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NXP Semiconductors MC9S08QE4CTGR

Part No.:
MC9S08QE4CTGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08QE4CTGR.pdf
Description:
IC MCU 8BIT 4KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,750

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Product details

Overview

MC9S08QE4CTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, 20 MHz CPU operation at 1.8–3.6 V, integrated 12-bit ADC, dual analog comparators, and SPI/I²C/SCI peripherals - used in low-power industrial sensor nodes and automotive body electronics.

For engineers reviewing the MC9S08QE4CTGR datasheet, MC9S08QE4CTGR pinout, MC9S08QE4CTGR application, or MC9S08QE4CTGR equivalent, this page delivers verified package mapping (32-pin QFN), confirmed stop3-mode current (0.4–6 µA), real-time counter with 1 kHz LPO, single-wire background debug interface, and validated alternative part selection for cost-optimized 8-bit MCU replacement.

Technical Context

The MC9S08QE4CTGR implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) trimmed to ±0.2% resolution, enabling stable bus frequencies from 1 MHz to 10 MHz across voltage and temperature.

Power management includes Stop2 and Stop3 modes with sub-µA quiescent current, a dedicated 1 kHz low-power oscillator for RTC wake-up, and peripheral clock gating to disable unused modules. The ADC operates down to 1.8 V with 2.5 µs conversion time and includes a 1.7 mV/°C temperature sensor.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 8-bit core with BGND instruction and 32 interrupt/reset vectors
Flash / RAM 4096 bytes flash (read/program/erase over full voltage/temp); 256 bytes RAM
Operating Voltage 1.8 V to 3.6 V - enables direct Li-ion battery or 2xAA supply operation without regulator
Max Clock Speed 20 MHz at 3.6 V, -40°C to +85°C - supports real-time control loops with <50 ns instruction cycle
ADC 12-bit, 10-channel, 2.5 µs conversion - includes internal bandgap reference and temperature sensor
Low-Power Modes Stop3 mode draws 0.4–6 µA; 6 µs wake-up time - suitable for battery-powered wake-on-event systems
I/O Pins 26 GPIOs + 1 output-only + 1 input-only; configurable pull-ups, slew rate, and drive strength

Pinout & Package

MC9S08QE4CTGR is housed in a 32-pin QFN package (case number 2078-01, copper-wire bonded per QFN_Addendum Rev. 0), with 5 mm × 5 mm footprint, 0.5 mm pitch, and exposed thermal pad.

Pin/Terminal Circuit Role Design Meaning
VDD Core power supply Primary 1.8–3.6 V supply for digital logic and I/O; decoupling required near pin
VSS Digital ground Reference return path for all digital circuitry; must be connected to PCB ground plane
VDDA/VREFH Analog power / ADC reference high Separate analog supply pin; ties to VDD by default but may be isolated for noise-sensitive ADC use
VSSA/VREFL Analog ground / ADC reference low Independent analog ground; recommended to route separately from digital ground and tie at single point
PTA5/IRQ/TCLK/RESET Multi-function pin Configurable as active-low reset input (open-drain with internal pull-up) or IRQ/TCLK signal
PTA4/ACMP1O/BKGD/MS Debug & analog output Single-wire background debug (BKGD) interface; also outputs ACMP1 comparator result
PTB0–PTB7 Port B I/O Includes RxD/TxD (SCI), MOSI/MISO/SPSCK (SPI), SDA/SCL (I²C), TPM channels, and KBI inputs
PTC0–PTC7 Port C I/O Hosts ACMP2 inputs/outputs, TPM2CH2, and general-purpose digital I/O with hysteresis
PTD0–PTD3 Port D I/O Four general-purpose pins with configurable pull-up/pull-down and drive strength

Key Features

Feature Design Value
Single-wire background debug (BDC) Enables in-circuit programming and debugging using only BKGD pin - reduces test fixture complexity
Flash block protection Prevents unauthorized read/write access to flash and RAM - meets basic firmware security requirements
Low-voltage detection (LVD) Configurable reset or interrupt at 1.80–1.96 V threshold - protects against brown-out data corruption
Real-time counter (RTC) 8-bit modulus counter with binary/decimal prescaler; runs on 1 kHz LPO in all modes - enables calendar/time-of-day without external crystal
Peripheral clock gating Software-controlled register disables clocks to idle modules - reduces dynamic current by >30% in partial-active states

Applications

Automotive Body Control Module Industrial Temperature Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level vehicles.

IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing PWM-driven motor drivers, and sampling analog sensor inputs.

Use Value: Integrated LIN-compliant SCI, 12-bit ADC with temperature sensor, and sub-µA Stop3 mode extend battery life during vehicle sleep cycles.

Use Scenario: Wireless-capable environmental monitor deployed in HVAC ducts or factory machinery enclosures.

IC Role / Device Role / Timing Role: Signal acquisition engine acquiring thermistor/RTD readings, performing local calibration, and triggering RF wake-up via GPIO.

