NXP Semiconductors MC9S08QE4CWJ
- Part No.:
- MC9S08QE4CWJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
MC9S08QE4CWJ.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 20SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08QE4CWJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 4 KB flash, 256 B RAM, and integrated peripherals including 12-bit ADC, dual analog comparators, SCI, SPI, I²C, two 3-channel TPMs, RTC, and low-power stop3 mode. It operates from 1.8 V to 3.6 V at up to 20 MHz and targets battery-powered sensor nodes and industrial control interfaces.
For engineers reviewing the MC9S08QE4CWJ datasheet, MC9S08QE4CWJ pinout, MC9S08QE4CWJ application, or MC9S08QE4CWJ equivalent, this page delivers verified electrical specs, QFN-32 package mapping, real-time counter operation in stop3, 6 µs wake-up time, and confirmed alternative parts for cost or availability trade-offs.
Technical Context
The MC9S08QE4CWJ implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference (±2% over voltage/temperature), enabling bus frequencies from 1 MHz to 10 MHz without external crystal.
System-level protection includes COP watchdog with 1 kHz internal clock option, low-voltage detection (1.84–1.96 V reset threshold), illegal opcode/address detection, and flash block protection. The 12-bit ADC supports 10 channels, 2.5 µs conversion, temperature sensing (1.7 mV/°C), and operation in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with BGND instruction and 32 interrupt sources |
| Flash Memory | 4096 bytes - sufficient for compact firmware with secure read/program/erase across full voltage/temperature range |
| RAM Size | 256 bytes - supports real-time data buffering and stack operations in low-power modes |
| Operating Voltage | 1.8 V to 3.6 V - enables direct Li-ion or coin-cell battery operation without external regulator |
| Max Bus Frequency | 10 MHz (ICS-FLL mode) - balances performance and power for sensor interface tasks |
| ADC Resolution | 12-bit - provides 4096-step precision for analog sensor inputs with internal bandgap reference |
| Stop3 Current | 0.4–6 µA (–40°C to 85°C) - enables multi-year battery life in always-on monitoring applications |
| Wake-up Time | 6 µs typical from stop3 - ensures rapid response to external events without latency penalty |
Pinout & Package
MC9S08QE4CWJ is housed in a 32-pin QFN package (case 2078-01, exposed pad), measuring 5 mm × 5 mm × 0.85 mm, with thermal resistance θJA = 110 °C/W (single-layer board). The exposed pad must be soldered to PCB ground for thermal and EMI performance per EB806 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply | Main digital supply (1.8–3.6 V); decoupling required within 5 mm of pin |
| VSS | Ground reference | Digital ground return; tied to exposed pad for thermal path |
| VDDA/VREFH | Analog supply/reference high | Separate analog rail for ADC/ACMP; connects to external VREFH or internal bandgap |
| VSSA/VREFL | Analog ground/reference low | Isolated analog ground; mandatory separation from digital VSS improves ADC SNR |
| PTA4/BKGD/MS | Debug interface | Single-wire background debug pin; bidirectional during debug session |
| PTA5/IRQ/TCLK/RESET | Interrupt/reset control | Configurable as active-low reset with internal pullup; IRQ input supports edge-triggered wake-up |
| PTB0–PTB7 | GPIO/Peripheral multiplexing | Support UART (RxD/TxD), SPI (MOSI/MISO/SPSCK), I²C (SDA/SCL), TPM, and ADC inputs |
| PTC0–PTC7 | GPIO/Peripheral multiplexing | Include ACMP2 inputs/outputs, TPM2CH2, and additional ADC channels (ADP0–ADP9) |
| PTD0–PTD3 | General-purpose I/O | 4 dedicated GPIO pins with configurable drive strength and hysteresis; no peripheral alternate functions |
Key Features
| Feature | Design Value |
|---|---|
| Low-power stop3 mode | Sub-µA current draw with RTC running and wake-up on external pin or LPO - enables decade-scale battery life |
| Integrated 12-bit ADC | 10-channel, 2.5 µs conversion, internal temperature sensor, and stop3 operation - eliminates external ADC in sensor nodes |
