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NXP Semiconductors MC9S08QG84CDTE

Part No.:
MC9S08QG84CDTE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08QG84CDTE.pdf
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,732

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Product details

Overview

MC9S08QG84CDTE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 20-MHz CPU, 8 KB Flash memory, 512 bytes RAM, and integrated peripherals including 10-bit ADC, SCI, SPI, I²C, TPM, ACMP, and MTIM. It operates across industrial temperature range (–40°C to +105°C) in a 16-pin QFN package with exposed thermal pad, targeting cost-sensitive embedded control applications such as motor drive supervision and sensor interface modules.

For engineers reviewing the MC9S08QG84CDTE datasheet, MC9S08QG84CDTE pinout, MC9S08QG84CDTE application, or MC9S08QG84CDTE equivalent, key selection criteria include its single-wire background debug interface, internal clock source with FLL and ±2% frequency stability over voltage/temperature, 12 GPIOs with configurable pullups/slew rate, and FLASH block protection for firmware integrity in field-deployed devices.

Technical Context

The MC9S08QG84CDTE implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and featuring an on-chip debug module with two comparators, nine trigger modes, and eight-deep FIFO for change-of-flow tracing. Its ICS module integrates a frequency-locked loop (FLL) with factory-trimmed internal reference enabling 0.2% resolution and ±2% deviation over full operating range.

Peripherals are tightly coupled to low-power operation: the ADC supports hardware triggering via RTI counter and includes internal bandgap reference and temperature sensor; the TPM provides dual-channel PWM with edge- and center-aligned modes; and the ACMP output can be routed directly to TPM for analog event-driven timing control - all functional in Wait mode and selectively retained in Stop1/Stop2 modes.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core running at up to 20 MHz; enables deterministic real-time control with <1 µs interrupt latency.
Memory8 KB on-chip FLASH (read/program/erase over full VDD/temp); 512 bytes RAM; supports in-application programming.
ADC10-bit, 8-channel SAR ADC with internal bandgap reference, temperature sensor, and automatic compare function.
Clock SystemICS with FLL + internal reference (±2% accuracy); XOSC supports crystal/resonator (31.25 kHz–16 MHz) or external clock ≤20 MHz.
I/O Capability12 general-purpose I/O pins (10 mA sink/source each), 1 input-only, 1 output-only; software-configurable pullups, slew rate, and drive strength.
Debug InterfaceSingle-wire background debug (BDM) with breakpoint support (1 tag + 2 force breakpoints) and real-time bus capture.
Operating Range2.7–5.5 V supply; –40°C to +105°C ambient temperature - qualified for industrial-grade reliability.

Pinout & Package

MC9S08QG84CDTE is housed in a 16-pin quad flat no-lead (QFN) package (98ASA00671D) with 3 mm × 3 mm footprint and exposed thermal pad for enhanced thermal dissipation in compact PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltage inputPrimary power rail (2.7–5.5 V); must be decoupled locally to reduce noise coupling into analog/RTC domains.
VSSGround referenceDigital ground return; tied to exposed pad for thermal and EMI performance.
PTA0–PTA5Port A bidirectional I/O6 GPIOs with optional pullups; PTA5 has dedicated reset pullup; all support interrupt-on-change (KBI).
PTB0–PTB5Port B bidirectional I/O6 GPIOs; PTB0–PTB3 share functions with ADC inputs (AD0–AD3); PTB4/PTB5 serve as SCI TX/RX.
RESETActive-low reset inputInternal pullup ensures reliable startup without external resistor; accepts 1.5 V logic threshold for brownout detection.
BKGD/MSBackground debug / mode selectSingle-wire BDM interface pin; pulled high internally during normal operation; used for in-circuit debugging and programming.
XTALCrystal oscillator inputAccepts fundamental-mode crystals (1–16 MHz) or ceramic resonators; requires external load capacitors per XOSC configuration.
EXTALExternal clock inputAlternative clock source input up to 20 MHz; bypasses oscillator circuitry for precision timing or clock synchronization.

