NXP Semiconductors MC9S08QG4CFFER
- Part No.:
- MC9S08QG4CFFER
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-VQFN Exposed Pad
- Datasheet:
-
MC9S08QG4CFFER.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 16QFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,357
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Product details
Overview
MC9S08QG4CFFER from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 20-MHz CPU, 4 KB flash memory, 256 bytes RAM, and integrated peripherals including 8-channel 10-bit ADC, SCI, SPI, I²C, TPM, ACMP, and MTIM - designed for cost-sensitive embedded control in appliance motor drives and sensor interface modules.
For engineers reviewing the MC9S08QG4CFFER datasheet, MC9S08QG4CFFER pinout, MC9S08QG4CFFER application, or MC9S08QG4CFFER equivalent, key selection criteria include its 16-pin QFN package with exposed pad, internal clock source (ICS) with FLL, low-voltage detection, COP watchdog, and single-wire background debug interface for in-circuit development.
Technical Context
The MC9S08QG4CFFER implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and real-time debugging via an on-chip debug module with two comparators, nine trigger modes, and eight-deep FIFO. Its ICS module integrates a frequency-locked loop (FLL) trimmed to ±0.2% resolution over voltage and temperature, enabling bus frequencies from 1 MHz to 10 MHz without external crystal.
Peripherals are tightly coupled to the CPU: the 10-bit ADC supports hardware triggering by RTI and includes automatic compare with internal bandgap reference; the TPM provides dual-channel PWM with edge- and center-aligned modes; and the ACMP output can be routed directly to TPM for analog-triggered timing events - all operating across Run, Wait, and Stop3 modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit CPU running at up to 20 MHz; executes HC08 instruction set with BGND for background debug. |
| Memory | 4 KB on-chip FLASH (read/program/erase over full VDD/temp), 256 bytes RAM; FLASH block protection enabled. |
| ADC | 8-channel, 10-bit SAR ADC with internal bandgap reference, temperature sensor, and RTI hardware trigger capability. |
| Clock System | ICS with FLL + internal reference (±0.2% trim resolution); XOSC supports 31.25 kHz–16 MHz crystals/resonators or external clock ≤20 MHz. |
| Power Modes | Run, Wait, and three Stop modes (Stop1/Stop2/Stop3); COP watchdog runs from dedicated 1-kHz internal clock or bus clock. |
| I/O & Packaging | 12 GPIO pins + 1 input-only + 1 output-only; 16-pin QFN (3×3 mm, 0.5 mm pitch) with exposed thermal pad (CFFER suffix). |
| Debug Interface | Single-wire background debug (BKGD/MS pin); on-chip ICE with real-time bus capture and breakpoint support (1 tag + 2 force breakpoints). |
Pinout & Package
MC9S08QG4CFFER is housed in a 16-pin quad flat no-lead (QFN) package measuring 3 mm × 3 mm with 0.5 mm pitch and an exposed thermal pad (JEDEC MO-220, case outline 98ASA00671D). The package uses copper wire bonding per Freescale QFN migration addendum Rev. 0 (July 2014).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage | Core and I/O power rail (2.7–3.6 V); decoupling required near pin. |
| VSS | Ground | Digital ground reference; connects to PCB ground plane under exposed pad. |
| BKGD/MS | Debug & mode select | Single-wire background debug interface; also selects active background mode at reset. |
| RESET | Reset input | Active-low reset with internal pullup; accepts external pushbutton or supervisor signal. |
| PTA0–PTA7 | Port A I/O | 8-bit general-purpose port; PTA5 has internal pullup; software-selectable slew rate and drive strength. |
| PTB0–PTB3 | Port B I/O | 4-bit general-purpose port; supports keyboard interrupt (KBI) with edge/level polarity selection. |
| IRQ | Interrupt request | External interrupt input with internal pullup; level- or edge-sensitive per configuration. |
| XTAL | Oscillator input | Connects to crystal/resonator or external clock source for XOSC module operation. |
Key Features
| Feature | Design Value |
|---|---|
| FLASH endurance | 100,000 program/erase cycles with data retention >10 years - enables field firmware updates in deployed systems. |
| Low-power operation | Stop3 mode draws <1 µA typical; supports battery-powered sensor nodes with multi-year runtime. |
| Analog integration | On-die 10-bit ADC + temperature sensor + bandgap reference eliminates external components for thermal monitoring. |
| Robust system protection | COP watchdog with independent 1-kHz clock, low-voltage detect (reset/interrupt), illegal opcode/address traps, and FLASH block protect. |
| Debug efficiency | Single-wire BKGD interface reduces PCB routing complexity and enables real-time trace via on-chip FIFO and comparator triggers. |
Applications
| Smart Appliance Motor Control | Industrial Sensor Node |
|---|---|
Use Scenario: Brushless DC motor commutation in washing machine drum drives using hall-effect feedback. IC Role / Device Role / Timing Role: MCU executing closed-loop speed control, generating 3-phase PWM via TPM channels, and sampling current/voltage via ADC. Use Value: Integrated TPM with center-aligned PWM and ADC hardware trigger reduce timing jitter and eliminate external timer/trigger logic. | Use Scenario: Battery-powered temperature/humidity monitor transmitting data via UART to gateway. IC Role / Device Role / Timing Role: System controller managing sensor acquisition, low-power sleep scheduling, and SCI serial communication. Use Value: Stop3 mode current <1 µA and internal bandgap reference enable accurate ADC readings without external voltage reference IC. |
| Home Automation Keypad | LED Lighting Dimming Module |