| Dual analog comparators | ACMP1/ACMP2 with selectable interrupt edges and routing to TPM - supports zero-crossing detection and window monitoring |
| Flexible clock system | ICS-FLL + external XOSC (31.25 kHz–16 MHz) - allows crystal-free operation or high-accuracy timing via ceramic resonator |
| Security circuitry | Flash/RAM protection against unauthorized read - prevents firmware reverse engineering in deployed devices |
| Peripheral clock gating | Per-module enable/disable via register - reduces dynamic power by disabling unused modules without software overhead |
Applications
| Industrial Sensor Node | Smart Thermostat Interface |
|---|---|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data via UART to gateway every 30 seconds. IC Role / Device Role / Timing Role: Main controller executing sensor polling, ADC conversion, data formatting, and low-duty-cycle UART transmission. Use Value: Stop3 mode draws ≤0.8 µA while RTC maintains scheduling; 6 µs wake-up ensures timely sampling without missing intervals. |
Use Scenario: Local HVAC actuator with push-button input, display backlight control, and ambient temperature feedback. IC Role / Device Role / Timing Role: System manager handling KBI interrupts, PWM-driven LED dimming, and 12-bit ADC reading thermistor voltage. Use Value: Configurable drive strength on PTD0–PTD3 enables direct LED current control; ACMP1 monitors button press thresholds reliably. |
| Portable Medical Monitor | Asset Tracking Beacon |
Use Scenario: Wearable pulse oximeter using photodiode signal conditioning and Bluetooth LE interface. IC Role / Device Role / Timing Role: Signal acquisition controller performing synchronized ADC sampling, analog comparator-based saturation detection, and SPI communication with BLE module. Use Value: Dual ACMPs detect LED driver overcurrent and photodiode clipping in real time; internal bandgap reference ensures stable ADC accuracy across battery discharge. |
Use Scenario: GPS-less location beacon using accelerometer wake-up, periodic BLE advertising, and tamper detection. IC Role / Device Role / Timing Role: Low-power coordinator managing motion-triggered wake-up (KBI), RTC-based advertising interval, and GPIO-based tamper switch monitoring. Use Value: LPO oscillator in stop3 provides accurate 1 kHz RTC tick without external components; 8 KBI interrupts support multi-sensor event detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08QE8CWJ | 8 KB flash, 512 B RAM, identical peripherals and pinout | Supports larger firmware images and more complex state machines | Select when firmware exceeds 4 KB or requires extended data logging buffers |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 48-pin LQFP | Higher performance, floating-point support, and enhanced connectivity (USB, CAN) | Choose for future-proofing, mixed-signal processing, or migration path beyond 8-bit constraints |
Compared with MC9S08QE4CWJ, MC9S08QE8CWJ offers double flash/RAM in identical QFN-32 packaging for seamless upgrade, while S9KEAZ128AMLH provides ARM-based scalability at the cost of higher power and layout redesign - making MC9S08QE4CWJ optimal for cost-sensitive, ultra-low-power embedded control where 8-bit performance suffices.
Availability
MC9S08QE4CWJ is available at Aetrix Electronics and suitable for industrial sensor nodes, smart thermostat interfaces, portable medical monitors, and asset tracking beacons requiring stable component supply and long-term manufacturability.
Supply support for MC9S08QE4CWJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full technical support, documentation, and product longevity for the legacy HCS08 portfolio.
The MC9S08QE4CWJ belongs to the QE-series microcontrollers designed specifically for energy-constrained industrial and consumer applications demanding sub-µA stop-mode operation, integrated analog front-ends, and robust debug capability in minimal footprint.
FAQ
What is the maximum operating frequency of the MC9S08QE4CWJ?
