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NXP Semiconductors MC9S08QE32CLCR

Part No.:
MC9S08QE32CLCR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixMC9S08QE32CLCR.pdf
Description:
IC MCU 8BIT 32KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,000

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Product details

Overview

MC9S08QE32CLCR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB flash, 2 KB RAM, and integrated peripherals including 12-bit ADC, dual analog comparators, two SCI modules, I²C, SPI, three TPM timer/PWM modules, RTC, and single-wire background debug interface. It operates from 1.8 V to 3.6 V across –40 °C to +85 °C and targets low-power industrial control and sensor interface applications.

For engineers reviewing the MC9S08QE32CLCR datasheet, MC9S08QE32CLCR pinout, MC9S08QE32CLCR application, or MC9S08QE32CLCR equivalent, key selection considerations include its 32-pin QFN (5 mm × 5 mm) package, stop3 mode wakeup time of 6 µs, 12-bit ADC with temperature sensor, internal clock source supporting up to 50.33 MHz, and on-chip security circuitry for flash/RAM protection.

Technical Context

The MC9S08QE32CLCR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and operating at 50.33 MHz (at 3.6 V), 40 MHz (2.4–2.1 V), or 20 MHz (2.1–1.8 V). Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference enabling ±0.2% resolution and ±2% deviation over voltage and temperature.

System-level features include two very low-power stop modes, reduced-power wait mode, peripheral clock gating via PCE register, and a dedicated 1 kHz low-power oscillator for RTC operation in all modes. The device integrates hardware-based security circuitry to prevent unauthorized access to flash and RAM contents.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 8-bit CPU with BGND instruction and 32 interrupt/reset sources
Flash / RAM32 KB user flash with read/program/erase over full voltage/temperature range; 2 KB RAM with retention down to 0.6 V
ADC10-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, temperature sensor (1.7 mV/°C), functional in stop3 mode
Clock SourcesInternal ICS with FLL (4 kHz–50.33 MHz); external XOSCVLP (31.25 kHz–38.4 kHz or 1–16 MHz crystal/resonator)
Power ModesTwo very low-power stop modes, reduced-power wait mode, 6 µs typical wakeup from stop3, low-power 1 kHz RTC oscillator
I/O & Peripherals40 GPIOs (1 output-only, 1 input-only), two ACMPs, two SCIs, one I²C (100 kbps), one SPI, three TPM modules (TPM1: 3-ch, TPM2: 3-ch, TPM3: 6-ch), RTC
Supply Range1.8 V to 3.6 V operating voltage; absolute max VDD = 3.8 V; VLVDH = 2.11–2.27 V, VLVDL = 1.80–1.99 V

Pinout & Package

MC9S08QE32CLCR is packaged in a 32-pin QFN (Case 1582), 5 mm × 5 mm body, exposed pad, lead-free, RoHS-compliant. Pinout matches the 32-pin LQFP/QFN configuration shown in Figure 4 of Rev. 7 datasheet.

Pin/TerminalCircuit RoleDesign Meaning
VDDPrimary power supplyConnects to regulated 1.8–3.6 V supply; dual VDD pins (pins 4, 30) reduce IR drop and improve noise immunity
VSSGround referenceConnects to system ground; dual VSS pins (pins 5, 31) provide low-inductance return path
PTA4/BKGD/MSDebug interface / Mode selectSingle-wire background debug channel; bidirectional when configured as BKGD; used for programming and in-circuit debugging
PTA5/IRQ/TPM1CLK/RESETInterrupt / Clock input / ResetActive-low reset input with internal pullup; also serves as IRQ input and TPM1 clock source; bi-directional with open-drain output when RESET active
PTB0–PTB7Port B I/OMulti-function pins supporting RxD1/TxD1, MOSI/MISO/SPSCK/SS, TPM channels, KBI, and ADP inputs; configurable drive strength and slew rate
PTC0–PTC7Port C I/OSupports TPM3 channels, TxD2/RxD2, ACMP2 inputs/outputs, and ADP inputs; ACMP2+ and ACMP2– enable differential sensing
PTD0–PTD7Port D I/OKeyboard interrupt inputs (KBI2P0–P7); no alternate functions beyond KBI; supports selectable polarity interrupts
VREFH / VREFLAnalog referenceConnect to VDDAD/VREFH and VSSAD/VREFL respectively; define ADC full-scale range; internally tied to VDD/VSS on 28-pin packages only