Key Features

FeatureDesign Value
FLASH Block ProtectionConfigurable protection of FLASH sectors prevents accidental overwrite or malicious firmware modification during field updates.
Low-Voltage DetectionProgrammable LVD threshold (2.5 V/2.7 V/2.9 V/3.1 V) with selectable reset or interrupt response - critical for battery-powered system safety.
Hardware-Triggered ADCRTI counter can initiate ADC conversions autonomously, enabling precise periodic sampling without CPU intervention or timer overhead.
ACMP-to-TPM RoutingAnalog comparator output directly controls TPM channel timing, allowing zero-latency PWM modulation based on analog thresholds (e.g., overcurrent shutdown).
Stop Mode Power OptimizationStop3 mode draws <1 µA typical; Stop1 retains RTC and KBI wake capability - extends battery life in intermittent-sensing applications.

Applications

Motor Control SupervisionSensor Signal Conditioning

Use Scenario: Monitoring current sense signals and thermal feedback in BLDC motor drivers to enforce safe commutation timing and fault shutdown.

IC Role / Device Role / Timing Role: Real-time supervisor executing closed-loop checks using ADC-triggered TPM PWM and ACMP-based overcurrent detection.

Use Value: Enables sub-10 µs response to overcurrent events via direct ACMP→TPM routing, eliminating software polling delay and improving system robustness.

Use Scenario: Digitizing analog outputs from pressure, humidity, and temperature sensors in HVAC control nodes with local calibration storage.

IC Role / Device Role / Timing Role: Sensor hub performing synchronized multi-channel ADC acquisition, internal temperature compensation, and I²C data aggregation.

Use Value: Integrated bandgap reference and on-die temperature sensor allow drift-compensated measurements without external components, reducing BOM cost and layout area.

Industrial Keypad InterfaceLow-Power Remote Telemetry Node

Use Scenario: Scanning mechanical or capacitive keypads in industrial HMIs with ESD-hardened I/O and debounce filtering.

IC Role / Device Role / Timing Role: Keyboard interrupt controller (KBI) scanning 8-key matrix while maintaining ultra-low standby current in Stop3 mode.

Use Value: Software-selectable edge/level polarity and internal pullups eliminate external biasing components, simplifying front-panel design and improving EMC immunity.

Use Scenario: Battery-operated environmental monitor transmitting sensor data via UART to LoRaWAN gateway every 15 minutes.

IC Role / Device Role / Timing Role: Sleep/wake coordinator managing RTC-triggered wake-up, ADC sampling, SCI transmission, and return to Stop3 mode.

Use Value: <1 µA Stop3 current and programmable LVD reset ensure >5-year battery life with standard CR123A cells under defined duty cycle.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08QG8CDTESame die, identical Flash/RAM (8 KB/512 B), but packaged in 24-pin QFN (98ASA00474D) - larger footprint, more I/O (20 total), no exposed pad.Requires PCB redesign; suited for designs needing additional GPIOs or legacy 24-pin layout compatibility.Select MC9S08QG8CDTE only when extra I/O or thermal margin via larger package is required - not drop-in compatible with MC9S08QG84CDTE.
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ MCU; 128 KB Flash, 16 KB RAM, higher performance, but no native BDM - uses SWD/JTAG instead.Targets migration paths requiring scalable processing, USB, or CAN; lacks direct replacement due to architecture and debug interface mismatch.Choose S9KEAZ128AMLH for new designs needing future-proofing, higher throughput, or peripheral expansion - not a functional substitute for MC9S08QG84CDTE in existing BDM-based toolchains.

Compared with MC9S08QG8CDTE and S9KEAZ128AMLH, the MC9S08QG84CDTE delivers optimal balance of proven industrial reliability, minimal BOM count, and seamless integration with legacy Freescale BDM tools - making it ideal for cost-constrained, long-lifecycle embedded controllers where pin count and thermal profile are primary constraints.

