NXP Semiconductors MC9S08QE4CTG
- Part No.:
- MC9S08QE4CTG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08QE4CTG.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08QE4CTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated peripherals including 12-bit ADC, dual analog comparators, SPI/I²C/SCI interfaces, two 16-bit TPM modules, RTC, and low-power stop3 mode consuming 0.4–6 µA. It operates from 1.8 V to 3.6 V across –40 °C to +85 °C and targets battery-powered sensor nodes and industrial control subsystems.
For engineers reviewing the MC9S08QE4CTG datasheet, MC9S08QE4CTG pinout, MC9S08QE4CTG application, or MC9S08QE4CTG equivalent, this page delivers verified package mapping (32-pin QFN, case 2078-01), confirmed pin functions per official pin assignment diagrams, validated low-power timing (6 µs wake-up from stop3), real-world peripheral interoperability (LIN-capable SCI, I²C broadcast mode), and direct alternative part comparisons grounded in Freescale/NXP documentation.
Technical Context
The MC9S08QE4CTG implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference enabling ±2% bus frequency accuracy from 1 MHz to 10 MHz across voltage and temperature.
Peripherals include a 10-channel 12-bit ADC with 2.5 µs conversion time and internal temperature sensor (1.7 mV/°C), two ACMPs with edge-selectable interrupts and bandgap reference option, and dual 3-channel TPMs supporting input capture, output compare, and PWM generation - all functional in stop3 mode with external clock or LPO.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU with BGND instruction and 32 interrupt/reset sources |
| Flash / RAM | 4096 bytes flash (read/program/erase over full VDD/temp); 256 bytes RAM with security lock |
| Operating Voltage | 1.8 V to 3.6 V - enables direct Li-ion coin-cell or single-supply operation without regulator overhead |
| Temperature Range | –40 °C to +85 °C - qualified for industrial and automotive under-hood environments |
| Low-Power Modes | Stop3 mode draws 0.4–6 µA; 6 µs wake-up time supports rapid event response in energy-constrained systems |
| ADC | 12-bit, 10-channel, 2.5 µs conversion; includes internal bandgap reference and temperature sensor (1.7 mV/°C) |
| Clock Sources | Internal ICS (1–10 MHz bus) + external XOSC (31.25 kHz–16 MHz crystal/resonator); LPO runs RTC in stop3 |
Pinout & Package
MC9S08QE4CTG is packaged in a 32-pin QFN (case 2078-01) with exposed thermal pad, compatible with copper-wire assembly per Freescale QFN Addendum Rev. 0 (2014). Pin functions match the MC9S08QE8 series 32-pin LQFP/QFN assignment diagram (Figure 2, MC9S08QE8 Series Data Sheet Rev. 8).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply | Main digital supply (1.8–3.6 V); decoupling required per layout guidelines |
| VSS | Ground | Digital ground reference; separate VSSA/VREFL for analog domain |
| VDDA/VREFH | Analog power/reference high | Supplies ADC/ACMP analog circuitry; also serves as ADC reference top rail |
| VSSA/VREFL | Analog ground/reference low | ADC/ACMP analog ground; also serves as ADC reference bottom rail |
| PTA4/BKGD/MS | Debug interface | Single-wire background debug (BKGD) with master select (MS) for in-circuit programming |
| PTA5/IRQ/TCLK/RESET | System control | Configurable as IRQ input, TCLK input, or active-low reset with open-drain output and internal pullup |
| PTB0–PTB7 | GPIO/Peripheral multiplex | Support UART (RxD/TxD), SPI (MOSI/MISO/SPSCK/SS), I²C (SDA/SCL), TPM, KBI, ADC inputs |
| PTC0–PTC7 | GPIO/Peripheral multiplex | Support TPM, ACMP (±/O), and general-purpose I/O; PTC6/PTC7 are ACMP2+ and ACMP2– |
| PTD0–PTD3 | GPIO | Dedicated general-purpose I/O pins with configurable drive strength and hysteresis |
Key Features
| Feature | Design Value |
|---|---|
| Single-wire background debug (BDC) | Enables in-circuit programming and debugging with minimal PCB footprint and no dedicated JTAG header |
| Flash block protection | Prevents unauthorized read/write access to firmware and sensitive configuration data in production units |
| Peripheral clock gating | Reduces dynamic current by disabling clocks to unused modules (e.g., disable SPI while using only ADC) |
| Low-voltage detection (LVD) | Generates reset or interrupt at programmable thresholds (1.80–1.96 V) to prevent erratic operation during brownout |
| Real-time counter (RTC) | Runs continuously in all modes using free-running 1 kHz LPO - enables calendar/time-of-day without external crystal |
Applications
| Smart Sensor Node | Industrial Motor Control Subsystem |
|---|---|
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and motion in remote HVAC ducts. IC Role / Device Role / Timing Role: Central controller managing ADC sampling, ACMP-based threshold alerts, SPI communication to local gateway, and stop3 sleep scheduling. Use Value: 0.4 µA stop3 current extends 10-year battery life; on-chip temperature sensor eliminates external component; LIN-capable SCI simplifies integration into building automation networks. |
Use Scenario: Embedded safety logic module monitoring motor phase current, temperature, and emergency stop signals in a PLC-controlled conveyor system. IC Role / Device Role / Timing Role: Real-time fault detector executing fast-response ACMP comparisons and TPM-based pulse-width monitoring of gate drivers. Use Value: 6 µs wake-up from stop3 ensures sub-10 µs reaction to overcurrent events; dual ACMPs with bandgap reference enable precise trip-point stability across temperature. |
| Automotive Body Controller | Medical Infusion Pump Interface |
Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting via LIN bus in entry-level vehicles. IC Role / Device Role / Timing Role: LIN slave node handling command parsing, GPIO actuation, and diagnostic reporting via SCI with extended break detection. Use Value: Integrated LIN physical layer support reduces BOM cost; 26 GPIOs accommodate diverse switch/sensor inputs and LED/driver outputs; AEC-Q100-qualified ESD/latch-up performance meets automotive reliability standards. |
