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NXP Semiconductors MC9S08QG4CFQE

Part No.:
MC9S08QG4CFQE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
8-VDFN Exposed Pad
Datasheet:
AetrixMC9S08QG4CFQE.pdf
Description:
IC MCU 8BIT 4KB FLASH 8DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:435

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Product details

Overview

MC9S08QG4CFQE from Freescale Semiconductor is an 8-bit HCS08 microcontroller with 4 KB FLASH, 256 bytes RAM, 20-MHz CPU, internal clock source (ICS) with FLL, and integrated peripherals including 8-channel 10-bit ADC, SCI, SPI, I²C, TPM, ACMP, and KBI - used in low-cost embedded control applications such as appliance motor interfaces and sensor signal conditioning.

For engineers reviewing the MC9S08QG4CFQE datasheet, MC9S08QG4CFQE pinout, MC9S08QG4CFQE application, or MC9S08QG4CFQE equivalent, key selection factors include its 16-pin QFN package, single-wire background debug interface, 12 GPIO + 1 input-only + 1 output-only pin configuration, 1–10 MHz bus frequency support, and low-voltage detection with reset/interrupt capability.

Technical Context

The MC9S08QG4CFQE implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and featuring an on-chip debug module with two comparators, nine trigger modes, and eight-deep FIFO for flow-event capture. Its ICS module integrates a frequency-locked loop (FLL) with factory-trimmed internal reference enabling ±0.2% resolution and ±2% deviation over voltage/temperature.

Peripherals include a hardware-triggerable 10-bit ADC with internal bandgap reference and temperature sensor, analog comparator with optional routing to TPM, and dual-channel timer/pulse-width modulator supporting edge-aligned and center-aligned PWM - all operating under three stop modes and wait mode for power-sensitive designs.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit CPU running at up to 20 MHz; executes HC08 instruction set with BGND for debugging.
Memory4 KB on-chip FLASH (read/program/erase across full VDD/temp); 256 bytes RAM.
ADC8-channel, 10-bit SAR ADC with automatic compare, asynchronous clock, internal bandgap reference, and RTI hardware trigger.
Clock SourceICS with FLL (1–10 MHz bus frequency); XOSC supports crystal/resonator (31.25 kHz–16 MHz) or external clock ≤20 MHz.
I/O Pins12 general-purpose I/O, 1 input-only, 1 output-only; 10 mA per output, 60 mA total package drive.
Debug InterfaceSingle-wire background debug (BDM) with on-chip ICE, real-time bus capture, and breakpoint support (1 tag + 2 force).
Power ModesRun, Wait, Stop1, Stop2, Stop3 - with configurable wake-up sources and peripheral retention in Stop3.

Pinout & Package

MC9S08QG4CFQE is housed in a 16-pin quad flat no-lead (QFN) package with exposed thermal pad (98ASA00671D), measuring 4 mm × 4 mm × 0.85 mm, RoHS-compliant, and optimized for compact PCB layouts requiring thermal efficiency.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltageCore and I/O power supply (2.7–3.6 V); decoupling required near pin.
VSSGroundDigital ground reference; connects to PCB ground plane.
PTA0–PTA7Port A I/O8-bit bidirectional port with software-selectable pullups, slew rate, and drive strength.
PTB0–PTB3Port B I/O4-bit bidirectional port; PTA5 has internal pullup; PTB3 is input-only.
RESETActive-low reset inputInternal pullup enables reset without external resistor; triggers cold start or COP timeout recovery.
BKGD/MSBackground debug / mode selectSingle-wire BDM communication and mode configuration during startup.
XTALCrystal oscillator inputConnects to crystal or ceramic resonator for XOSC module operation.
EXTALCrystal oscillator outputDrives crystal/resonator; requires external load capacitors per frequency.

Key Features

FeatureDesign Value
FLASH Block ProtectionConfigurable protection of FLASH sectors prevents accidental overwrite during field firmware updates.
Low-Voltage DetectionProgrammable LVD threshold (2.5 V or 2.7 V) with selectable reset or interrupt response for brown-out resilience.
Hardware-Triggered ADCRTI counter initiates conversions without CPU intervention, enabling deterministic sampling in real-time control loops.
Integrated Temperature SensorOn-die sensor feeds ADC channel for ambient temperature monitoring without external components.
Keyboard Interrupt Module8-pin KBI with edge/level detection and polarity control simplifies matrix keypad scanning in user-interface designs.

Applications

Home Appliance ControlIndustrial Sensor Node

Use Scenario: Microcontroller manages motor speed, user inputs, and status LEDs in compact washing machine control boards.

IC Role / Device Role / Timing Role: Primary system controller executing real-time motor commutation logic and front-panel scan via KBI and TPM PWM outputs.

Use Value: Integrated 10-bit ADC reads current-sense resistors and thermistors; single-wire debug enables in-field firmware patching without JTAG header space.

Use Scenario: Standalone environmental monitor collects temperature, humidity, and vibration data for predictive maintenance reporting.

IC Role / Device Role / Timing Role: Data acquisition hub interfacing analog sensors via ADC and digital sensors via I²C, then transmitting via SCI UART to gateway.

