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NXP Semiconductors MC9S08QG8CDTE

Part No.:
MC9S08QG8CDTE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08QG8CDTE.pdf
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,975

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Product details

Overview

MC9S08QG8CDTE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 20-MHz CPU, 8 KB FLASH/512 B RAM, internal clock source with FLL, and integrated peripherals including 10-bit ADC, SCI, SPI, I²C, TPM, ACMP, and KBI. It targets cost-sensitive embedded control in automotive body electronics, industrial sensors, and appliance motor control.

For engineers reviewing the MC9S08QG8CDTE datasheet, MC9S08QG8CDTE pinout, MC9S08QG8CDTE application, or MC9S08QG8CDTE equivalent, key selection criteria include QFN-16 package compatibility, single-wire background debug support, 12 GPIO + dedicated reset/IRQ pins, 10-bit ADC with temperature sensor, and COP watchdog with independent 1-kHz clock source.

Technical Context

The MC9S08QG8CDTE implements the S08CPUV2 core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and hardware breakpoint capability via on-chip debug module with two comparators and nine trigger modes. Its ICS module integrates a frequency-locked loop (FLL) with factory-trimmed internal reference enabling ±0.2% resolution and ±2% deviation over voltage/temperature.

Peripherals are tightly coupled to the bus architecture: ADC supports hardware triggering by RTI counter and includes automatic compare function with internal bandgap reference; TPM provides two channels configurable for input capture, output compare, or edge/center-aligned PWM; ACMP output can be routed directly to TPM for analog event-driven timing control.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 S08CPUV2 with BGND instruction and 20-MHz max operation - enables deterministic real-time control with minimal code footprint.
Memory 8 KB on-chip FLASH (read/program/erase across full VDD/temp range) and 512 bytes RAM - supports field firmware updates without external memory.
ADC 8-channel, 10-bit SAR ADC with asynchronous clock, internal bandgap reference, temperature sensor, and RTI-triggered conversion - enables precise sensor monitoring with low MCU overhead.
Debug Interface Single-wire background debug (BKGD/MS pin) with 8-deep FIFO for change-of-flow addresses - allows non-intrusive in-circuit debugging using minimal PCB routing.
Power Modes Wait + Stop1/Stop2/Stop3 modes; COP watchdog operable from dedicated 1-kHz internal clock during Stop3 - extends battery life in intermittent-sensing applications.
I/O Capability 12 general-purpose I/O pins (10 mA sink/source each, 60 mA package total), software-selectable pullups/slew rate/drive strength - simplifies interface to switches, LEDs, and legacy logic without external components.
Package 16-pin QFN (98ASA00671D) with exposed thermal pad - provides compact footprint and enhanced thermal performance for space-constrained PCBs.

Pinout & Package

MC9S08QG8CDTE is housed in a 16-pin quad flat no-lead (QFN) package per outline 98ASA00671D, featuring an exposed thermal pad for improved heat dissipation in thermally demanding environments.

Pin/Terminal Circuit Role Design Meaning
VDD Supply voltage (2.7–3.6 V) Primary power rail for digital and analog domains; requires local decoupling to ensure stable operation of ADC and ICS modules.
VSS Digital ground Reference return path for all digital I/O and core logic; must be connected to PCB ground plane with low-inductance path.
VDDAD Analog supply Separate 2.7–3.6 V rail for ADC and ACMP; isolation from digital VDD reduces noise coupling into precision analog measurements.
VSSAD Analog ground Dedicated analog return; should be tied to digital ground at single point near VDDAD/VDD to minimize ground bounce in mixed-signal operation.
PTA0–PTA5 Port A general-purpose I/O 6-bit bidirectional port with software-configurable pullups, slew rate, and drive strength; PTA5 has internal pullup enabled on reset.
PTB0–PTB5 Port B general-purpose I/O 6-bit bidirectional port; PTB0–PTB3 support keyboard interrupt (KBI) functionality with edge/level detection.
RESET Active-low reset input Asynchronous reset with internal pullup; accepts external pushbutton or supervisor IC signal; triggers full system initialization.
IRQ Interrupt request input Edge-sensitive external interrupt with internal pullup; used for wake-up from low-power modes or priority event handling.
BKGD/MS Background debug / mode select Single-wire debug interface pin; also selects boot mode (normal vs. special bootstrap loader) during reset assertion.
XIN/XOUT Crystal/resonator connection Differential oscillator inputs supporting 31.25 kHz–16 MHz crystals or ceramic resonators; optional external clock input up to 20 MHz.