Use Scenario: Touchless proximity keypad with capacitive sensing and LED feedback in HVAC wall controllers. IC Role / Device Role / Timing Role: Keyboard interrupt (KBI) processor scanning 8-key matrix and driving status LEDs via GPIO. Use Value: KBI module with software-selectable edge/level polarity and internal pullups simplifies front-panel design and reduces BOM count. | Use Scenario: Analog-dimmable LED driver with potentiometer input and thermal foldback protection. IC Role / Device Role / Timing Role: ADC reads pot wiper and thermal sensor; TPM generates adjustable-duty-cycle PWM to MOSFET gate. Use Value: ACMP output routed to TPM allows immediate PWM shutdown on overtemperature event - no CPU intervention required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08QG8CFFER | 8 KB FLASH, 512 bytes RAM; identical pinout, peripherals, and package - direct memory upgrade path. | Supports larger firmware images and more complex control algorithms without layout change. | Select when future firmware expansion or additional feature sets (e.g., enhanced communication stacks) are anticipated. |
| S9KEAZ128AMLH | ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM; different architecture, instruction set, and debug interface (SWD). | Requires full firmware rewrite but offers higher performance, USB, and CAN interfaces not available in QG4. | Choose for new designs needing scalability beyond 8-bit constraints or requiring modern peripheral sets like USB or CAN. |
Compared with MC9S08QG8CFFER, the MC9S08QG4CFFER trades flash/RAM capacity for lower cost and smaller footprint while retaining identical peripheral functionality and debug compatibility; versus S9KEAZ128AMLH, it offers proven 8-bit toolchain continuity and lower power in deep-sleep modes but lacks 32-bit compute throughput and advanced interfaces.
Availability
MC9S08QG4CFFER is available at Aetrix Electronics and suitable for smart appliance motor control, industrial sensor nodes, home automation keypads, and LED lighting dimming modules requiring stable component supply and long-term manufacturability.
Supply support for MC9S08QG4CFFER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and consumer markets.
The MC9S08QG4 belongs to the HCS08 microcontroller family, engineered for cost-optimized, low-power 8-bit control in space-constrained applications such as white goods, lighting, and sensor interfaces.
FAQ
What is the package type and thermal pad configuration of the MC9S08QG4CFFER?
The MC9S08QG4CFFER uses a 16-pin QFN package (3 mm × 3 mm, 0.5 mm pitch) with an exposed thermal pad designated by the "CFFER" suffix. This pad must be soldered to a PCB thermal plane for reliable thermal dissipation and EMI reduction. Per Freescale EB806, the pad should be connected to VSS with multiple thermal vias.
Does the MC9S08QG4CFFER support in-circuit debugging, and what interface is used?
Yes, the MC9S08QG4CFFER supports full in-circuit debugging via a single-wire background debug interface on the BKGD/MS pin. It includes an on-chip debug module with breakpoint support (1 tag + 2 force breakpoints), real-time bus capture, and an 8-deep FIFO for flow tracing - all accessible without halting normal operation.
What are the clock source options available on the MC9S08QG4CFFER?
The MC9S08QG4CFFER offers two primary clock sources: the Internal Clock Source (ICS) with FLL for 1–10 MHz bus frequencies using factory-trimmed internal reference (±0.2% resolution), and the External Oscillator (XOSC) supporting crystals/resonators from 31.25 kHz to 16 MHz or external clock inputs up to 20 MHz.
Can the MC9S08QG4CFFER operate in ultra-low-power modes, and what is the lowest current draw?
Yes, the MC9S08QG4CFFER supports Stop3 mode with typical current draw below 1 µA. In this mode, the ICS is disabled, RAM is retained, and wake-up is possible via IRQ, KBI, or RTI - making it suitable for battery-powered applications where multi-year operation is required.
Is the MC9S08QG4CFFER pin-compatible with other devices in the QG family, and which ones?
Yes, the MC9S08QG4CFFER is pin-compatible with the MC9S08QG8CFFER in the same 16-pin QFN package. Both share identical pin assignments, peripheral mappings, and electrical characteristics - allowing drop-in replacement where increased flash/RAM capacity is needed without PCB revision.
MC9S08QG4CFFER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-VQFN Exposed Pad
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08QG4CFFER FAQ
1.How can I place an order for MC9S08QG4CFFER through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08QG4CFFER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08QG4CFFER reliable?
The price and inventory of MC9S08QG4CFFER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QG4CFFER is usually 5 days.
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Once your MC9S08QG4CFFER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08QG4CFFER?
For technical support, including MC9S08QG4CFFER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QG4CFFER requirements.
6.How does Aetrix verify that MC9S08QG4CFFER is sourced from the original manufacturer or authorized distributors?
All MC9S08QG4CFFER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QG4CFFER meets industry standards.
7.What is the process for return or replacement of MC9S08QG4CFFER?
All MC9S08QG4CFFER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QG4CFFER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08QG4CFFER part is unused and in its original packaging.
Return procedure for MC9S08QG4CFFER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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