NXP Semiconductors MC9S08QE8CLC

Overview

MC9S08QE8CLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 B RAM, and integrated peripherals including 12-bit ADC, dual analog comparators, SCI, SPI, I²C, two 16-bit TPM modules, RTC, and single-wire background debug interface. It operates from 1.8 V to 3.6 V at up to 20 MHz and supports ultra-low-power stop3 mode (0.4 µA typical). It is used in battery-powered industrial sensors and automotive body electronics.

For engineers reviewing the MC9S08QE8CLC datasheet, MC9S08QE8CLC pinout, MC9S08QE8CLC application, or MC9S08QE8CLC equivalent, key selection considerations include its 32-pin QFN package (Case 2078-01), 12-bit ADC with temperature sensor, dual ACMPs with external reference support, LIN-capable SCI, and verified stop3 wake-up time of 6 µs - all critical for low-power embedded control designs.

Technical Context

The MC9S08QE8CLC implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature), enabling bus frequencies from 1 MHz to 10 MHz without external crystal.

System protection includes COP watchdog with 1 kHz internal clock option, low-voltage detection (1.80–1.96 V threshold), illegal opcode/address reset, and flash block protection. Power management features include two stop modes, reduced-power wait, peripheral clock gating, and a dedicated low-power oscillator for RTC operation in stop3.

Key Specifications

Pinout & Package

MC9S08QE8CLC is housed in a 32-pin QFN package (Case 2078-01), thermally enhanced with exposed pad, copper-wire bonded per Freescale QFN Addendum Rev. 0 (2014). Pin assignments match the 32-pin LQFP/QFN configuration shown in Figure 2 of the MC9S08QE8 Rev. 8 datasheet.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08AC16CFGE, the MC9S08QE8CLC offers lower stop-mode current and integrated RTC at smaller footprint; versus S9KEAZ128AMLH, it delivers proven ultra-low-power operation and hardware LIN support without software stack overhead or ARM licensing complexity.

Availability

MC9S08QE8CLC is available at Aetrix Electronics and suitable for industrial sensor nodes, automotive body electronics, smart meter interfaces, and medical wearable monitors requiring stable component supply, long-term lifecycle support, and verified QFN thermal performance.

Supply support for MC9S08QE8CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, connected, and intelligent solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The MC9S08QE8CLC belongs to the HCS08-based QE series designed specifically for ultra-low-power, cost-optimized embedded control in space-constrained and battery-operated systems - emphasizing integrated analog, robust debug, and automotive-grade reliability.

FAQ

What is the maximum operating frequency of the MC9S08QE8CLC and under what conditions?

The MC9S08QE8CLC achieves up to 20 MHz CPU operation at 3.6 V across the full industrial temperature range (–40 °C to +85 °C). This is enabled by its internal clock source (ICS) with FLL and factory-trimmed reference. At lower voltages (e.g., 1.8 V), the maximum frequency is reduced per the datasheet's voltage-frequency curve. The MC9S08QE8CLC must be configured in FEI or FBE mode to reach this speed; PLL-based modes are not supported in this device.

Does the MC9S08QE8CLC support LIN communication natively?

Yes, the MC9S08QE8CLC supports LIN 2.x natively through its SCI module, which includes hardware extended break generation (for master) and extended break detection (for slave). This eliminates the need for bit-banging or external LIN transceivers for basic protocol handling. The MC9S08QE8CLC requires an external LIN physical layer transceiver (e.g., TJA1020) for bus interfacing, but all protocol timing and framing are handled in silicon.

What are the power supply requirements for the analog section of the MC9S08QE8CLC?

The MC9S08QE8CLC requires separate analog supply connections: VDDA/VREFH (1.8–3.6 V) and VSSA/VREFL. These pins must be decoupled with 100 nF ceramic capacitors close to the package. When no external reference is used, VDDA serves as the ADC's positive reference and VSSA as the negative reference. The internal bandgap reference (1.17 V typical) is available on the ADC's internal channel and remains stable across voltage and temperature - critical for accurate measurements in the MC9S08QE8CLC.

How does the MC9S08QE8CLC achieve ultra-low-power operation in stop3 mode?

The MC9S08QE8CLC achieves 0.4 µA typical stop3 current by disabling all clocks except the 1 kHz low-power oscillator (LPO), which continues powering the RTC. Flash, RAM, and most peripherals are powered down; only selected wakeup sources (e.g., BKGD, RTC overflow, ACMP edge) remain active. The MC9S08QE8CLC retains full register and RAM content during stop3, and wake-up occurs in 6 µs - making it ideal for duty-cycled sensing applications where responsiveness and energy efficiency are both essential.

Is the MC9S08QE8CLC pin-compatible with other members of the QE family?

No, the MC9S08QE8CLC is not fully pin-compatible across the QE family. While it shares the 32-pin QFN footprint with MC9S08QE32 and MC9S08QE128, pin functions differ significantly - especially for ADC inputs, TPM channels, and I²C locations. For example, ACMP2+ and ACMP2– are fixed to PTC6 and PTC7 on the MC9S08QE8CLC but may map elsewhere in larger variants. Always verify pin assignments using the specific device's datasheet; migration requires PCB redesign unless using identical variant and package.