Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC9S08QG8CFFE

Part No.:
MC9S08QG8CFFE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-VQFN Exposed Pad
Datasheet:
AetrixMC9S08QG8CFFE.pdf
Description:
IC MCU 8BIT 8KB FLASH 16QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,835

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC9S08QG8CFFE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 20-MHz CPU, 8 KB Flash memory, 512 bytes RAM, and integrated peripherals including 10-bit ADC, SCI, SPI, I²C, TPM, ACMP, and MTIM. It operates in industrial temperature range (–40°C to +105°C) and supports multiple low-power stop modes. It is used in cost-sensitive embedded control applications such as appliance motor control and sensor interface modules.

For engineers reviewing the MC9S08QG8CFFE datasheet, MC9S08QG8CFFE pinout, MC9S08QG8CFFE application, or MC9S08QG8CFFE equivalent, key selection criteria include its 16-pin QFN package with exposed pad, single-wire background debug interface, internal clock source with FLL and ±2% accuracy over voltage/temperature, and hardware-triggerable ADC with temperature sensor channel.

Technical Context

The MC9S08QG8CFFE implements the S08CPUV2 core with HC08 instruction set extension and BGND instruction support. Its debug module includes two comparators, nine trigger modes, and an eight-deep FIFO for flow-address capture - enabling real-time in-circuit debugging without external probes.

System clocking combines ICS (FLL-based internal source, 1–10 MHz bus frequency) and XOSC (crystal/resonator support from 31.25 kHz to 16 MHz). The ADC features asynchronous clocking, automatic compare, internal bandgap reference, and RTI-triggered conversion - all configurable without CPU intervention.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 S08CPUV2 with 20-MHz max operation and BGND instruction for single-wire debug
Memory 8 KB on-chip FLASH (read/program/erase across full VDD/temp), 512 bytes RAM
ADC 8-channel, 10-bit SAR ADC with internal bandgap reference, temperature sensor input, and RTI hardware trigger
Package 16-pin QFN (98ASA00671D), 4×4 mm body, 0.5 mm pitch, exposed thermal pad
Power Modes Run, Wait, Stop1, Stop2, Stop3 - with COP watchdog optionally clocked from 1-kHz internal source
I/O Capability 12 general-purpose I/O pins (10 mA sink/source each), 1 input-only, 1 output-only; software-selectable pullups/slew rate
Clock Sources ICS with FLL (1–10 MHz bus), XOSC supporting crystals from 31.25 kHz to 16 MHz, or external clock up to 20 MHz

Pinout & Package

MC9S08QG8CFFE is housed in a 16-pin QFN package (case outline 98ASA00671D), 4 mm × 4 mm body, 0.5 mm pitch, with exposed thermal pad for enhanced thermal dissipation in compact PCB layouts.

Pin/Terminal Circuit Role Design Meaning
VDD Supply voltage input Core and I/O power supply (2.7–5.5 V); decoupling required near pin
VSS Ground reference Digital ground return; tied to exposed pad for thermal and EMI performance
PTA0/IRQ Interrupt request input Edge-sensitive external interrupt pin with internal pullup; shares port A bit 0
PTA1/BKGD Background debug interface Single-wire debug communication line; requires external pullup and series resistor
PTA2 General-purpose I/O Programmable as input/output with software-selectable pullup and slew rate
PTA3 General-purpose I/O Supports keyboard interrupt (KBI) edge detection; shares with KBI function
PTA4 General-purpose I/O Configurable as analog input (AD0) or digital I/O via APCTL registers
PTA5 General-purpose I/O Can serve as ACMP0 output or TPM channel; supports comparator-to-TPM routing
PTB0 General-purpose I/O SCI transmit (TXD) or SPI MOSI function; multiplexed peripheral capability
PTB1 General-purpose I/O SCI receive (RXD) or SPI MISO function; supports full-duplex serial communication
PTB2 General-purpose I/O TPM channel 0 input capture/output compare; supports PWM generation
PTB3 General-purpose I/O TPM channel 1 input capture/output compare; enables dual-channel timing control
RESET Active-low reset input Internal pullup ensures reliable reset assertion; accepts external pushbutton or supervisor IC
XTAL Clock oscillator input Connects to crystal/resonator or external clock source; pairs with EXTAL pin
EXTAL Clock oscillator output Drives crystal/resonator; must be left unconnected when using external clock input
EXPOSED PAD Thermal and electrical ground Must be soldered to PCB ground plane for thermal management and noise reduction

