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NXP Semiconductors MC9S08QG8CFKE

Part No.:
MC9S08QG8CFKE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
24-VFQFN Exposed Pad
Datasheet:
AetrixMC9S08QG8CFKE.pdf
Description:
IC MCU 8BIT 8KB FLASH 24QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,302

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Product details

Overview

MC9S08QG8CFKE from Freescale Semiconductor is an 8-bit HCS08 microcontroller featuring a 20-MHz CPU, 8 KB Flash/512 B RAM, internal clock source with FLL, and integrated peripherals including 10-bit ADC, SCI, SPI, I²C, TPM, ACMP, and KBI. It operates across industrial temperature range (–40°C to +105°C) in a 16-pin QFN package and targets cost-sensitive embedded control applications such as motor drive supervision and sensor interface modules.

For engineers reviewing the MC9S08QG8CFKE datasheet, MC9S08QG8CFKE pinout, MC9S08QG8CFKE application, or MC9S08QG8CFKE equivalent, key selection criteria include its single-wire background debug interface, copper-wire QFN package (98ASA00671D), 12 GPIO + 1 input-only + 1 output-only pin configuration, and support for Wait/Stop1/Stop2/Stop3 low-power modes - all critical for space-constrained, battery-aware designs.

Technical Context

The MC9S08QG8CFKE implements the S08CPUV2 core with HC08 instruction set extension (BGND), on-chip debug module with two comparators and eight-deep FIFO, and supports up to 32 interrupt/reset sources. Its ICS module delivers bus frequencies from 1 MHz to 10 MHz using FLL with factory-trimmed internal reference (±2% deviation over voltage/temperature).

Peripherals are tightly coupled to power management: ADC supports hardware triggering via RTI counter; ACMP output can route to TPM for event-driven timing; and KBI provides 8-pin keyboard interrupt with software-selectable edge/level polarity. All I/O pins feature configurable pullups, slew rate, and drive strength - enabling direct interface with mechanical switches, analog sensors, and digital logic without external components.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 S08CPUV2 with BGND instruction and 20-MHz max operation - enables deterministic real-time control at low gate count.
Memory 8 KB on-chip FLASH (read/program/erase over full VDD/temp) and 512 bytes RAM - sufficient for firmware with ADC data logging and PWM control loops.
ADC 8-channel, 10-bit SAR ADC with internal bandgap reference, temperature sensor, and automatic compare - supports closed-loop thermal monitoring without external references.
Clock Sources ICS with FLL (1–10 MHz bus) + XOSC supporting crystal/ceramic (31.25 kHz–16 MHz) or external clock ≤20 MHz - allows flexible timing architecture with no external oscillator required.
Power Modes Wait + Stop1/Stop2/Stop3 - Stop3 draws ≤1 µA typical, enabling multi-year battery life in intermittent-sensing applications.
I/O Capability 12 general-purpose I/O, 1 input-only (IRQ), 1 output-only (RESET); 10 mA per output, 60 mA total package sink/source - drives LEDs, small relays, or logic buffers directly.
Debug Interface Single-wire background debug (BKGD/MS pin) with on-chip ICE and real-time bus capture - eliminates need for JTAG header, reducing PCB area and BOM cost.

Pinout & Package

MC9S08QG8CFKE is housed in a 16-pin quad flat no-lead (QFN) package with exposed thermal pad (case outline 98ASA00671D), using copper wire bonding per Freescale QFN migration addendum (Rev. 0, 07/2014). Dimensions: 4 mm × 4 mm × 0.85 mm, pitch: 0.65 mm.

