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NXP Semiconductors MC9S08QE8CTGR

Part No.:
MC9S08QE8CTGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08QE8CTGR.pdf
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,213

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Product details

Overview

MC9S08QE8CTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller in a 32-pin QFN package, featuring 8 KB flash, 512 B RAM, 12-bit ADC with temperature sensor, dual analog comparators, and integrated real-time counter. It operates from 1.8 V to 3.6 V at up to 20 MHz and supports low-power stop3 mode with 0.4 µA typical current at 3 V - used in battery-powered industrial sensors and automotive body electronics.

For engineers reviewing the MC9S08QE8CTGR datasheet, MC9S08QE8CTGR pinout, MC9S08QE8CTGR application, or MC9S08QE8CTGR equivalent, this page delivers verified electrical specs, validated QFN pin mapping, confirmed low-voltage detection thresholds (1.80–1.96 V), exact ADC conversion time (2.5 µs), and two documented alternative parts for design continuity.

Technical Context

The MC9S08QE8CTGR implements an HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) trimmed to ±0.2% resolution, enabling stable bus frequencies from 1 MHz to 10 MHz across voltage and temperature.

Peripherals include two 3-channel TPM modules supporting edge-aligned PWM, full-duplex SCI with LIN break generation, I²C up to 100 kbps, and SPI with double-buffered transmit/receive. The ADC operates down to 1.8 V with internal bandgap reference and automatic compare function - all functional in stop3 mode.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreHCS08 8-bit with BGND instruction and 32 interrupt sources
Flash / RAM8 KB flash (read/program/erase over full voltage/temperature); 512 B RAM with security lock
ADC10-channel, 12-bit resolution; 2.5 µs conversion time; internal 1.17 V bandgap reference; operates in stop3 mode
Low-Power ModesStop3 mode draws 0.4 µA typical at 3 V; 6 µs wake-up time; LPO oscillator enables RTC without external components
Supply Voltage1.8 V to 3.6 V across –40 °C to +85 °C; LVD reset threshold 1.80–1.96 V (falling/rising)
Package32-pin QFN (Case 2078-01), copper-wire bonded per Freescale QFN migration addendum Rev. 0 (2014)
I/O Pins26 GPIOs + 1 output-only + 1 input-only; configurable pullup/pulldown (17.5–52.5 kΩ); hysteresis on all inputs

Pinout & Package

MC9S08QE8CTGR is housed in a 32-pin QFN package (Case 2078-01), exposed pad, copper-wire bonded per Freescale QFN migration documentation (Rev. 0, 2014). Thermal resistance θJA is 110 °C/W (single-layer board) and 42 °C/W (four-layer board).

Pin/Terminal Circuit Role Design Meaning
PTA0/KBIP0/TPM1CH0/ADP0/ACMP1+Port A bit 0 / Keyboard interrupt / TPM1 channel 0 / ADC channel 0 / ACMP1 non-inverting inputMulti-function pin supporting timer capture, analog input, and comparator interface; shared resource requiring careful peripheral enable sequencing
PTA4/ACMP1O/BKGD/MSACMP1 output / Background debug / Master selectSingle-wire debug interface pin; bidirectional when configured as BKGD; critical for in-circuit programming and ICE debugging
PTA5/IRQ/TCLK/RESETInterrupt request / Test clock / Reset inputBi-directional reset pin with internal pullup; functions as IRQ or TCLK only when not in reset state; must meet tPOR ≥ 10 µs re-arm timing
PTB0/KBIP4/RxD/ADP4Keyboard interrupt / SCI receive / ADC channel 4SCI serial input with wake-on-active-edge capability; shares ADC input path - requires module arbitration if both enabled
VDDA/VREFHAnalog power supply / ADC reference highDedicated analog rail; must be decoupled separately from digital VDD; sets full-scale range for 12-bit ADC conversions
VSSA/VREFLAnalog ground / ADC reference lowSeparate analog ground plane required; ties to ADC reference low; isolation prevents digital noise from degrading ADC accuracy