Use Value: 1.7 mV/°C on-chip temperature sensor enables self-calibration; 6 µs Stop3 wake-up ensures rapid response to thermal anomalies.

Smart Appliance Power Management Medical Disposable Device Controller

Use Scenario: Energy-efficient control unit in cordless vacuum cleaners or robotic mops managing battery charge state and motor commutation.

IC Role / Device Role / Timing Role: Real-time supervisor monitoring cell voltage, temperature, and load current while coordinating motor driver enable signals.

Use Value: Dual analog comparators (ACMP1/ACMP2) provide fast overvoltage/overcurrent trip detection independent of CPU execution.

Use Scenario: Single-use diagnostic patch measuring skin temperature and transmitting alerts via BLE when thresholds are exceeded.

IC Role / Device Role / Timing Role: Ultra-low-power system controller acquiring analog biometric data and managing BLE subsystem wake timing.

Use Value: 0.4 µA typical Stop3 current and 1 kHz LPO-backed RTC allow multi-week operation on coin-cell batteries without external timing components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08QG8CDTE 1 KB flash, 128 B RAM, 8-pin SOIC - lacks ADC, RTC, and I²C; no BKGD debug Suitable only for simple GPIO/state-machine tasks; not viable for sensor acquisition or communication Select only if design requires minimal footprint and zero analog/peripheral needs
S9KEAZ128AMLH ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 48 MHz - higher performance, larger memory, different toolchain Requires migration from HCS08 assembly/C to ARM GCC/Keil; supports USB, CAN, more advanced peripherals Choose for future-proofing or when scaling beyond 4 KB flash; not drop-in compatible

Compared with MC9S08QE4CTGR, MC9S08QG8CDTE sacrifices all analog and communication capability for size reduction, while S9KEAZ128AMLH offers architectural upgrade at cost of software rework and higher BOM cost - making MC9S08QE4CTGR optimal for legacy-compatible, mixed-signal 8-bit control.

Availability

MC9S08QE4CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance power management, and medical disposable device controllers requiring stable component supply across extended temperature ranges.

Supply support for MC9S08QE4CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, energy-efficient, and scalable solutions for automotive, industrial, IoT, and mobile applications.

The MC9S08QE4CTGR belongs to the HCS08-based QE series designed specifically for cost-sensitive, low-power embedded control in harsh environments - emphasizing robustness, analog integration, and debug simplicity.

FAQ

What is the maximum operating frequency of the MC9S08QE4CTGR?

The MC9S08QE4CTGR supports up to 20 MHz CPU operation at 3.6 V across the full –40°C to +85°C temperature range. At lower supply voltages (e.g., 1.8 V), the maximum safe frequency is reduced per the internal FLL lock range and voltage-dependent timing margins specified in the datasheet's AC characteristics section.

Does the MC9S08QE4CTGR include an integrated temperature sensor?

Yes, the MC9S08QE4CTGR integrates a calibrated 1.7 mV/°C temperature sensor accessible via the ADC's dedicated channel. This sensor operates across the full –40°C to +85°C range and functions in Stop3 mode, enabling accurate thermal monitoring without external components.

What debug interface does the MC9S08QE4CTGR support?

The MC9S08QE4CTGR supports a single-wire background debug (BKGD) interface on PTA4, enabling in-circuit programming, breakpoint setting, and real-time register inspection using standard Freescale/NXP BDM tools - no JTAG header or additional pins required.

Can the MC9S08QE4CTGR operate from a 2-cell alkaline battery?

Yes, the MC9S08QE4CTGR operates from 1.8 V to 3.6 V, matching the discharge curve of two alkaline AA/AAA cells (3.2 V fresh → ~1.9 V end-of-life). Its low-voltage detection (LVD) circuit triggers reset below 1.80 V, preventing unreliable operation during battery depletion.

Is the MC9S08QE4CTGR pin-compatible with other QE-series MCUs?

No - the MC9S08QE4CTGR shares the same 32-pin QFN package and core peripheral set with MC9S08QE8, but differs in flash/RAM size and some pin multiplexing defaults. Pin assignments match the QE8 family in 32-pin variants, but software initialization must account for memory map and module enable differences.

MC9S08QE4CTGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
12
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QE4CTGR FAQ

1.How can I place an order for MC9S08QE4CTGR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QE4CTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QE4CTGR reliable?

The price and inventory of MC9S08QE4CTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QE4CTGR is usually 5 days.

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MC9S08QE4CTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QE4CTGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QE4CTGR?

For technical support, including MC9S08QE4CTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QE4CTGR requirements.

6.How does Aetrix verify that MC9S08QE4CTGR is sourced from the original manufacturer or authorized distributors?

All MC9S08QE4CTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QE4CTGR meets industry standards.

7.What is the process for return or replacement of MC9S08QE4CTGR?

All MC9S08QE4CTGR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QE4CTGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QE4CTGR part is unused and in its original packaging.

Return procedure for MC9S08QE4CTGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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