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NXP Semiconductors MC9S08QG8CDNE
- Part No.:
- MC9S08QG8CDNE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
MC9S08QG8CDNE.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:192
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Product details
Overview
MC9S08QG8CDNE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 20-MHz CPU, 8 KB FLASH, 512 bytes RAM, and integrated peripherals including 10-bit ADC, SCI, SPI, I²C, TPM, and ACMP. It operates in industrial temperature range (–40°C to +105°C) and targets low-cost embedded control in space-constrained applications such as motor drive interfaces and sensor signal conditioning.
For engineers reviewing the MC9S08QG8CDNE datasheet, MC9S08QG8CDNE pinout, MC9S08QG8CDNE application, or MC9S08QG8CDNE equivalent, key selection criteria include its 16-pin QFN package with exposed pad, single-wire background debug interface, internal clock source with FLL, and support for Wait/Stop power-saving modes - all critical for battery-powered and thermally sensitive designs.
Technical Context
The MC9S08QG8CDNE implements the HCS08 CPU core with HC08 instruction set extension (including BGND), on-chip debug module with two comparators and eight-deep FIFO, and supports up to 32 interrupt/reset sources. Its ICS module integrates a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature), enabling bus frequencies from 1 MHz to 10 MHz.
Peripherals are tightly coupled to the CPU via a unified memory map: ADC provides hardware-triggered 10-bit conversion with internal bandgap reference and temperature sensor; TPM delivers two-channel PWM with edge- and center-aligned modes; and ACMP output can be routed to TPM for analog event-driven timing control - all operating under active, wait, or Stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 20-MHz max operation - enables deterministic real-time control with minimal code footprint. |
| Memory | 8 KB on-chip FLASH (read/program/erase across full VDD/temp) and 512 bytes RAM - sufficient for firmware with sensor processing and communication stacks. |
| ADC | 8-channel, 10-bit SAR ADC with internal bandgap reference, temperature sensor, and RTI-triggered sampling - supports closed-loop thermal monitoring without external components. |
| Package | 16-pin QFN (98ASA00671D), 4×4 mm body, 0.5 mm pitch, exposed thermal pad - optimized for compact PCB layout and thermal dissipation in sealed enclosures. |
| Debug Interface | Single-wire background debug (BDM) with breakpoint capability and on-chip ICE - enables in-circuit debugging without dedicated JTAG pins or external probes. |
| Power Modes | Wait + three Stop modes (Stop1/Stop2/Stop3); COP watchdog runs from 1-kHz internal clock during Stop3 - extends battery life while retaining wake-on-event capability. |
| Operating Range | –40°C to +105°C ambient, 2.7–5.5 V supply - qualified for automotive under-hood and industrial motor-control environments. |
Pinout & Package
MC9S08QG8CDNE is housed in a 16-pin QFN package (case outline 98ASA00671D), 4 mm × 4 mm body, 0.5 mm lead pitch, with exposed thermal pad (EPAD) connected to VSS for enhanced thermal performance and EMI reduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage input | Primary power rail (2.7–5.5 V); must be decoupled near pin with 100 nF ceramic capacitor to ensure stable core/peripheral operation. |
| VSS | Ground reference | Digital ground return; EPAD must be soldered to VSS plane for thermal and noise integrity. |
| PTA0/IRQ | Programmable I/O / Interrupt request input | Edge-sensitive external interrupt pin with internal pullup; default high-true trigger unless polarity inverted in KBI register. |
| PTA1/BKGD | Background debug I/O | Single-wire BDM interface; requires 10 kΩ pullup to VDD and series resistor (100 Ω) for ESD protection during debug connection. |
| PTA2 | General-purpose I/O | Configurable as input (with software-selectable pullup) or output (10 mA sink/source, slew-rate controllable). |
| PTA3 | SCI TX / TPM channel 0 output | Shared function pin: drives UART transmit signal or TPM0 PWM waveform - selected via port control registers. |
| PTA4 | SCI RX / TPM channel 1 input | Shared function pin: receives UART data or captures TPM1 input edges - configured at runtime via peripheral enable bits. |
| PTA5 | ADC channel 0 / ACMP0 input | Analog input supporting 10-bit ADC conversion or comparator reference; requires external filtering if used for precision sensing. |
| PTA6 | ADC channel 1 / ACMP1 input | Second analog input shared between ADC and ACMP modules; supports differential measurement when paired with PTA5. |
| PTA7 | ADC channel 2 / I²C SCL | Open-drain I²C clock line or ADC input; external 4.7 kΩ pullup required for I²C operation. |