Pin/Terminal Circuit Role Design Meaning
VDD Supply voltage (2.7–5.5 V) Primary power rail; must be decoupled locally to ensure stable ADC and CPU operation under transient load.
VSS Digital ground Reference return for digital logic and I/O; separate from analog ground (VSSAD) in mixed-signal layout.
PTA0–PTA5 Port A general-purpose I/O 6-bit bidirectional port with software-selectable pullups, slew rate, and drive strength - configurable as ADC inputs, SCI TX/RX, or TPM channels.
PTB0–PTB5 Port B general-purpose I/O 6-bit bidirectional port supporting KBI interrupt, ACMP inputs, and SPI signals; PTA5 and PTB0 share IRQ functionality.
RESET Active-low reset input (output-only) Internal pullup reduces external component count; asserts on power-on, COP timeout, or LVD event.
IRQ External interrupt request (input-only) Edge-triggered interrupt source with internal pullup; used for wake-from-Stop or asynchronous event capture.
BKGD/MS Background debug / mode select Single-wire debug interface pin; also selects active background mode during reset - requires no additional debug connector footprint.
XTAL/EXTAL Clock oscillator input/output Supports crystal, ceramic resonator, or external clock source; enables precise timing for communication or sampling when ICS FLL insufficient.

Key Features

Feature Design Value
FLASH Block Protection Configurable protection of FLASH sectors prevents accidental overwrite of bootloader or calibration data during field firmware updates.
On-Chip COP Watchdog Dedicated 1-kHz internal clock option ensures reliable system recovery even if main clock fails - critical for safety-critical motor control.
Hardware-Triggered ADC RTI counter triggers ADC conversions autonomously - enables precise periodic sampling without CPU intervention or timer ISR overhead.
ACMP-to-TPM Routing Analog comparator output directly controls TPM channel - allows zero-crossing detection to initiate PWM duty cycle adjustment in real time.
Low-Voltage Detect (LVD) Configurable reset or interrupt on VDD drop below threshold - protects against erratic behavior during brownout conditions in automotive or industrial power environments.

Applications

Motor Control Supervision Sensor Signal Conditioning

Use Scenario: Monitoring current sense, temperature, and hall-effect feedback in BLDC motor drivers.

IC Role / Device Role / Timing Role: MCU supervising fault detection, commutation timing, and closed-loop speed regulation via TPM PWM outputs.

Use Value: Integrated 10-bit ADC with internal bandgap reference and ACMP-to-TPM routing enables real-time overcurrent cutoff within <1 µs latency - eliminating external comparators and discrete logic.

Use Scenario: Interfacing thermistors, potentiometers, and pressure transducers in HVAC control panels.

IC Role / Device Role / Timing Role: Signal acquisition node converting analog sensor outputs to digital values for display or wireless transmission.

Use Value: Hardware-triggered ADC with RTI timer ensures consistent 100 Hz sampling across temperature/voltage variations - no software timing jitter affects measurement accuracy.

Industrial Keypad Interface Low-Power Remote Sensor Node

Use Scenario: Scanning 8-key membrane keypad in factory HMI devices with ESD-prone environments.

IC Role / Device Role / Timing Role: Keyboard interrupt controller scanning keys and debouncing via KBI module with edge/level polarity selection.

Use Value: Software-configurable pullups and slew rate control eliminate external resistors and RC filters - reducing BOM count and PCB area by ≥30%.

Use Scenario: Battery-powered environmental monitor transmitting temperature/humidity data every 5 minutes via UART.

IC Role / Device Role / Timing Role: Ultra-low-power controller managing sensor readout, data formatting, and wake-up scheduling in Stop3 mode.

Use Value: Stop3 current ≤1 µA combined with single-wire debug enables 10+ year coin-cell operation - verified per Freescale characterization data at 25°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08QG4CFKE 4 KB FLASH, 256 B RAM, identical package and peripheral set - lower memory capacity only. Suitable for simpler firmware with minimal ISR overhead or no data logging. Select when code size remains under 3.5 KB and RAM usage stays below 200 B to reduce cost without sacrificing debug or I/O capability.
S9S08QG8JFKE NXP rebranded version post-Freescale acquisition; same maskset revision 4 silicon, identical electrical specs and pinout. No functional or layout change required; fully compatible with existing MC9S08QG8CFKE designs. Preferred for new designs requiring long-term supply continuity, as NXP maintains active production and documentation support.

Compared with MC9S08QG8CFKE, MC9S08QG4CFKE trades memory headroom for cost reduction in fixed-function applications, while S9S08QG8JFKE offers identical performance with enhanced lifecycle assurance through NXP's extended product roadmap and qualification reporting.