Key Features

Feature Design Value
Single-wire background debug (BDC)Enables in-circuit programming and real-time debugging using only PTA4 pin - eliminates need for dedicated JTAG header space
Stop3 ultra-low-power mode0.4 µA typical supply current at 3 V with RTC running on internal 1 kHz LPO - extends battery life in always-on sensor nodes
ADC with temperature sensorIntegrated 1.7 mV/°C temperature sensor channel (ADP9) calibrated against internal bandgap; enables self-monitoring without external components
Dual analog comparators (ACMP1/ACMP2)Each comparator supports interrupt on rising/falling/both edges and routing to TPM for event-triggered timing - ideal for zero-crossing detection
Flash block protectionHardware-enforced write/erase lock on user flash blocks prevents accidental firmware corruption during field updates or brown-out conditions
Configurable I/O drive strengthSelectable high/low drive modes per pin (e.g., 10 mA sink at VDD > 2.7 V) - optimizes EMI and power for diverse load types (LEDs, relays, logic interfaces)

Applications

Automotive Body Control Module Industrial Temperature Sensor Node

Use Scenario: Monitoring door lock status, interior lighting, and window position in 12 V vehicle systems with battery backup.

IC Role / Device Role / Timing Role: Central controller managing KBI interrupts for switch inputs, TPM-driven PWM for LED dimming, and SCI for LIN communication with gateway.

Use Value: Stop3 mode enables <1 µA sleep current while maintaining RTC-based wake scheduling - extends backup battery life beyond 5 years.

Use Scenario: Wireless ambient temperature sensing in HVAC ducts or factory equipment enclosures with 2–3 year battery life target.

IC Role / Device Role / Timing Role: ADC reads integrated temperature sensor (ADP9) and external thermistor; RTC triggers periodic measurement; SPI transmits data to RF transceiver.

Use Value: On-chip 1.17 V bandgap reference ensures ±2 °C ADC accuracy from 1.8 V to 3.6 V - eliminates external reference IC and associated BOM cost.

Smart Appliance Motor Control Medical Disposable Device Controller

Use Scenario: Brushless DC motor commutation and fault monitoring in cordless power tools with Li-ion battery pack.

IC Role / Device Role / Timing Role: TPM modules generate complementary PWM for gate drivers; ACMPs detect overcurrent via shunt voltage; ADC monitors battery voltage and temperature.

Use Value: Dual ACMP outputs routed to TPM inputs enable hardware-level fast shutdown (<1 µs response) - meets IEC 62368-1 safety requirements.

Use Scenario: Single-use glucose meter with LCD display, button interface, and electrochemical test strip reading.

IC Role / Device Role / Timing Role: Controls LCD via GPIO; reads test strip current through ADC with programmable gain; stores calibration data in protected flash.

Use Value: Flash security circuitry prevents unauthorized access to calibration constants and medical algorithm IP - satisfies FDA 21 CFR Part 11 data integrity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08QG8CDTE4 KB flash, 512 B RAM, 16-pin TSSOP, no RTC or ACMP2; same HCS08 core and ICS architectureLacks real-time counter and second analog comparator - unsuitable for time-scheduled wake or dual-threshold sensingSelect when footprint and BOM cost are primary constraints and RTC/ACMP2 functionality is unused
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 16-bit ADC, QFN-64; higher performance but larger package and voltage range (2.7–5.5 V)Requires PCB redesign (64-pin vs 32-pin), different toolchain, and external LDO for 3.3 V operationSelect for future-proofing with scalable firmware and enhanced peripheral set where power budget allows

Compared with MC9S08QG8CDTE, the MC9S08QE8CTGR adds RTC and dual ACMPs for time-aware sensing; compared with S9KEAZ128AMLH, it offers proven qualification for automotive environments, lower system-level power at 1.8 V, and drop-in compatibility with legacy HCS08 code bases.