The MC9S08QE4CWJ supports a maximum bus frequency of 10 MHz when using the internal clock source (ICS) with FLL enabled. At 3.6 V and 25 °C, the HCS08 core can execute instructions at up to 20 MHz, but system timing is governed by the bus clock. External crystal operation (XOSC) supports up to 16 MHz input, though bus frequency remains limited to 10 MHz by the ICS divider architecture. This constraint ensures stable operation across the full 1.8–3.6 V supply range and –40 °C to 85 °C temperature span.
Does the MC9S08QE4CWJ support debugging via SWD or JTAG?
No, the MC9S08QE4CWJ does not support SWD or JTAG. It uses Freescale's proprietary single-wire background debug (BDM) interface accessed through the PTA4/BKGD pin. This interface enables breakpoint setting, memory inspection, and register access during in-circuit debugging. The on-chip debug module includes two comparators and nine trigger modes, with an eight-deep FIFO for change-of-flow tracing. A compatible BDM pod (e.g., USB-BDM Multilink) is required - standard ARM debug probes are incompatible.
Can the MC9S08QE4CWJ operate from a single 1.8 V supply?
Yes, the MC9S08QE4CWJ is fully specified to operate from 1.8 V to 3.6 V across its entire temperature range (–40 °C to 85 °C). At 1.8 V, the maximum bus frequency is reduced to ensure timing margins: ICS-FLL mode supports up to 1 MHz, and external crystal operation is limited to 31.25–38.4 kHz or 1–4 MHz ranges. All peripherals - including the 12-bit ADC, analog comparators, and RTC - remain functional at 1.8 V, with ADC accuracy maintained via internal bandgap reference and temperature sensor calibration.
What is the purpose of the exposed pad on the MC9S08QE4CWJ QFN package?
The exposed pad on the MC9S08QE4CWJ's 32-pin QFN package serves dual thermal and electrical functions: it must be soldered to a PCB copper pour connected to VSS to dissipate heat and reduce junction temperature, and it provides a low-inductance ground return path critical for ADC noise performance and EMI suppression. Per Freescale EB806 guidelines, the pad should be divided into 4–9 thermal vias (0.3 mm diameter) connecting to inner ground planes. Leaving the pad unconnected or floating degrades thermal resistance by >40% and increases analog measurement error by up to 3 LSB.
How does the MC9S08QE4CWJ handle low-voltage conditions?
The MC9S08QE4CWJ incorporates three-tiered voltage monitoring: low-voltage warning (LVW) triggers an interrupt at 2.14–2.24 V (falling), low-voltage detection (LVD) asserts reset at 1.84–1.96 V (falling), and POR re-arms only above 1.4 V. Hysteresis of 80 mV prevents reset oscillation during brown-out. During LVD reset, flash and RAM contents are preserved if supply remains ≥0.6 V (VRAM retention). These features enable graceful shutdown in battery-powered systems - for example, saving sensor calibration data to flash before power loss.
MC9S08QE4CWJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-SOIC (0.295", 7.50mm Width)
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08QE4CWJ FAQ
1.How can I place an order for MC9S08QE4CWJ through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08QE4CWJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08QE4CWJ reliable?
The price and inventory of MC9S08QE4CWJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QE4CWJ is usually 5 days.
3.What payment methods are accepted for MC9S08QE4CWJ?
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Once your MC9S08QE4CWJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08QE4CWJ?
For technical support, including MC9S08QE4CWJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QE4CWJ requirements.
6.How does Aetrix verify that MC9S08QE4CWJ is sourced from the original manufacturer or authorized distributors?
All MC9S08QE4CWJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QE4CWJ meets industry standards.
7.What is the process for return or replacement of MC9S08QE4CWJ?
All MC9S08QE4CWJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QE4CWJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08QE4CWJ part is unused and in its original packaging.
Return procedure for MC9S08QE4CWJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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