Key Features

FeatureDesign Value
On-chip security circuitryPrevents unauthorized read/write access to flash and RAM contents, enabling firmware IP protection in deployed systems
Stop3 mode with 6 µs wakeupEnables ultra-low-power operation while retaining RAM and register state; rapid resumption supports responsive real-time event handling
Integrated 1.17 V bandgap referenceFactory-trimmed (±0.02 V) internal voltage reference used by ADC and ACMPs, eliminating need for external precision reference
Configurable I/O drive strengthPer-pin selection of high/low drive strength and slew rate optimizes EMI, signal integrity, and power consumption per peripheral interface
Dedicated low-power RTC oscillator1 kHz on-chip oscillator powers RTC independently of main clock, enabling calendar/time-of-day functions without external components or wake-up overhead

Applications

Industrial Sensor NodeSmart HVAC Controller

Use Scenario: Battery-powered wireless temperature/humidity node collecting data every 30 seconds and transmitting via UART-to-LoRa bridge.

IC Role / Device Role / Timing Role: Main controller managing ADC sampling, sensor calibration, low-power scheduling, and serial communication handoff.

Use Value: Stop3 mode with 6 µs wakeup and 1.8 V operation extends battery life; integrated temperature sensor (1.7 mV/°C) enables self-calibration without external IC.

Use Scenario: Wall-mounted thermostat with local display, relay control, and wired RS-485 communication to building management system.

IC Role / Device Role / Timing Role: System-on-chip managing UI polling, PWM fan speed control, relay timing, and SCI-based Modbus RTU protocol stack.

Use Value: Three independent TPM modules support simultaneous 3-channel PWM (fan), 2-channel capture (encoder), and 1-channel compare (relay debounce); dual SCI modules enable concurrent local UART and RS-485 interfaces.

Medical Patient Monitor ModuleAutomotive Body Control Unit Subsystem

Use Scenario: Portable pulse oximeter module acquiring analog photodiode signals, computing SpO₂, and driving OLED display via SPI.

IC Role / Device Role / Timing Role: Signal acquisition and processing unit performing analog front-end conditioning, ADC conversion, digital filtering, and display interface timing.

Use Value: 12-bit ADC with internal bandgap reference ensures consistent gain accuracy across voltage/temperature; ACMP1/ACMP2 support fast threshold detection for LED current control and saturation monitoring.

Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting using discrete FET drivers and LIN communication.

IC Role / Device Role / Timing Role: LIN slave node executing position feedback, PWM motor control, and diagnostic reporting under ISO 17987-4 compliance.

Use Value: SCI1 supports LIN master break generation and slave extended break detection; programmable low-voltage detection (VLVDL = 1.80–1.99 V) enables graceful shutdown during battery brownout conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9KEAZN32ACLHKinetis E-series ARM Cortex-M0+ core; 32 KB flash, 4 KB RAM; higher performance but larger code footprint and different toolchainRequires migration from HCS08 assembly/C to ARM GCC/Keil; lacks single-wire BDC but adds SWD debug; no native BGND instructionSelect for new designs needing >50 MHz throughput or RTOS compatibility; not drop-in compatible due to architecture and pinout differences
MC9S08AC128CLCRHCS08 core, 128 KB flash, 8 KB RAM, 48-pin QFN; identical peripheral set but larger memory and packageSame instruction set and debug interface; supports more complex firmware and additional I/O via 48-pin routing; higher thermal resistance (θJA = 92 °C/W vs. 32-pin)Select when firmware growth exceeds 32 KB or when additional GPIOs/ADC channels are required; pin-compatible only within same package family

Compared with S9KEAZN32ACLH, MC9S08QE32CLCR offers deterministic 8-bit real-time response and minimal memory overhead for legacy codebases, while MC9S08AC128CLCR provides direct architectural continuity with expanded resources-both require PCB redesign due to non-identical pinouts and thermal profiles.