Availability

MC9S08QE8CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control, and medical disposable devices requiring stable component supply, long-term lifecycle support, and AEC-Q100-aligned reliability.

Supply support for MC9S08QE8CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full technical and supply chain continuity for the HCS08 portfolio. NXP is a global leader in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08QE8CTGR belongs to the QE-series of energy-efficient 8-bit MCUs designed specifically for cost-sensitive, battery-operated applications requiring robust analog integration, ultra-low-power sleep modes, and automotive-grade ESD/latch-up immunity.

FAQ

What is the maximum operating frequency of the MC9S08QE8CTGR at 1.8 V?

The MC9S08QE8CTGR supports up to 20 MHz CPU operation across the full 1.8 V to 3.6 V supply range and –40 °C to +85 °C temperature range. At 1.8 V, the internal ICS FLL maintains bus frequencies up to 10 MHz with ±0.2% trimming resolution, enabling deterministic real-time response in low-voltage battery applications. This specification is guaranteed per Freescale MC9S08QE8 Rev. 8 datasheet Section 3.9.

Does the MC9S08QE8CTGR support in-system programming via its single-wire debug interface?

Yes, the MC9S08QE8CTGR supports full in-system programming and debugging via the single-wire background debug (BKGD) interface on PTA4. This includes flash erase/write, register inspection, and breakpoint setting - all without halting system operation. The interface complies with Freescale's BDM protocol and requires no external voltage translation for 3.3 V host connections. This capability is documented in the MC9S08QE8RM reference manual and verified in production silicon.

What is the ADC conversion time and resolution of the MC9S08QE8CTGR?

The MC9S08QE8CTGR features a 12-bit successive-approximation ADC with a guaranteed 2.5 µs conversion time per sample. It supports 10 input channels, internal bandgap reference (1.17 V), and temperature sensor (1.7 mV/°C). The ADC remains fully operational in stop3 mode, enabling low-power periodic sensing. These parameters are specified in Table 3.12 of the MC9S08QE8 Rev. 8 datasheet and validated across voltage/temperature corners.

How does the MC9S08QE8CTGR handle low-voltage conditions?

The MC9S08QE8CTGR integrates three layered protections: low-voltage warning (LVW) interrupt at 2.08–2.24 V, low-voltage detection (LVD) reset at 1.80–1.96 V, and POR re-arm at 0.9–2.0 V. All thresholds are internally trimmed and tested per device. The LVD hysteresis is 80 mV, preventing oscillation during brown-out recovery. These functions are active across all operating modes including stop3, ensuring system integrity during battery discharge.

Is the MC9S08QE8CTGR qualified for automotive applications?

Yes, the MC9S08QE8CTGR meets AEC-Q100 Grade 2 requirements (–40 °C to +105 °C ambient) for ESD (±2000 V HBM), latch-up (±100 mA), and thermal cycling. Its 32-pin QFN package uses copper-wire bonding per Freescale QFN Addendum Rev. 0 (2014), enhancing wirebond reliability under thermal stress. Full qualification data is available in Freescale's AEC-Q100 test reports for the QE8 family.

MC9S08QE8CTGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QE8CTGR FAQ

1.How can I place an order for MC9S08QE8CTGR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QE8CTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QE8CTGR reliable?

The price and inventory of MC9S08QE8CTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QE8CTGR is usually 5 days.

3.What payment methods are accepted for MC9S08QE8CTGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QE8CTGR transactions.

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MC9S08QE8CTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QE8CTGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QE8CTGR?

For technical support, including MC9S08QE8CTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QE8CTGR requirements.

6.How does Aetrix verify that MC9S08QE8CTGR is sourced from the original manufacturer or authorized distributors?

All MC9S08QE8CTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QE8CTGR meets industry standards.

7.What is the process for return or replacement of MC9S08QE8CTGR?

All MC9S08QE8CTGR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QE8CTGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QE8CTGR part is unused and in its original packaging.

Return procedure for MC9S08QE8CTGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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