Use Value: Internal bandgap reference ensures stable ADC accuracy across supply variation; Stop3 mode extends battery life to >2 years on coin cell.

Smart Lighting DriverMedical Diagnostic Handset

Use Scenario: LED driver board regulates brightness and color mixing using PWM dimming and thermal feedback.

IC Role / Device Role / Timing Role: PWM generator and thermal supervisor - TPM channels drive MOSFET gates while ADC monitors heatsink temperature.

Use Value: Center-aligned PWM reduces EMI; on-chip temperature sensor eliminates discrete thermal diode, reducing BOM cost by $0.12/unit.

Use Scenario: Portable blood glucose meter performs analog signal conditioning, button scan, and LCD update in ultra-low-power mode.

IC Role / Device Role / Timing Role: Signal processor and UI coordinator - ACMP compares sensor thresholds, KBI detects button press, and SCI transmits results to Bluetooth module.

Use Value: Input-only pin (PTB3) isolates critical safety input; LVD interrupt alerts before battery cutoff, preserving last measurement in nonvolatile memory.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08QG8CFQE8 KB FLASH, 512 bytes RAM, identical pinout and peripheral set; same 16-pin QFN package.Supports larger firmware images and more complex state machines without layout change.Select when firmware size exceeds 4 KB or future scalability is required.
S9KEAZ128AMLHARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, 48 MHz; different architecture, instruction set, and debug interface (SWD).Requires full firmware rewrite and PCB redesign; suited for higher-performance or mixed-signal applications needing USB or CAN.Choose only when migrating to ARM ecosystem and accepting toolchain/BOM changes.

Compared with MC9S08QG8CFQE, the MC9S08QG4CFQE offers identical peripheral functionality and footprint but halves FLASH/RAM capacity for cost-sensitive volume production; versus S9KEAZ128AMLH, it avoids ARM licensing, toolchain complexity, and layout rework while meeting basic real-time control requirements.

Availability

MC9S08QG4CFQE is available at Aetrix Electronics and suitable for home appliance control, industrial sensor nodes, smart lighting drivers, and medical diagnostic handsets requiring stable component supply and long-term manufacturing continuity.

Supply support for MC9S08QG4CFQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and consumer markets.

The MC9S08QG4CFQE belongs to the HCS08 microcontroller family, engineered for cost-sensitive, low-power 8-bit control applications where small footprint, integrated analog peripherals, and single-wire debug are essential.

FAQ

What is the package type and dimensions of the MC9S08QG4CFQE?

The MC9S08QG4CFQE uses a 16-pin QFN package (case outline 98ASA00671D) measuring 4 mm × 4 mm × 0.85 mm with an exposed thermal pad. It is RoHS-compliant and designed for high-density PCB layouts requiring efficient heat dissipation in space-constrained applications like handheld devices and sensor modules.

Does the MC9S08QG4CFQE support in-circuit debugging, and what interface is used?

Yes, the MC9S08QG4CFQE supports in-circuit debugging via a single-wire background debug (BDM) interface. This allows real-time bus capture, breakpoint setting (one tag + two force), and on-chip emulation without requiring additional pins or headers - enabling rapid development and field firmware updates directly through the BKGD/MS pin.

What are the supported clock sources for the MC9S08QG4CFQE, and how precise is the internal oscillator?

The MC9S08QG4CFQE supports both the Internal Clock Source (ICS) with FLL and the External Oscillator (XOSC). The ICS achieves ±0.2% resolution and ±2% deviation over temperature and voltage due to factory trimming of its internal reference, delivering stable 1–10 MHz bus frequencies without external crystals.

Can the MC9S08QG4CFQE operate in low-power modes, and which peripherals remain active in Stop3 mode?

Yes, the MC9S08QG4CFQE supports Wait, Stop1, Stop2, and Stop3 modes. In Stop3 mode, the ADC, TPM, KBI, and RTI remain functional and can wake the MCU; the ICS is disabled but the 1-kHz COP clock continues, allowing watchdog supervision without full CPU activation.

Is there an internal temperature sensor in the MC9S08QG4CFQE, and how is it accessed?

Yes, the MC9S08QG4CFQE includes an on-die temperature sensor connected to ADC channel AD7. It is accessed by configuring the ADC to sample that channel with internal bandgap reference - enabling accurate ambient temperature monitoring without external components, ideal for thermal management in battery-powered or sealed systems.

MC9S08QG4CFQE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
8-VDFN Exposed Pad
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QG4CFQE FAQ

1.How can I place an order for MC9S08QG4CFQE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QG4CFQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QG4CFQE reliable?

The price and inventory of MC9S08QG4CFQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QG4CFQE is usually 5 days.

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MC9S08QG4CFQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QG4CFQE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QG4CFQE?

For technical support, including MC9S08QG4CFQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QG4CFQE requirements.

6.How does Aetrix verify that MC9S08QG4CFQE is sourced from the original manufacturer or authorized distributors?

All MC9S08QG4CFQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QG4CFQE meets industry standards.

7.What is the process for return or replacement of MC9S08QG4CFQE?

All MC9S08QG4CFQE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QG4CFQE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QG4CFQE part is unused and in its original packaging.

Return procedure for MC9S08QG4CFQE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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