Availability

MC9S08QG84CDTE is available at Aetrix Electronics and suitable for motor control supervision, sensor signal conditioning, industrial keypad interface, and low-power remote telemetry node applications requiring stable component supply and long-term industrial temperature support.

Supply support for MC9S08QG84CDTE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and consumer markets.

The MC9S08QG84CDTE belongs to the HCS08 microcontroller family, engineered for cost-sensitive, low-power industrial control applications demanding high reliability, integrated analog peripherals, and streamlined development with single-wire debug.

FAQ

What is the maximum operating frequency of the MC9S08QG84CDTE CPU core?

The MC9S08QG84CDTE features an HCS08 CPU core rated for up to 20 MHz operation. This frequency is achieved using the internal clock source (ICS) with FLL enabled and properly configured external or internal reference. Bus speed scales directly with core frequency, enabling deterministic real-time execution with sub-microsecond interrupt response - essential for time-critical motor control loops and sensor sampling routines in the MC9S08QG84CDTE.

Does the MC9S08QG84CDTE support in-system programming via its debug interface?

Yes, the MC9S08QG84CDTE supports full in-system programming (ISP) through its single-wire background debug (BDM) interface. Using standard Freescale BDM tools (e.g., DEMO9S08QG8 evaluation board with P&E Micro debugger), users can erase, program, and verify FLASH memory - including security byte configuration - without removing the MC9S08QG84CDTE from the target PCB. This capability is integral to field firmware updates and production programming workflows for the MC9S08QG84CDTE.

What analog reference options are available for the ADC in the MC9S08QG84CDTE?

The MC9S08QG84CDTE ADC supports multiple reference configurations: internal bandgap (1.22 V nominal), external VREFH/VREFL pins, or AVDD/AVSS. The internal bandgap reference is factory-trimmed and temperature-stable, enabling accurate ratiometric measurements without external components. This flexibility allows the MC9S08QG84CDTE to adapt to varying sensor output ranges and power supply conditions while maintaining measurement integrity across its –40°C to +105°C operating range.

How does the MC9S08QG84CDTE handle low-voltage conditions during operation?

The MC9S08QG84CDTE integrates a programmable low-voltage detect (LVD) system with four selectable thresholds (2.5 V, 2.7 V, 2.9 V, 3.1 V). When supply voltage drops below the chosen threshold, it can generate either a non-maskable interrupt or a hardware reset - configurable via SRS register bits. This feature ensures safe shutdown or graceful state preservation before brownout, protecting both system integrity and stored data in the MC9S08QG84CDTE's FLASH and RAM.

Is the MC9S08QG84CDTE pin-compatible with other members of the QG8 family?

No, the MC9S08QG84CDTE is not pin-compatible with other QG8 variants. It uses a 16-pin QFN package (98ASA00671D), whereas MC9S08QG8CDTE uses a 24-pin QFN (98ASA00474D), and MC9S08QG8CPBE uses a 16-pin TSSOP. Pin assignments differ across packages - for example, PTA5 serves as RESET on the 16-pin QFN but maps to different functions in larger packages. Migration between variants requires PCB layout revision and signal reassignment for the MC9S08QG84CDTE.

MC9S08QG84CDTE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QG84CDTE FAQ

1.How can I place an order for MC9S08QG84CDTE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QG84CDTE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QG84CDTE reliable?

The price and inventory of MC9S08QG84CDTE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QG84CDTE is usually 5 days.

3.What payment methods are accepted for MC9S08QG84CDTE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QG84CDTE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08QG84CDTE?

MC9S08QG84CDTE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QG84CDTE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QG84CDTE?

For technical support, including MC9S08QG84CDTE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QG84CDTE requirements.

6.How does Aetrix verify that MC9S08QG84CDTE is sourced from the original manufacturer or authorized distributors?

All MC9S08QG84CDTE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QG84CDTE meets industry standards.

7.What is the process for return or replacement of MC9S08QG84CDTE?

All MC9S08QG84CDTE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QG84CDTE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QG84CDTE part is unused and in its original packaging.

Return procedure for MC9S08QG84CDTE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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