Key Features

Feature Design Value
FLASH Block Protection Configurable protection of FLASH sectors via FPROT/NVPROT registers prevents accidental overwrite of bootloader or calibration data during field updates.
Internal Clock Source (ICS) FLL-controlled internal reference with factory trimming achieves ±0.2% resolution and ±2% accuracy over temperature/voltage - eliminates need for external crystal in cost-sensitive timing applications.
Real-Time Interrupt (RTI) Programmable periodic interrupt generator with 16-bit modulo counter and selectable prescaler - enables precise timekeeping for sensor sampling or communication timeouts without consuming CPU cycles.
ADC Temperature Sensor On-die temperature sensor channel calibrated at factory and accessible via ADC channel 7 - provides direct die-temperature measurement for thermal management without external components.
Low-Voltage Detection (LVD) Configurable LVD threshold (2.5 V or 2.7 V) with reset or interrupt option - protects system integrity during brown-out conditions while allowing graceful shutdown or data retention.

Applications

Automotive Body Control Module Industrial Temperature Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level vehicles.

IC Role / Device Role / Timing Role: Main system controller executing CAN/LIN gateway logic, PWM motor drive, and switch debouncing.

Use Value: Integrated 10-bit ADC reads potentiometer position feedback; TPM channels generate synchronized PWM for DC motor speed control; single-wire debug enables production-line programming and diagnostics.

Use Scenario: Battery-powered wireless node measuring ambient and equipment temperature in HVAC or manufacturing environments.

IC Role / Device Role / Timing Role: Sensor acquisition and preprocessing unit with ultra-low-power sleep/wake cycling.

Use Value: On-die temperature sensor eliminates external sensor cost; Stop3 mode with COP running from 1-kHz clock extends battery life to >5 years; SCI interface supports UART-to-LoRaWAN bridge firmware.

Home Appliance Motor Controller Smart Power Outlet with Load Monitoring

Use Scenario: Speed and direction control of universal motors in vacuum cleaners or blenders.

IC Role / Device Role / Timing Role: Real-time motor commutation controller interfacing with zero-crossing detector and triac driver.

Use Value: ACMP compares zero-crossing signal to internal reference and triggers TPM output compare to precisely time triac firing; KBI detects user button presses without CPU polling.

Use Scenario: Energy-monitoring outlet that measures current, voltage, and power factor for smart home integration.

IC Role / Device Role / Timing Role: Analog front-end processor acquiring and conditioning shunt-based current signals before transmission to host MCU.

Use Value: 10-bit ADC with internal bandgap reference ensures stable current measurement across line voltage variations; hardware-triggered conversions reduce jitter in RMS calculation; FLASH retains calibration coefficients across power cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08QG8CPBE Same core, memory, and peripheral set; packaged in 16-pin PDIP instead of QFN - larger footprint, no exposed thermal pad, through-hole mounting. Preferred for prototyping or low-volume manual assembly where QFN reflow is unavailable. Select MC9S08QG8CPBE when board assembly uses wave soldering or breadboarding is required; QFN package offers better thermal performance and smaller area.
S9S08QG8J2CTJR NXP rebranded version post-Freescale acquisition; identical electrical specs and pinout; updated maskset (rev J2) with minor errata fixes. Identical functional replacement with extended long-term availability and NXP's support infrastructure. Choose S9S08QG8J2CTJR for new designs requiring guaranteed supply continuity and access to NXP's design tools and documentation portal.