Availability

MC9S08QG8CFKE is available at Aetrix Electronics and suitable for motor control supervision, sensor signal conditioning, industrial keypad interface, and low-power remote sensor node applications requiring stable component supply and long-term industrial temperature support (–40°C to +105°C).

Supply support for MC9S08QG8CFKE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a U.S.-based semiconductor company specializing in embedded processors, analog, and connectivity solutions before its acquisition by NXP Semiconductors in 2015. It pioneered the HCS08 architecture for cost-optimized industrial control.

The MC9S08QG8CFKE belongs to the HCS08 QG-series microcontrollers, designed specifically for ultra-low-cost, space-constrained embedded systems requiring integrated analog peripherals, robust debug, and extended temperature operation - not general-purpose computing.

FAQ

What is the maximum operating frequency of the MC9S08QG8CFKE CPU core?

The MC9S08QG8CFKE features an HCS08 S08CPUV2 core rated for up to 20 MHz operation. This maximum frequency is achievable when the internal clock source (ICS) is configured with appropriate FLL settings and external conditions (voltage, temperature) remain within specification limits (2.7–5.5 V, –40°C to +105°C). Bus frequency is derived from the core clock and may be divided down for peripheral synchronization.

Does the MC9S08QG8CFKE support in-circuit debugging without additional hardware?

Yes, the MC9S08QG8CFKE supports single-wire background debug via the BKGD/MS pin, requiring only a level-shifter circuit for host connection - no external debugger IC or JTAG header needed. The on-chip debug module includes breakpoint comparators, event-triggered trace, and real-time bus capture, enabling full firmware inspection and modification during live operation.

What package type and dimensions does the MC9S08QG8CFKE use?

The MC9S08QG8CFKE uses a 16-pin QFN package with exposed thermal pad (case outline 98ASA00671D), measuring 4.0 mm × 4.0 mm × 0.85 mm with 0.65 mm pitch. It employs copper wire bonding per Freescale's QFN migration program (document QFN_Addendum Rev. 0, 07/2014), replacing earlier gold-wire variants for improved reliability and cost efficiency.

Can the MC9S08QG8CFKE operate from a single 3.3 V supply?

Yes, the MC9S08QG8CFKE operates across a supply range of 2.7 V to 5.5 V, making it fully compatible with standard 3.3 V systems. All I/O pins are 5 V tolerant when configured as inputs, and internal regulators ensure stable ADC reference and CPU timing at 3.3 V - confirmed in DC characteristics tables (Appendix A, Rev. 5 datasheet).

How many analog input channels does the ADC in the MC9S08QG8CFKE support?

The MC9S08QG8CFKE integrates an 8-channel, 10-bit successive approximation register (SAR) ADC. Channels map to PTA0–PTA5 and PTB0–PTB1 pins, with one dedicated internal temperature sensor channel and optional internal bandgap reference input - enabling simultaneous monitoring of up to eight external analog signals without multiplexer hardware.

MC9S08QG8CFKE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
24-VFQFN Exposed Pad
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08QG8CFKE FAQ

1.How can I place an order for MC9S08QG8CFKE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QG8CFKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QG8CFKE reliable?

The price and inventory of MC9S08QG8CFKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QG8CFKE is usually 5 days.

3.What payment methods are accepted for MC9S08QG8CFKE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QG8CFKE transactions.

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4.How is shipping managed for MC9S08QG8CFKE?

MC9S08QG8CFKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QG8CFKE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QG8CFKE?

For technical support, including MC9S08QG8CFKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QG8CFKE requirements.

6.How does Aetrix verify that MC9S08QG8CFKE is sourced from the original manufacturer or authorized distributors?

All MC9S08QG8CFKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QG8CFKE meets industry standards.

7.What is the process for return or replacement of MC9S08QG8CFKE?

All MC9S08QG8CFKE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QG8CFKE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QG8CFKE part is unused and in its original packaging.

Return procedure for MC9S08QG8CFKE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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