Availability

MC9S08QE32CLCR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart HVAC controllers, medical patient monitor modules, and automotive body control subsystems requiring stable component supply, long-term lifecycle support, and qualified automotive-grade sourcing.

Supply support for MC9S08QE32CLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08QE32CLCR belongs to the HCS08-based QE series designed specifically for cost-sensitive, low-power embedded control applications where deterministic real-time behavior, small code size, and robust peripheral integration are critical.

FAQ

What is the maximum operating frequency of the MC9S08QE32CLCR and under what voltage conditions?

The MC9S08QE32CLCR achieves a maximum CPU frequency of 50.33 MHz at 3.6 V supply voltage, 40 MHz between 2.4 V and 2.1 V, and 20 MHz between 2.1 V and 1.8 V, all across the full temperature range of –40 °C to +85 °C. This voltage-dependent scaling is implemented in hardware and requires no software configuration.

Does the MC9S08QE32CLCR support in-system programming and debug via a single pin?

Yes, the MC9S08QE32CLCR supports single-wire background debug (BDC) through the PTA4/BKGD/MS pin, enabling full in-circuit programming, breakpoint setting, and real-time register inspection without requiring a dedicated JTAG interface. The on-chip debug module includes three comparators and nine trigger modes for advanced trace capabilities.

What are the key low-power features of the MC9S08QE32CLCR relevant to battery-operated devices?

The MC9S08QE32CLCR includes two very low-power stop modes, a reduced-power wait mode, and peripheral clock gating via the PCE register. Its stop3 mode retains RAM and register context with only 6 µs wakeup latency, and the integrated 1 kHz low-power oscillator enables RTC operation without external components-critical for extending battery life in intermittent-sampling applications.

Can the MC9S08QE32CLCR's ADC operate during low-power stop modes?

Yes, the 12-bit ADC in the MC9S08QE32CLCR remains fully functional in stop3 mode, allowing analog measurements to be triggered by external events or internal timers without exiting low-power state. It supports automatic compare, internal bandgap reference, and a built-in temperature sensor (1.7 mV/°C), enabling autonomous sensor monitoring with minimal energy overhead.

How does the MC9S08QE32CLCR handle low-voltage conditions to prevent erratic operation?

The MC9S08QE32CLCR integrates configurable low-voltage detection (LVD) and low-voltage warning (LVW) circuits with selectable trip points: VLVDH (2.11–2.27 V), VLVDL (1.80–1.99 V), and corresponding warning thresholds. These can generate interrupts or force reset, and hysteresis of 80 mV prevents oscillation near threshold-ensuring reliable brownout recovery in automotive and industrial environments.

MC9S08QE32CLCR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QE32CLCR FAQ

1.How can I place an order for MC9S08QE32CLCR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QE32CLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QE32CLCR reliable?

The price and inventory of MC9S08QE32CLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QE32CLCR is usually 5 days.

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MC9S08QE32CLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QE32CLCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QE32CLCR?

For technical support, including MC9S08QE32CLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QE32CLCR requirements.

6.How does Aetrix verify that MC9S08QE32CLCR is sourced from the original manufacturer or authorized distributors?

All MC9S08QE32CLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QE32CLCR meets industry standards.

7.What is the process for return or replacement of MC9S08QE32CLCR?

All MC9S08QE32CLCR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QE32CLCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QE32CLCR part is unused and in its original packaging.

Return procedure for MC9S08QE32CLCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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