NXP Semiconductors MC9S08QE64CLC

Overview

MC9S08QE64CLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 64 KB flash, 4 KB RAM, and 48-pin QFN package. It features a 50.33-MHz CPU (at ≥2.4 V), dual analog comparators, 24-channel 12-bit ADC, two I²C, two SPI, two SCI/LIN interfaces, six-channel TPM, RTC, and single-wire background debug. It targets low-power industrial sensor nodes and motor control subsystems.

For engineers reviewing the MC9S08QE64CLC datasheet, MC9S08QE64CLC pinout, MC9S08QE64CLC application, or MC9S08QE64CLC equivalent, key selection criteria include its 48-pin QFN thermal performance (θJA = 81°C/W on single-layer board), stop-mode wake-up time (6 μs), 1.8–3.6 V operating range, and integrated ACMP/ADC/TPM peripherals for embedded real-time control.

Technical Context

The MC9S08QE64CLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses FLL with factory-trimmed internal reference (0.2% resolution, ±2% deviation) to generate CPU frequencies from 2 MHz to 50.33 MHz.

System-level timing relies on multiple synchronized clock domains: external crystal/ceramic oscillator (31.25 kHz–16 MHz), ICS-controlled bus clock, and dedicated 1-kHz COP clock. Peripheral modules-including TPM, ADC, and SCI-are individually clock-gated via peripheral clock enable register to minimize active current in partial-stop modes.

Key Specifications

Pinout & Package

MC9S08QE64CLC is housed in a 48-pin QFN package (case 1314, 7 mm² footprint) with exposed thermal pad. The package uses copper wire bonding per Freescale QFN migration addendum Rev. 0 (2014).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MC9S08AC60CFUE, MC9S08QE64CLC adds RTC and ACMP2 for time-critical and dual-threshold safety functions; versus S9KEAZN64ACLH, it delivers lower system-level cost and deterministic LIN timing without software overhead.

Availability

MC9S08QE64CLC is available at Aetrix Electronics and suitable for industrial sensor nodes, motor control subsystems, automotive body controllers, and smart power outlets requiring stable component supply across extended temperature ranges (–40°C to +85°C).

Supply support for MC9S08QE64CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08QE64CLC belongs to the HCS08-based QE series designed for energy-efficient, cost-sensitive embedded control applications requiring mixed-signal integration, low-voltage operation, and robust debug capability.

FAQ

What is the maximum operating frequency of the MC9S08QE64CLC under 2.4 V supply?

The MC9S08QE64CLC achieves a maximum CPU frequency of 50.33 MHz when operated at VDD ≥ 2.4 V across the full temperature range (–40°C to +85°C). At lower supply voltages-2.1 V and 1.8 V-the maximum frequencies reduce to 40 MHz and 20 MHz respectively, as specified in the MC9S08QE128 Series Data Sheet Rev. 7.

Does the MC9S08QE64CLC support LIN communication natively?

Yes, the MC9S08QE64CLC supports LIN communication natively through its two SCI modules, which implement LIN master extended break generation and LIN slave extended break detection per ISO 9141-2 and LIN 2.x specifications. This enables direct connection to standard LIN transceivers without additional protocol translation logic.

How many analog comparator channels does the MC9S08QE64CLC include?

The MC9S08QE64CLC includes two independent analog comparators (ACMP1 and ACMP2), each with selectable interrupt on rising, falling, or both edges. ACMP outputs can be routed to TPM modules for hardware-triggered actions, and either comparator may reference the internal 1.17 V bandgap voltage.

What package type and thermal resistance does the MC9S08QE64CLC use?

The MC9S08QE64CLC uses a 48-pin QFN package (case 1314, 7 mm²) with copper wire bonding. Its thermal resistance is θJA = 81°C/W on a single-layer PCB and 26°C/W on a four-layer board, enabling reliable operation in thermally constrained industrial enclosures without forced airflow.

Can the MC9S08QE64CLC retain RAM contents during low-power stop modes?

Yes, the MC9S08QE64CLC retains RAM contents during all stop modes when supply voltage remains above VRAM = 0.6 V (minimum). Its RAM retention voltage specification (0.6–1.0 V) ensures data integrity during brownout conditions or capacitor-backed power-down sequences common in battery-powered systems.