NXP Semiconductors MC9S08QG8CPBE

Overview

MC9S08QG8CPBE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB Flash, 512 bytes RAM, 20-MHz CPU, internal clock source with FLL, and integrated peripherals including 10-bit ADC, SCI, SPI, I²C, TPM, ACMP, and KBI. It targets low-cost embedded control in space-constrained industrial and consumer applications using its 16-pin QFN package.

For engineers reviewing the MC9S08QG8CPBE datasheet, MC9S08QG8CPBE pinout, MC9S08QG8CPBE application, or MC9S08QG8CPBE equivalent, key selection criteria include Flash/RAM size, QFN-16 thermal and layout advantages, single-wire background debug support, and compatibility with legacy HCS08 toolchains and peripheral drivers.

Technical Context

The MC9S08QG8CPBE implements the S08CPUV2 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and a hardware debug module with two comparators, nine trigger modes, and eight-deep FIFO for flow tracing. Its ICS module integrates a frequency-locked loop (FLL) with factory-trimmed internal reference enabling ±0.2% resolution and ±2% deviation over voltage/temperature.

Peripherals are tightly coupled to the bus architecture: the 10-bit ADC supports hardware triggering via RTI and automatic compare with temperature sensor and bandgap reference; the TPM provides two channels configurable as input capture, output compare, or edge/center-aligned PWM; and the ACMP output can be routed directly to TPM for analog event-driven timing control.

Key Specifications

Pinout & Package

MC9S08QG8CPBE is housed in a 16-pin quad flat no-lead (QFN) package with exposed thermal pad (98ASA00671D), optimized for compact PCB layouts and improved thermal dissipation in cost-sensitive embedded systems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08QG8CPBE, MC9S08QG8CDTE offers identical functionality in a through-hole-compatible TSSOP package but sacrifices thermal efficiency and board density, while S9KEAZ128AMLH delivers significantly greater processing headroom and peripheral breadth at the cost of increased complexity, power, and BOM cost.

Availability

MC9S08QG8CPBE is available at Aetrix Electronics and suitable for smart thermostat control, industrial sensor nodes, LED lighting dimmers, and appliance motor control requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08QG8CPBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The MC9S08QG8CPBE belongs to the legacy HCS08 microcontroller family, designed for cost-sensitive, low-power embedded control applications where small footprint, debug simplicity, and peripheral integration outweigh raw performance demands.

FAQ

What is the maximum operating frequency of the MC9S08QG8CPBE?

The MC9S08QG8CPBE features a 20-MHz HCS08 CPU core. Its internal clock source (ICS) supports bus frequencies from 1 MHz to 10 MHz, and the FLL can be configured to achieve the full 20-MHz core speed using an external crystal or internal reference. The MC9S08QG8CPBE's timing specifications are validated across its full operating voltage (2.7–3.6 V) and temperature range (−40°C to +105°C).

Does the MC9S08QG8CPBE support in-circuit debugging?

Yes, the MC9S08QG8CPBE includes a single-wire background debug interface (BKGD/MS pin) and an on-chip in-circuit emulator (ICE) with real-time bus capture. It supports breakpoint setting, two hardware comparators, nine trigger modes, and an eight-deep FIFO for change-of-flow address logging - all accessible without halting system operation during active debugging sessions.

What package type is used for the MC9S08QG8CPBE?

The MC9S08QG8CPBE uses a 16-pin quad flat no-lead (QFN) package with exposed thermal pad, documented under package outline number 98ASA00671D. This copper-wire QFN variant replaces earlier gold-wire versions and is optimized for thermal performance and compact PCB layouts in space-constrained designs.

Can the MC9S08QG8CPBE operate from a battery-powered supply?

Yes, the MC9S08QG8CPBE supports battery operation with a supply voltage range of 2.7 V to 3.6 V and features multiple low-power modes: Wait mode and three Stop modes (Stop1/Stop2/Stop3). In Stop3 mode with selected peripherals disabled, it achieves sub-1 µA typical current draw, making it suitable for long-life battery-powered sensor and control applications.

What analog peripherals are integrated into the MC9S08QG8CPBE?

The MC9S08QG8CPBE integrates an 8-channel, 10-bit successive-approximation ADC with internal bandgap reference, temperature sensor, and automatic compare function; plus an analog comparator (ACMP) with selectable internal reference and output routable to the TPM module. Both peripherals support hardware triggering - the ADC via RTI, and the ACMP output can directly initiate TPM events for deterministic analog response.