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NXP Semiconductors MC9S08QD4MSC
- Part No.:
- MC9S08QD4MSC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
MC9S08QD4MSC.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,659
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Product details
Overview
MC9S08QD4MSC from NXP Semiconductors is an 8-bit HCS08 microcontroller with 16 MHz CPU, 4 KB Flash, 256 B RAM, and integrated ADC, dual timers (TIM1/TIM2), keyboard interrupt (KBI), and background debug interface. It operates across –40 °C to 125 °C and targets low-cost embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the MC9S08QD4MSC datasheet, MC9S08QD4MSC pinout, MC9S08QD4MSC application, or MC9S08QD4MSC equivalent, key selection criteria include its 8-pin SOIC package, single-wire BDM support, internal clock source with ±2% FLL accuracy, 4-channel 10-bit ADC with hardware trigger, and COP watchdog with dedicated 32 kHz clock option.
Technical Context
The MC9S08QD4MSC implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and active background debugging with three breakpoint registers. Its ICS module delivers system clock via frequency-locked loop (FLL) locked to an internal reference trimmed to ±0.2% resolution.
Peripherals include a 4-channel 10-bit ADC with automatic compare, temperature sensor, and bandgap reference; TIM1 (2-channel) and TIM2 (1-channel) PWM/timer modules supporting edge- and center-aligned modes; and a 4-pin KBI with software-selectable edge/level sensitivity and internal pullups.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 16 MHz max operation |
| Flash Memory | 4096 bytes - supports in-system programming over full voltage/temperature range |
| RAM Size | 256 bytes - sufficient for real-time control stacks and peripheral buffers |
| ADC | 4-channel, 10-bit with hardware trigger (RTI), internal bandgap reference, and temperature sensor |
| Timers | TIM1: 2-channel; TIM2: 1-channel - each supports input capture, output compare, and buffered PWM |
| Debug Interface | Single-wire background debug mode (BDM) - enables in-circuit debugging without dedicated JTAG pins |
| Operating Temp | –40 °C to +125 °C - qualified for under-hood automotive and industrial environments |
Pinout & Package
MC9S08QD4MSC is housed in an 8-pin SOIC package (3.9 mm × 4.9 mm, 1.27 mm pitch), RoHS-compliant and optimized for space-constrained PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage | Core and I/O power rail (2.7–5.5 V); decoupling required near pin |
| VSS | Ground | Digital ground reference; must be connected to system GND plane |
| RESET | Active-low reset input | Internal pullup ensures reliable startup; accepts external reset pulse or watchdog assertion |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and boot-mode control; requires 10 kΩ pullup |
| PTA0–PTA3 | General-purpose I/O | Four bidirectional pins with software-selectable pullups, slew rate, and drive strength (10 mA each) |
| PTA4 | Input-only | Dedicated IRQ input; internal pullup reduces external component count |
| PTA5 | Output-only | Fixed-function output; not configurable as input - used for specific peripheral signaling |
Key Features
| Feature | Design Value |
|---|---|
| Internal Clock Source (ICS) | FLL-based system clock with ±2% deviation over voltage/temperature and 0.2% trimming resolution - eliminates need for external crystal in cost-sensitive designs |
| Low-Voltage Detection | Configurable LVD reset or interrupt with programmable trip points - protects firmware integrity during brownout conditions |
| Flash Block Protection | Hardware-enforced write/erase lock on flash sectors - prevents accidental corruption of bootloader or calibration data |
| Keyboard Interrupt (KBI) | 4-pin interrupt module with polarity-selectable edge/level detection and internal pullups - simplifies mechanical switch interfacing without external resistors |
| Real-Time Interrupt (RTI) | Programmable periodic interrupt sourced from internal 1 kHz oscillator - enables deterministic timing for sensor sampling or state-machine ticks |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
Use Scenario: Control of power windows, locks, and mirror actuators in entry-level vehicle door modules. IC Role / Device Role / Timing Role: Primary MCU executing motor control logic, switch debouncing, and LIN bus message handling. Use Value: Integrated 10-bit ADC reads potentiometer position; TIM1 PWM drives H-bridge gate drivers; 125 °C rating ensures reliability near door latch mechanisms. | Use Scenario: Standalone ambient temperature monitoring node with analog sensor input and LED status indication. IC Role / Device Role / Timing Role: System controller acquiring temperature via internal ADC channel and driving discrete outputs. Use Value: On-chip temperature sensor and bandgap reference enable self-calibrated readings; low-power STOP modes extend battery life in wireless variants. |
| Smart Appliance Control Panel | LED Lighting Dimmer Module |
