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NXP Semiconductors MC9S08QG8MPBE

Part No.:
MC9S08QG8MPBE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-DIP (0.300", 7.62mm)
Datasheet:
AetrixMC9S08QG8MPBE.pdf
Description:
IC MCU 8BIT 8KB FLASH 16DIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,403

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Product details

Overview

MC9S08QG8MPBE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller designed for cost-sensitive embedded control applications. It integrates 8 KB Flash, 512 bytes RAM, a 20-MHz CPU, 10-bit ADC with temperature sensor and internal bandgap reference, SCI/SPI/IIC interfaces, and two-channel TPM with PWM capability. It targets low-power industrial sensors and appliance motor controls requiring deterministic real-time response.

For engineers reviewing the MC9S08QG8MPBE datasheet, MC9S08QG8MPBE pinout, MC9S08QG8MPBE application, or MC9S08QG8MPBE equivalent, key selection criteria include its 16-pin QFN package with exposed pad, single-wire background debug interface, ICS-based FLL clock generation with ±2% accuracy over voltage/temperature, COP watchdog with dedicated 1-kHz clock source, and hardware-triggerable ADC using RTI counter - all validated for operation at 2.7–5.5 V supply.

Technical Context

The MC9S08QG8MPBE implements the S08CPUV2 core with HC08 instruction set extension including BGND, supporting in-circuit debugging via single-wire BDM interface. Its debug module includes two comparators, nine trigger modes, and an eight-deep FIFO for change-of-flow address capture.

System clocking combines ICS (FLL-controlled internal reference trimmed to 0.2% resolution) and XOSC (supporting 31.25 kHz–16 MHz crystals/resonators or external clock up to 20 MHz). Peripheral timing derives from bus clock, with TPM channels configurable for edge-aligned or center-aligned PWM, input capture, or output compare.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 S08CPUV2 with BGND instruction and 20-MHz max frequency
Memory 8 KB on-chip FLASH (read/program/erase over full VDD/temperature), 512 bytes RAM
ADC 8-channel, 10-bit SAR ADC with automatic compare, internal bandgap reference, and temperature sensor
Timers 2-channel TPM (input capture/output compare/PWM), 8-bit MTIM with prescaler, RTI for hardware-triggered ADC
Communication SCI (13-bit break support), SPI, IIC, and analog comparator with TPM routing capability
Power Management Wait mode + Stop1/Stop2/Stop3; COP watchdog with selectable 1-kHz or bus clock source; LVD reset/interrupt
I/O 12 GPIO pins (10 mA each, 60 mA total), 1 input-only, 1 output-only; software-selectable pullups, slew rate, and drive strength

Pinout & Package

MC9S08QG8MPBE is housed in a 16-pin QFN package (98ASA00671D) with 3 mm × 3 mm footprint, 0.5 mm pitch, and exposed thermal pad. The package supports copper-wire bonding per Freescale QFN migration addendum Rev. 0 (2014).

Pin/Terminal Circuit Role Design Meaning
VDD Supply voltage input Primary power rail (2.7–5.5 V); decoupling required near pin
VSS Ground reference Digital ground return; connects to exposed pad for thermal conduction
PTA0–PTA5 Port A general-purpose I/O 6-bit bidirectional port with software-selectable pullups and slew control
PTB0–PTB5 Port B general-purpose I/O 6-bit bidirectional port; PTA5 and PTB0 share IRQ functionality
RESET Active-low reset input Internal pullup enables reset without external resistor; triggers cold start
BKGD/MS Background debug / mode select Single-wire BDM interface pin; asserts during debug entry or mode configuration
XTAL Oscillator input Connects to crystal/resonator or external clock source for XOSC module
EXTAL Oscillator output Drives crystal/resonator; requires external load capacitors per frequency

Key Features

Feature Design Value
Background Debug Interface Single-wire BDM enables in-circuit emulation, real-time bus capture, and breakpoint debugging without halting system clocks
FLL-Based Clock System ICS module provides bus frequencies from 1–10 MHz with factory-trimmed internal reference (±2% deviation over temp/voltage)
Hardware-Triggered ADC RTI counter initiates conversions without CPU intervention, enabling deterministic sampling in low-power modes
Peripheral Integration SCI/SPI/IIC, TPM with dual PWM outputs, ACMP with TPM routing, and KBI for keyboard scanning reduce external component count
Flash Security & Protection FLASH block protect and illegal opcode/address detection prevent unauthorized access and execution errors

Applications

Industrial Sensor Node Small Appliance Motor Control

Use Scenario: Standalone temperature/humidity sensor with local display and serial telemetry.

IC Role / Device Role / Timing Role: Main controller executing sensor readout, linearization, and UART transmission; RTI-driven ADC ensures consistent sampling intervals.

Use Value: Integrated 10-bit ADC with temperature sensor and internal bandgap reference eliminates external precision references and reduces BOM cost by ≥2 components.

Use Scenario: Fan speed regulation in HVAC blower units using hall-effect rotor feedback.

IC Role / Device Role / Timing Role: Real-time motor commutation controller generating center-aligned PWM via TPM; KBI monitors user interface buttons.

Use Value: Dual TPM channels support simultaneous PWM generation and input capture for precise rotor position tracking at ≤20 kHz update rates.

Smart Meter Front-End LED Lighting Dimming Module

Use Scenario: Energy meter sub-system monitoring line voltage/current and communicating via RS-485.

