NXP Semiconductors MC9S08QE16CLD

Overview

MC9S08QE16CLD from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB flash, 1 KB RAM, and integrated peripherals including 12-bit ADC, dual analog comparators, two SCI modules, SPI, I²C, three TPM timer/PWM modules, RTC, and single-wire background debug interface. It operates from 1.8 V to 3.6 V and supports automotive-grade temperature range (–40 °C to +85 °C), targeting low-power embedded control in motor management and sensor interface applications.

For engineers reviewing the MC9S08QE16CLD datasheet, MC9S08QE16CLD pinout, MC9S08QE16CLD application, or MC9S08QE16CLD equivalent, key selection considerations include its 32-pin QFN package (5 mm × 5 mm), 50.33 MHz max CPU frequency at 3.6 V, stop3 mode wakeup time of 6 µs, on-chip voltage regulator, and support for LIN-compliant SCI with extended break generation.

Technical Context

The MC9S08QE16CLD implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and featuring a frequency-locked-loop (FLL)-based internal clock source (ICS) with 0.2% trimming resolution. Its power architecture includes two very low-power stop modes, reduced-power wait mode, and peripheral clock gating via PCE register.

Peripherals are tightly integrated: the 10-channel 12-bit ADC operates down to 1.8 V with temperature sensor and bandgap reference; dual ACMPs support routing to TPM inputs; SCI1/SCI2 provide LIN master/slave capability; and TPM3 offers six channels for edge- or center-aligned PWM - all functional in stop3 mode with external or low-power oscillator clocking.

Key Specifications

Pinout & Package

MC9S08QE16CLD uses a 32-pin QFN package (Case 1582, 5 mm × 5 mm) with exposed thermal pad and copper wire interconnect per Freescale QFN migration addendum (Rev. 0, 07/2014). Pinout matches the MC9S08QE32 series 32-pin variant, with shared functionality across port pins and alternate functions controlled by SOPT2 register settings.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08AC16CFGE, MC9S08QE16CLD adds RTC, dual SCI with LIN support, and smaller 32-pin footprint; versus S9KEAZ128AMLH, it offers lower cost and legacy toolchain continuity but less computational headroom and no ARM ecosystem alignment.

Availability

MC9S08QE16CLD is available at Aetrix Electronics and suitable for motor control interface, automotive body controller, and industrial sensor node applications requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.

Supply support for MC9S08QE16CLD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontrollers dating to the Motorola 6800 family.

The MC9S08QE16CLD belongs to the HCS08-based QE series designed specifically for cost-sensitive, low-power automotive and industrial control applications where robustness, LIN compliance, and small-footprint integration are critical.

FAQ

What is the maximum operating frequency of the MC9S08QE16CLD at 3.6 V?

The MC9S08QE16CLD achieves a maximum CPU frequency of 50.33 MHz when operating at 3.6 V across the full temperature range (–40 °C to +85 °C). This is enabled by its internal frequency-locked-loop (FLL) clock system, which uses either an external crystal (1–16 MHz) or internal reference for precise frequency synthesis. The MC9S08QE16CLD maintains this rating under validated thermal conditions with appropriate PCB thermal management.

Does the MC9S08QE16CLD support LIN communication?

Yes, the MC9S08QE16CLD supports LIN communication through its two SCI modules: SCI1 provides LIN master extended break generation, and SCI2 supports LIN slave extended break detection and wake-on-active-edge functionality. Both modules operate in all MCU modes including stop3, enabling low-power network participation. The MC9S08QE16CLD meets LIN 2.1 physical layer timing requirements when configured with appropriate baud rates and oscillator accuracy.

What package type and dimensions does the MC9S08QE16CLD use?

The MC9S08QE16CLD uses a 32-pin QFN package (Case 1582) measuring 5 mm × 5 mm with an exposed thermal pad. It employs copper wire bonding per Freescale's QFN migration addendum (Rev. 0, 07/2014), replacing earlier gold wire variants. The package is RoHS-compliant and rated for –40 °C to +85 °C operation, with thermal resistance (θJA) of 92 °C/W on single-layer boards and 33 °C/W on four-layer boards.

Can the MC9S08QE16CLD retain RAM contents during low-power modes?

Yes, the MC9S08QE16CLD retains RAM contents down to 0.6 V supply voltage (VRAM min = 0.6 V), enabling reliable data preservation during brownout or battery-sag conditions. In stop3 mode, RAM remains powered and accessible upon wakeup, with typical wakeup time of 6 µs from internal 1 kHz oscillator. The MC9S08QE16CLD's security circuitry prevents unauthorized access to retained RAM, preserving sensitive calibration or state data.

How many analog-to-digital converter (ADC) channels does the MC9S08QE16CLD have, and what is their resolution?

The MC9S08QE16CLD features a 10-channel, 12-bit successive-approximation ADC with 2.5 µs conversion time, fully operational from 3.6 V down to 1.8 V. It includes an internal temperature sensor (1.7 mV/°C), bandgap reference channel, and automatic compare function. All ADC channels remain functional in stop3 mode when clocked by the low-power oscillator, making the MC9S08QE16CLD suitable for periodic sensor sampling in ultra-low-power applications.