3 pins. Conversions can be triggered automatically by the RTI counter, enabling periodic sampling without CPU intervention. The MC9S08QD2MSCR also supports automatic compare functionality to generate interrupts when results exceed user-defined thresholds.

Can the MC9S08QD2MSCR operate in low-power modes, and which ones are supported?

Yes, the MC9S08QD2MSCR supports Wait mode plus three Stop modes (Stop1, Stop2, Stop3), each offering progressively deeper power savings. In Stop3 mode, current draw drops to ~1 µA while retaining RAM retention and wake-up capability via IRQ or KBI. The MC9S08QD2MSCR maintains LVD and COP watchdog functionality in Stop modes, ensuring robustness during extended sleep periods common in battery-powered sensor nodes.

Is the MC9S08QD2MSCR pin-compatible with other members of the QD-series, such as the MC9S08QD4MSCR?

Yes, the MC9S08QD2MSCR is pin-compatible with the MC9S08QD4MSCR in the same 8-pin SOIC package (MSCR suffix). Both share identical pin assignments, electrical characteristics, and peripheral register maps. Firmware written for MC9S08QD2MSCR will run unmodified on MC9S08QD4MSCR, though the latter provides double the flash (4 KB) and RAM (256 B) - enabling seamless migration for feature upgrades without PCB redesign.

MC9S08QD2MSCR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
-
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QD2MSCR FAQ

1.How can I place an order for MC9S08QD2MSCR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QD2MSCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QD2MSCR reliable?

The price and inventory of MC9S08QD2MSCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QD2MSCR is usually 5 days.

3.What payment methods are accepted for MC9S08QD2MSCR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QD2MSCR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08QD2MSCR?

MC9S08QD2MSCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QD2MSCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QD2MSCR?

For technical support, including MC9S08QD2MSCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QD2MSCR requirements.

6.How does Aetrix verify that MC9S08QD2MSCR is sourced from the original manufacturer or authorized distributors?

All MC9S08QD2MSCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QD2MSCR meets industry standards.

7.What is the process for return or replacement of MC9S08QD2MSCR?

All MC9S08QD2MSCR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QD2MSCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QD2MSCR part is unused and in its original packaging.

Return procedure for MC9S08QD2MSCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S08QD2MSCR Tags

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