Compared with MC9S08QG8CDTE, MC9S08QG8CPBE trades thermal efficiency and miniaturization for assembly flexibility, while S9S08QG8J2CTJR delivers identical functionality with enhanced lifecycle assurance and modern toolchain integration - both serve as validated alternatives without requiring schematic or layout changes.

Availability

MC9S08QG8CDTE is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance motor control, and smart power outlet designs requiring stable component supply and long-term manufacturability.

Supply support for MC9S08QG8CDTE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a leading designer of embedded processors, analog, and connectivity solutions, acquired by NXP Semiconductors in 2015. Its HCS08 family established benchmarks for low-cost, low-power 8-bit microcontrollers.

The MC9S08QG8 series was designed for cost-sensitive, space-constrained embedded control applications requiring robust analog integration, debug capability, and automotive-grade reliability - particularly in body electronics and appliance subsystems.

FAQ

What is the maximum operating frequency of the MC9S08QG8CDTE CPU?

The MC9S08QG8CDTE features a 20-MHz HCS08 CPU core. This maximum bus frequency is achievable using the internal clock source (ICS) with FLL enabled and properly configured external crystal or resonator, or via the XOSC module with 1–16 MHz crystal. The CPU executes instructions at this rate, enabling responsive real-time control in applications such as motor commutation and sensor polling.

Does the MC9S08QG8CDTE support in-circuit debugging, and what interface is used?

Yes, the MC9S08QG8CDTE supports in-circuit debugging via a single-wire background debug interface using the BKGD/MS pin. This interface enables full read/write memory access, register inspection, breakpoint setting (one hardware + two debug-module breakpoints), and real-time bus capture without halting peripheral operation - critical for validating timing-critical firmware during development.

What analog peripherals are integrated into the MC9S08QG8CDTE?

The MC9S08QG8CDTE integrates an 8-channel, 10-bit analog-to-digital converter (ADC) with internal bandgap reference, temperature sensor channel, and RTI-triggered conversion; plus an analog comparator (ACMP) with internal reference option and output routable to TPM for event-driven timing. These enable standalone sensor processing without external signal conditioning in applications like thermal monitoring and zero-crossing detection.

What power-saving modes does the MC9S08QG8CDTE offer, and how do they differ?

The MC9S08QG8CDTE provides Wait mode plus three Stop modes (Stop1, Stop2, Stop3). Stop3 offers deepest power reduction (sub-μA), retaining RAM and selected registers while disabling clocks to most peripherals; crucially, the COP watchdog remains active using its dedicated 1-kHz internal clock. Stop1/Stop2 retain more peripheral state but consume higher current - selection depends on wake-up latency and retention requirements.

Is the MC9S08QG8CDTE pin-compatible with other members of the QG8 family?

Yes, the MC9S08QG8CDTE shares identical pinout and electrical characteristics with other 16-pin QFN variants in the QG8 family, including MC9S08QG4CDTE (4 KB FLASH/256 B RAM). This allows scalable design reuse: firmware and PCB layout remain unchanged when migrating between memory configurations, reducing qualification effort and accelerating product variants.

MC9S08QG8CDTE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QG8CDTE FAQ

1.How can I place an order for MC9S08QG8CDTE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QG8CDTE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QG8CDTE reliable?

The price and inventory of MC9S08QG8CDTE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QG8CDTE is usually 5 days.

3.What payment methods are accepted for MC9S08QG8CDTE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QG8CDTE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08QG8CDTE?

MC9S08QG8CDTE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QG8CDTE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QG8CDTE?

For technical support, including MC9S08QG8CDTE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QG8CDTE requirements.

6.How does Aetrix verify that MC9S08QG8CDTE is sourced from the original manufacturer or authorized distributors?

All MC9S08QG8CDTE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QG8CDTE meets industry standards.

7.What is the process for return or replacement of MC9S08QG8CDTE?

All MC9S08QG8CDTE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QG8CDTE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QG8CDTE part is unused and in its original packaging.

Return procedure for MC9S08QG8CDTE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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