| PTB0 | ADC channel 3 / SPI MOSI | Master-out-slave-in data line or ADC input; driven by MCU during SPI writes, high-impedance when ADC active. |
| PTB1 | ADC channel 4 / SPI MISO | Master-in-slave-out data line or ADC input; tri-stated during ADC conversions to prevent analog contamination. |
| PTB2 | ADC channel 5 / SPI SCK | SPI clock output or ADC input; toggles only during SPI transfers; no effect on ADC timing when configured as analog input. |
| PTB3 | ADC channel 6 / SPI SS | Slave select input or ADC input; active-low signal asserted by master to initiate SPI transaction. |
| RESET | Active-low reset input | Asynchronous reset with internal 40 kΩ pullup; debounced externally or via LVD circuitry to prevent spurious resets. |
| EPAD | Exposed thermal pad | Must be soldered to solid VSS copper area ≥ 25 mm²; improves thermal resistance by ≤ 25°C/W and reduces radiated emissions. |
Key Features
| Feature | Design Value |
|---|---|
| Internal Clock Source (ICS) | FLL-controlled oscillator with factory-trimmed internal reference (±0.2% resolution), enabling 1–10 MHz bus frequencies without external crystal - reduces BOM cost and board area. |
| Hardware-Triggered ADC | RTI timer can initiate ADC conversions autonomously, allowing periodic sampling without CPU intervention - preserves CPU bandwidth for control algorithms. |
| ACMP-to-TPM Routing | Analog comparator output directly controls TPM channel operation, enabling analog threshold detection to trigger PWM duty cycle changes - supports adaptive motor current limiting. |
| FLASH Block Protection | Configurable protection of FLASH sectors via FPROT register prevents accidental overwrite of bootloader or calibration data during field firmware updates. |
| Low-Voltage Detection (LVD) | Detects supply drop below programmable threshold (2.5 V, 2.7 V, 3.0 V, or 3.3 V) and asserts interrupt or reset - safeguards against brownout-induced state corruption. |
Applications
| Motor Control Interface | Sensor Signal Conditioning |
|---|---|
Use Scenario: Compact BLDC motor driver in HVAC blower module requiring speed regulation, current sensing, and fault reporting over UART. IC Role / Device Role / Timing Role: Primary controller executing commutation logic, reading shunt-based current feedback via ADC, and transmitting status via SCI. Use Value: Integrated TPM PWM with center-aligned mode and ACMP-triggered shutdown ensures precise timing and fast overcurrent response (< 2 µs latency). | Use Scenario: Industrial temperature/humidity sensor node with analog outputs and battery backup. IC Role / Device Role / Timing Role: Signal acquisition unit digitizing thermistor and capacitive humidity signals, performing linearization, and transmitting via I²C to host MCU. Use Value: On-chip temperature sensor and bandgap reference eliminate external precision references; Stop3 mode draws < 1 µA, extending 10-year battery life. |
| Smart Power Outlet | Automotive Body Control Module |
Use Scenario: DIN-rail mounted smart outlet with load current monitoring, relay control, and energy metering. IC Role / Device Role / Timing Role: System manager handling zero-cross detection (via ACMP), RMS current calculation (ADC + MTIM), and relay timing (TPM). Use Value: Hardware-triggered ADC synchronized to AC line via ACMP edge eliminates software timing jitter in energy calculations. | Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN communication. IC Role / Device Role / Timing Role: Subsystem controller interfacing with potentiometers, switches, and LIN transceiver; managing PWM dimming and position feedback. Use Value: Single-wire BDM allows in-vehicle firmware updates without disassembly; –40°C to +105°C rating ensures reliability in door cavity environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9RS08KB12CDTE | RS08 core (10-MHz max), 1.5 KB FLASH, 128 bytes RAM, no ADC, 8-pin TSSOP/QFN - lower cost, reduced peripheral set. | Limited to simple switch monitoring or LED control; lacks analog front-end and PWM resolution for motor control. | Select when system requires only digital I/O and ultra-low cost; not suitable for sensor acquisition or variable-speed drive. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB FLASH, 16 KB RAM, 12-bit ADC, 32 MHz, 48-pin LQFP - higher performance, richer peripheral set, modern toolchain. | Supports CAN, USB, advanced motor control libraries; requires larger PCB area and higher power budget. | Select for next-generation designs needing scalability, safety certification (IEC 61508), or multi-protocol connectivity beyond MC9S08QG8CDNE capabilities. |
Compared with MC9S08QG8CDNE, MC9RS08KB12CDTE offers lower gate count and BOM cost but sacrifices analog integration and debug depth, while S9KEAZ128AMLH delivers architectural headroom and ecosystem maturity at the expense of footprint and power efficiency in legacy-compatible deployments.