Use Scenario: Keypad-driven UI for microwave ovens or washing machines with tactile feedback and safety interlocks. IC Role / Device Role / Timing Role: Dedicated KBI processor scanning membrane switches and managing debounce timing. Use Value: 4-pin KBI with software-configurable edge/level sensitivity handles multiple switch types; internal pullups eliminate 4 external resistors per panel. | Use Scenario: Analog-dimmable LED driver for commercial lighting with smooth brightness control and thermal foldback. IC Role / Device Role / Timing Role: PWM generator synchronizing dimming waveform with zero-cross detection circuitry. Use Value: TIM2's buffered center-aligned PWM minimizes EMI; ADC monitors heatsink thermistor to throttle output at 85 °C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08QG4CDTE | Same HCS08 core, 4 KB Flash, but 16-pin TSSOP package and added SPI/I²C interfaces | Requires PCB redesign for larger footprint and additional signal routing | Select when serial communication or more I/O is needed; not drop-in compatible with MC9S08QD4MSC |
| S9S08QD4F1CLK | Automotive-grade variant (AEC-Q100 qualified), identical peripherals and pinout, but with extended qualification testing | Validated for automotive production use including vibration, ESD, and thermal cycling | Choose for Tier-1 automotive programs requiring formal qualification evidence; otherwise functionally interchangeable |
Compared with MC9S08QD4MSC, MC9S08QG4CDTE adds communication peripherals at the cost of board space, while S9S08QD4F1CLK provides identical functionality with AEC-Q100 validation-making it suitable for production automotive systems where qualification traceability is mandatory.
Availability
MC9S08QD4MSC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, appliance control panels, and LED dimmer modules requiring stable component supply and long-term manufacturability.
Supply support for MC9S08QD4MSC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MC9S08QD4MSC belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-pin-count embedded control applications demanding high reliability and minimal external components.
FAQ
What is the maximum operating frequency of the MC9S08QD4MSC?
The MC9S08QD4MSC features an HCS08 CPU core rated for up to 16 MHz operation. This frequency is achieved using the internal clock source (ICS) with frequency-locked loop (FLL) enabled and properly configured. The actual achievable bus frequency depends on ICS register settings and external loading, but the device is fully characterized and guaranteed to operate reliably at 16 MHz across its specified temperature and voltage range.
Does the MC9S08QD4MSC include an internal voltage reference for the ADC?
Yes, the MC9S08QD4MSC integrates an internal bandgap voltage reference channel accessible by the 10-bit ADC. This reference enables stable analog measurements independent of VDD fluctuations and eliminates the need for an external precision reference in many applications. The ADC also includes a dedicated temperature sensor channel calibrated for direct die-temperature estimation.
Can the MC9S08QD4MSC operate without an external crystal or resonator?
Yes, the MC9S08QD4MSC can operate entirely from its internal clock source (ICS) module, which uses a frequency-locked loop (FLL) locked to an internal reference trimmed to ±0.2% resolution. No external crystal or resonator is required for basic operation, making it ideal for cost-sensitive designs where board space and BOM count are critical constraints.
What debug interface does the MC9S08QD4MSC support?
The MC9S08QD4MSC supports a single-wire background debug interface (BDM), enabling in-circuit programming and real-time debugging through the BKGD/MS pin. This interface requires no dedicated debug header or additional pins beyond the standard 8-pin SOIC footprint, reducing system complexity and test point requirements during development and field service.
Is the MC9S08QD4MSC pin-compatible with other members of the QD4 series?
Yes, the MC9S08QD4MSC shares identical pinout and electrical characteristics with MC9S08QD4, S9S08QD4, and S9S08QD2 in the same 8-pin SOIC package. However, Flash size (4 KB vs. 2 KB), RAM (256 B vs. 128 B), and qualification level (industrial vs. automotive AEC-Q100) differ between variants - firmware and qualification must be verified per specific part number.
MC9S08QD4MSC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 16MHz
- Connectivity:
- -
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 4
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08QD4MSC FAQ
1.How can I place an order for MC9S08QD4MSC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08QD4MSC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08QD4MSC reliable?
The price and inventory of MC9S08QD4MSC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QD4MSC is usually 5 days.
3.What payment methods are accepted for MC9S08QD4MSC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QD4MSC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08QD4MSC?
MC9S08QD4MSC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08QD4MSC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08QD4MSC?
For technical support, including MC9S08QD4MSC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QD4MSC requirements.
6.How does Aetrix verify that MC9S08QD4MSC is sourced from the original manufacturer or authorized distributors?
All MC9S08QD4MSC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QD4MSC meets industry standards.
7.What is the process for return or replacement of MC9S08QD4MSC?
All MC9S08QD4MSC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QD4MSC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08QD4MSC part is unused and in its original packaging.
Return procedure for MC9S08QD4MSC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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