IC Role / Device Role / Timing Role: Isolated data acquisition front-end managing ADC sequencing, fault detection (LVD/COP), and SCI framing.

Use Value: Low-voltage detect with interrupt/reset and COP watchdog with dedicated 1-kHz clock ensure reliable operation during brownout conditions without external supervisors.

Use Scenario: DALI-compatible LED driver with programmable dimming curves and thermal foldback.

IC Role / Device Role / Timing Role: Dimming engine executing logarithmic PWM lookup tables and reading thermistor via ADC channel.

Use Value: Hardware automatic compare function in ADC triggers thermal shutdown before silicon exceeds 125°C, eliminating need for polling loop overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9RS08KB12 4 KB Flash, 128 bytes RAM, no ADC, 8-pin DFN package (98ASA00602D) Lacks analog peripherals; suited for pure digital logic control with minimal I/O Select when system requires only GPIO/timers and space-constrained layout favors 2×2 mm DFN
S9KEAZ128AMLH Cortex-M0+ core, 128 KB Flash, 16 KB RAM, 12-bit ADC, 48-pin LQFP Higher performance, richer peripheral set, but larger footprint and higher power in active mode Choose for future-proofing where code growth or enhanced signal processing is anticipated

Compared with MC9S08QG8MPBE, MC9RS08KB12 offers smaller size and lower cost but omits ADC and reduces memory; S9KEAZ128AMLH delivers ARM-class scalability at the expense of increased PCB area and active current draw.

Availability

MC9S08QG8MPBE is available at Aetrix Electronics and suitable for industrial sensor nodes, small-appliance motor controllers, smart meter front-ends, and LED lighting dimming modules requiring stable component supply across extended production lifecycles.

Supply support for MC9S08QG8MPBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's embedded MCU heritage.

The MC9S08QG8MPBE belongs to the HCS08 family - a cost-optimized 8-bit microcontroller line targeting resource-constrained embedded systems requiring deterministic real-time control, low power, and debug-friendly development.

FAQ

What is the maximum operating frequency of the MC9S08QG8MPBE CPU core?

The MC9S08QG8MPBE features an HCS08 S08CPUV2 core rated for up to 20 MHz operation. This frequency is achievable when the internal clock source (ICS) is configured in FLL-engaged modes with appropriate bus clock division, and the supply voltage remains within the 2.7–5.5 V specification range. The actual bus frequency delivered to peripherals depends on ICS register settings and may be lower than 20 MHz to meet timing requirements of individual modules.

Does the MC9S08QG8MPBE support in-circuit debugging, and what interface is used?

Yes, the MC9S08QG8MPBE supports full in-circuit debugging via a single-wire background debug mode (BDM) interface using the BKGD/MS pin. This interface enables real-time bus capture, breakpoint setting (one active plus two in debug module), and on-chip emulation without requiring additional debug headers or JTAG circuitry. The debug module includes two comparators and nine trigger modes, making MC9S08QG8MPBE suitable for time-critical firmware validation in production environments.

What analog peripherals are integrated into the MC9S08QG8MPBE?

The MC9S08QG8MPBE integrates an 8-channel, 10-bit successive-approximation ADC with internal bandgap reference, temperature sensor, and automatic compare function. It also includes an analog comparator (ACMP) module with selectable internal reference and output routable to the TPM module for event-driven timing actions. Both peripherals operate independently of CPU activity, allowing low-power sampling and threshold detection without continuous polling.

What package type and dimensions does the MC9S08QG8MPBE use?

The MC9S08QG8MPBE is packaged in a 16-pin quad flat no-lead (QFN) variant with 3 mm × 3 mm body size, 0.5 mm lead pitch, and exposed thermal pad (case outline 98ASA00671D). This copper-wire-bonded package replaces earlier gold-wire versions per Freescale's QFN migration addendum (Rev. 0, 2014) and is optimized for thermal dissipation and board-space efficiency in compact industrial designs.

How does the MC9S08QG8MPBE handle power failure or brownout conditions?

The MC9S08QG8MPBE incorporates a low-voltage detect (LVD) system that generates either a reset or interrupt when VDD drops below a programmable threshold. It also includes a computer operating properly (COP) watchdog with optional dedicated 1-kHz internal clock source - ensuring reliable recovery even if the main clock fails. These features, combined with FLASH block protection and illegal opcode detection, make MC9S08QG8MPBE robust for unattended operation in utility-grade equipment.

MC9S08QG8MPBE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-DIP (0.300", 7.62mm)
Series:
S08
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:

MC9S08QG8MPBE FAQ

1.How can I place an order for MC9S08QG8MPBE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08QG8MPBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08QG8MPBE reliable?

The price and inventory of MC9S08QG8MPBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QG8MPBE is usually 5 days.

3.What payment methods are accepted for MC9S08QG8MPBE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QG8MPBE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08QG8MPBE?

MC9S08QG8MPBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08QG8MPBE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08QG8MPBE?

For technical support, including MC9S08QG8MPBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QG8MPBE requirements.

6.How does Aetrix verify that MC9S08QG8MPBE is sourced from the original manufacturer or authorized distributors?

All MC9S08QG8MPBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QG8MPBE meets industry standards.

7.What is the process for return or replacement of MC9S08QG8MPBE?

All MC9S08QG8MPBE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QG8MPBE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08QG8MPBE part is unused and in its original packaging.

Return procedure for MC9S08QG8MPBE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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