Key Features

Feature Design Value
Background Debug Interface Single-wire BDM enables in-circuit programming and real-time trace without JTAG header footprint
FLL-Based Internal Clock Source ICS module delivers stable 1–10 MHz bus clock with ±2% deviation over –40°C to +105°C and full VDD range
Hardware-Triggered ADC RTI timer can initiate conversions autonomously - freeing CPU for other tasks during sensor sampling
Integrated Temperature Sensor On-die thermal sensor feeds ADC channel AD7, enabling system-level thermal monitoring without external components
Flash Block Protection FPROT register allows selective write/erase protection of FLASH sectors - critical for bootloader and parameter storage security
Low-Voltage Detection LVD circuit provides configurable reset or interrupt at 2.5 V or 2.7 V thresholds - preventing erratic operation during brownout

Applications

Home Appliance Control Industrial Sensor Node

Use Scenario: Microcontroller in washing machine main control board managing motor drive, water valve actuation, and user interface.

IC Role / Device Role / Timing Role: Central system controller executing real-time motor commutation logic and ADC-based current sensing.

Use Value: Integrated TPM channels generate precise PWM for BLDC motor control; on-chip LVD prevents firmware corruption during mains dips.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and ambient light in factory settings.

IC Role / Device Role / Timing Role: Low-power data acquisition node with autonomous ADC sampling and SPI-connected sensors.

Use Value: Stop3 mode draws <1 µA; internal temperature sensor eliminates external thermistor; RTI-triggered ADC reduces active time per sample.

Smart Lighting Driver Point-of-Sale Peripheral

Use Scenario: LED driver module regulating brightness and color mixing in commercial lighting fixtures.

IC Role / Device Role / Timing Role: PWM generator and I²C slave interfacing with master lighting controller.

Use Value: Dual TPM channels deliver synchronized center-aligned PWM for flicker-free dimming; I²C supports multi-drop configuration with addressable slaves.

Use Scenario: Barcode scanner or magnetic stripe reader requiring serial host communication and button debounce.

IC Role / Device Role / Timing Role: Serial protocol translator and keyboard interrupt handler for physical input keys.

Use Value: SCI supports 9600–115200 baud with 13-bit break detection for frame sync; KBI module handles 8-key matrix with edge/level polarity selection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08QG4CFFE 4 KB FLASH, 256 bytes RAM, identical pinout and peripheral set Lower memory capacity limits firmware size and feature depth Select when application code fits within 4 KB and cost sensitivity outweighs future scalability
S9S08QG8CFFE Same silicon die; rebranded part post-NXP acquisition, identical electrical specs and package No functional difference; NXP documentation uses updated branding and support channels Prefer for new designs requiring long-term NXP technical support and updated toolchain compatibility

Compared with MC9S08QG8CFFE, the MC9S08QG4CFFE offers reduced memory for simpler applications, while the S9S08QG8CFFE provides identical functionality under NXP's post-acquisition support framework - enabling continuity without hardware redesign.

Availability

MC9S08QG8CFFE is available at Aetrix Electronics and suitable for home appliance control, industrial sensor nodes, smart lighting drivers, and point-of-sale peripherals requiring stable component supply and long-lifecycle support.

Supply support for MC9S08QG8CFFE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a leading designer of embedded processors and analog chips, acquired by NXP Semiconductors in 2015. Its HCS08 family pioneered cost-optimized 8-bit MCU architectures for industrial and consumer markets.

The MC9S08QG8CFFE belongs to the HCS08 QG-series, designed specifically for space-constrained, low-cost embedded control where small footprint, integrated analog peripherals, and single-wire debug are essential.

FAQ

What is the operating voltage range for the MC9S08QG8CFFE?