Availability
MC9S08QG8CDNE is available at Aetrix Electronics and suitable for motor control interfaces, sensor signal conditioning, smart power outlets, and automotive body electronics requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08QG8CDNE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors, analog, and mixed-signal ICs for automotive, industrial, and consumer markets.
The MC9S08QG8CDNE belongs to the HCS08 microcontroller family, engineered for cost-sensitive, space-constrained embedded control applications demanding robust analog integration, low-power operation, and field-debuggable firmware.
FAQ
What is the maximum operating frequency of the MC9S08QG8CDNE CPU core?
The MC9S08QG8CDNE features an HCS08 CPU core rated for up to 20 MHz operation. This frequency is achieved using the internal clock source (ICS) with its frequency-locked loop (FLL), which can generate bus frequencies from 1 MHz to 10 MHz - meaning the core executes instructions at 20 MHz while the peripheral bus runs at half that rate. The MC9S08QG8CDNE datasheet confirms this timing relationship in Section 10.4.1 and Table A-5.
Does the MC9S08QG8CDNE support in-circuit debugging, and what interface is used?
Yes, the MC9S08QG8CDNE supports in-circuit debugging via a single-wire background debug (BDM) interface on the PTA1/BKGD pin. This interface enables breakpoint setting, real-time bus capture, and flash programming without requiring additional pins or external debug probes. The MC9S08QG8CDNE debug module includes two comparators and nine trigger modes, as documented in Chapter 17 of the Rev. 5 datasheet.
What analog peripherals are integrated into the MC9S08QG8CDNE?
The MC9S08QG8CDNE integrates an 8-channel, 10-bit analog-to-digital converter (ADC) with internal bandgap reference and temperature sensor, plus a dual-channel analog comparator (ACMP) with selectable internal reference. Both modules support hardware triggering - the ADC via the RTI counter and ACMP output routed to TPM for event-driven timing. These capabilities are fully specified in Chapters 9 and 8 of the MC9S08QG8CDNE datasheet.
What power-saving modes does the MC9S08QG8CDNE offer, and how do they differ?
The MC9S08QG8CDNE supports Wait mode plus three Stop modes (Stop1, Stop2, Stop3). Stop3 offers the lowest power consumption (< 1 µA) with the COP watchdog running from a dedicated 1-kHz internal clock, while Stop1/Stop2 retain more peripheral clocks and RAM retention. All modes preserve FLASH and register contents. Detailed current measurements and wake-up sources are provided in Section 3.6 and Appendix A of the MC9S08QG8CDNE datasheet.
Is the MC9S08QG8CDNE pinout compatible with other members of the QG family, such as the MC9S08QG4?
No, the MC9S08QG8CDNE is not pin-compatible with the MC9S08QG4 in the same package variant. While both share the 16-pin QFN option, the MC9S08QG4 uses case outline 98ASA00671D only in 8-pin packages (PDIP/SOIC/DFN); the 16-pin QFN variant is exclusive to MC9S08QG8. Pin assignments, peripheral mappings, and voltage tolerances differ - direct substitution requires PCB redesign and firmware validation per the MC9S08QG8CDNE and MC9S08QG4 datasheets.
MC9S08QG8CDNE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 4
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08QG8CDNE FAQ
1.How can I place an order for MC9S08QG8CDNE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08QG8CDNE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08QG8CDNE reliable?
The price and inventory of MC9S08QG8CDNE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QG8CDNE is usually 5 days.
3.What payment methods are accepted for MC9S08QG8CDNE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QG8CDNE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08QG8CDNE?
MC9S08QG8CDNE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08QG8CDNE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08QG8CDNE?
For technical support, including MC9S08QG8CDNE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QG8CDNE requirements.
6.How does Aetrix verify that MC9S08QG8CDNE is sourced from the original manufacturer or authorized distributors?
All MC9S08QG8CDNE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QG8CDNE meets industry standards.
7.What is the process for return or replacement of MC9S08QG8CDNE?
All MC9S08QG8CDNE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QG8CDNE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08QG8CDNE part is unused and in its original packaging.
Return procedure for MC9S08QG8CDNE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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