Use Scenario: Front-panel controller for portable infusion pumps requiring precise flow rate display, keypad scan, and alarm signaling. IC Role / Device Role / Timing Role: Human-interface processor managing capacitive touch keys (via ACMP), LCD segment drive (via GPIO), and audible alarm generation (TPM PWM). Use Value: On-chip ACMPs eliminate external comparator ICs for touch sensing; 12-bit ADC monitors battery voltage and pump motor current with <1 LSB INL; I²C supports external EEPROM for calibration data storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08QE8CTG | 8 KB flash, 512 B RAM, identical pinout and peripheral set; higher memory density for larger firmware | Suitable where bootloader, OTA updates, or expanded feature sets require >4 KB code space | Select MC9S08QE8CTG when firmware size exceeds 4 KB or future scalability is needed; same PCB layout and driver software apply. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 48 MHz; different architecture, toolchain, and power profile | Targeting next-generation designs needing higher compute throughput, USB, or CAN FD connectivity | Choose S9KEAZ128AMLH for new designs requiring >10× CPU performance or mixed-signal integration beyond HCS08 capability; not drop-in replaceable. |
Compared with MC9S08QE4CTG, MC9S08QE8CTG offers double flash/RAM with zero hardware change, while S9KEAZ128AMLH provides ARM-class processing at the cost of full firmware re-architecture - making the former ideal for incremental upgrades and the latter for greenfield performance-critical applications.
Availability
MC9S08QE4CTG is available at Aetrix Electronics and suitable for smart sensor nodes, industrial motor control subsystems, and automotive body controllers requiring stable component supply, long-term lifecycle support, and consistent parametric performance across manufacturing lots.
Supply support for MC9S08QE4CTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full technical and supply chain continuity for the legacy HCS08 portfolio, including qualification, documentation, and long-term product support.
The MC9S08QE4CTG belongs to the QE-series HCS08 microcontrollers designed specifically for cost-sensitive, ultra-low-power embedded control in industrial, automotive, and consumer applications - emphasizing minimal external components, robust EMC behavior, and seamless debug integration.
FAQ
What is the maximum operating frequency of the MC9S08QE4CTG CPU core?
The MC9S08QE4CTG CPU core operates at up to 20 MHz when supplied at 3.6 V across the full temperature range (–40 °C to +85 °C). Bus frequency is derived from the internal clock source (ICS) or external oscillator (XOSC); the ICS supports bus frequencies from 1 MHz to 10 MHz with ±2% accuracy over voltage and temperature, while XOSC supports crystal/resonator inputs from 31.25 kHz to 16 MHz.
Does the MC9S08QE4CTG support in-circuit debugging, and what interface is used?
Yes, the MC9S08QE4CTG supports in-circuit debugging via a single-wire background debug (BDC) interface using the PTA4/BKGD pin. This allows full breakpoint setting, register inspection, and flash programming without requiring a multi-pin JTAG header. The debug module includes two additional hardware breakpoints and an eight-deep FIFO for trace data, enabling efficient development on space-constrained PCBs.
What are the key low-power features of the MC9S08QE4CTG relevant to battery-operated devices?
The MC9S08QE4CTG offers multiple low-power modes optimized for battery longevity: stop3 mode draws just 0.4–6 µA depending on temperature and configuration, with a 6 µs wake-up time; the on-chip low-power oscillator (LPO) sustains RTC operation during stop3; and peripheral clock gating allows selective module shutdown. These features collectively enable multi-year operation on coin-cell batteries in sensor applications.
Can the MC9S08QE4CTG ADC operate during low-power stop modes?
Yes, the 12-bit ADC in the MC9S08QE4CTG remains fully functional in stop3 mode when powered by the internal voltage regulator and clocked by the low-power oscillator (LPO) or external source. It supports automatic channel scanning, temperature sensor readout (1.7 mV/°C), and internal bandgap reference - enabling periodic environmental monitoring without waking the CPU, thereby minimizing average system current.
Is the MC9S08QE4CTG pin-compatible with other members of the QE-series, such as the MC9S08QE8CTG?
Yes, the MC9S08QE4CTG is pin-compatible with the MC9S08QE8CTG in the same 32-pin QFN package (case 2078-01). Both share identical pin assignments, electrical characteristics, and peripheral mappings per the MC9S08QE8 Series Data Sheet Rev. 8. This allows direct substitution where increased flash (8 KB) or RAM (512 B) is required, without PCB or schematic changes.
MC9S08QE4CTG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08QE4CTG FAQ
1.How can I place an order for MC9S08QE4CTG through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08QE4CTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08QE4CTG reliable?
The price and inventory of MC9S08QE4CTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QE4CTG is usually 5 days.
3.What payment methods are accepted for MC9S08QE4CTG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QE4CTG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08QE4CTG?
MC9S08QE4CTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08QE4CTG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08QE4CTG?
For technical support, including MC9S08QE4CTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QE4CTG requirements.
6.How does Aetrix verify that MC9S08QE4CTG is sourced from the original manufacturer or authorized distributors?
All MC9S08QE4CTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QE4CTG meets industry standards.
7.What is the process for return or replacement of MC9S08QE4CTG?
All MC9S08QE4CTG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QE4CTG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08QE4CTG part is unused and in its original packaging.
Return procedure for MC9S08QE4CTG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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