The MC9S08QG8CFFE operates from 2.7 V to 5.5 V across the full industrial temperature range (–40°C to +105°C). This wide supply range supports both 3.3 V and 5 V system designs without level-shifting, and the internal LVD circuit provides programmable reset thresholds at 2.5 V or 2.7 V to prevent malfunction during brownout conditions. The MC9S08QG8CFFE maintains full peripheral functionality and Flash programming capability across this entire voltage window.

Does the MC9S08QG8CFFE support in-circuit debugging without additional hardware?

Yes, the MC9S08QG8CFFE integrates a single-wire background debug module accessible via the BKGD/MS pin (PTA1), eliminating the need for dedicated JTAG headers or external debug probes. This interface supports full read/write memory access, breakpoint setting (one active plus two in debug module), and real-time bus capture - all using only one I/O pin and minimal external components (pullup resistor and series termination). The MC9S08QG8CFFE debug architecture is fully compatible with standard P&E Micro and SEGGER tools.

What package type and thermal characteristics does the MC9S08QG8CFFE use?

The MC9S08QG8CFFE is packaged in a 16-pin QFN (98ASA00671D) with 4 mm × 4 mm body, 0.5 mm pitch, and an exposed thermal pad. The pad must be soldered to a PCB ground plane to achieve θJA ≈ 50°C/W and sustain continuous operation at +105°C ambient. This package enables high-density layouts while delivering thermal performance comparable to larger SOIC variants - a key advantage for space-constrained applications like smart lighting modules and portable sensors.

Can the MC9S08QG8CFFE's ADC measure temperature internally?

Yes, the MC9S08QG8CFFE includes a calibrated on-die temperature sensor connected to ADC channel AD7. When enabled via the APCTL registers, it delivers ratiometric readings referenced to the internal bandgap voltage, requiring no external components. The sensor is factory-trimmed and supports accurate system-level thermal monitoring across –40°C to +105°C - commonly used in motor control and power supply thermal foldback circuits. The MC9S08QG8CFFE ADC also supports hardware triggering via the RTI timer for autonomous sampling.

How does the MC9S08QG8CFFE handle low-power operation in battery-powered systems?

The MC9S08QG8CFFE supports five power modes: Run, Wait, Stop1, Stop2, and Stop3. In Stop3 mode, current consumption drops below 1 µA with RTC and LVD active - ideal for infrequent wake-up events in battery-powered nodes. The COP watchdog can run from a dedicated 1-kHz internal clock, allowing safe deep-sleep operation without external timing components. Wake-up sources include IRQ, KBI, RTI, and ACMP - all configurable to minimize active time. The MC9S08QG8CFFE's low-voltage detection and Flash block protection further enhance reliability in energy-constrained deployments.

MC9S08QG8CFFE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-VQFN Exposed Pad
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QG8CFFE FAQ

1.How can I place an order for MC9S08QG8CFFE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QG8CFFE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QG8CFFE reliable?

The price and inventory of MC9S08QG8CFFE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QG8CFFE is usually 5 days.

3.What payment methods are accepted for MC9S08QG8CFFE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QG8CFFE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08QG8CFFE?

MC9S08QG8CFFE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QG8CFFE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QG8CFFE?

For technical support, including MC9S08QG8CFFE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QG8CFFE requirements.

6.How does Aetrix verify that MC9S08QG8CFFE is sourced from the original manufacturer or authorized distributors?

All MC9S08QG8CFFE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QG8CFFE meets industry standards.

7.What is the process for return or replacement of MC9S08QG8CFFE?

All MC9S08QG8CFFE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QG8CFFE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QG8CFFE part is unused and in its original packaging.

Return procedure for MC9S08QG8CFFE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S08QG8CFFE Tags

  • MC9S08QG8CFFE
  • MC9S08QG8CFFE PDF
  • MC9S08QG8CFFE Datasheet
  • MC9S08QG8CFFE Specifications
  • MC9S08QG8CFFE Images
  • NXP Semiconductors
  • NXP Semiconductors MC9S08QG8CFFE
  • Buy MC9S08QG8CFFE
  • MC9S08QG8CFFE Price
  • MC9S08QG8CFFE Distributor
  • MC9S08QG8CFFE Supplier
  • MC9S08QG8CFFE Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER