NXP Semiconductors MC9S08QL4CTG
- Part No.:
- MC9S08QL4CTG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08QL4CTG.pdf
- Description:
- IC MCU 8BIT 4KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,203
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08QL4CTG from NXP Semiconductors is an 8-bit HCS08 microcontroller designed for ultra-low-power embedded control in space-constrained applications. It features 4 KB flash, 256 bytes RAM, a 12-bit ADC with temperature sensor, single-channel TPM, RTC, SCI (LIN-capable), and operates from 1.8 V to 3.6 V across –40 °C to 85 °C - enabling use in battery-powered industrial sensors and smart metering endpoints.
For engineers reviewing the MC9S08QL4CTG datasheet, MC9S08QL4CTG pinout, MC9S08QL4CTG application, or MC9S08QL4CTG equivalent, this page delivers verified technical context, package-specific I/O mapping, power-mode trade-offs, and validated alternative options for cost-optimized, energy-efficient MCU selection.
Technical Context
The MC9S08QL4CTG implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its clock system integrates both a low-power external oscillator (31.25 kHz–16 MHz) and an internal FLL-based ICS with ±0.2% trimming resolution and 2% deviation over voltage/temperature.
System protection includes COP reset (with 1 kHz internal clock option), low-voltage detection with selectable trip points (1.80–1.96 V), illegal opcode/address detection, and flash block protection. Peripherals operate down to 1.8 V and remain functional in stop3 mode, including ADC, ACMP, and RTC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, up to 20 MHz at 3.6 V, supports BGND instruction and 32 interrupt sources |
| Memory | 4 KB flash (read/program/erase over full voltage/temperature), 256 B RAM with security lock |
| ADC | 8-channel, 12-bit resolution, 2.5 µs conversion, internal bandgap reference, 1.7 mV/°C temp sensor |
| Power Modes | Stop3 mode draws 0.45 µA typical at 3 V/25 °C; 6 µs wakeup time; low-power run/wait modes supported |
| Clock Sources | XOSC: 31.25 kHz–38.4 kHz or 1–16 MHz crystal/resonator; ICS: FLL with 0.2% trim resolution, 1–10 MHz bus output |
| I/O | 14 GPIOs (in 16-pin TSSOP), all inputs with hysteresis and configurable pull-up; outputs with slew rate/drive strength control |
| Operating Range | 1.8 V–3.6 V supply, –40 °C to +85 °C ambient, AEC-Q100 qualified ESD (±2000 V HBM) |
Pinout & Package
MC9S08QL4CTG is housed in a 16-pin TSSOP (Case 948F) package with 14 usable GPIOs, including dedicated SCI, TPM, KBI, ADC, and ACMP signal routing. Pin functions are fixed per the 16-pin assignment table; PTA5 is input-only (IRQ/TCLK/RESET), PTA4 is output-only (ACMPO/BKGD/MS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (PTA5) | Input-only interrupt/reset | Active-low IRQ input, TCLK source, or hardware reset trigger; no output capability |
| 2 (PTA4) | Output-only debug/comparator | ACMPO output, BKGD serial debug interface, or master select (MS); not bidirectional |
| 3 (VDD) | Power supply | Main digital supply (1.8–3.6 V); decoupling required near pin for noise-sensitive operation |
| 4 (VSS) | Ground reference | Digital ground return; must be low-impedance connection to minimize noise coupling into analog peripherals |
| 5 (PTB7) | External oscillator input | EXTAL input for crystal/resonator; requires external load capacitors unless using XOSCVLP mode |
| 6 (PTB6) | External oscillator output | XTAL output for crystal/resonator; forms Pierce oscillator with PTB7 and external components |
| 7 (PTB5) | TPM channel 0 | Configurable as TPM input capture, output compare, or PWM output; default location for TPMCH0 |
| 8 (PTB4) | General-purpose I/O | Bidirectional port with hysteresis, programmable pull-up, and configurable drive strength |
| 13 (PTB3) | Keyboard interrupt / ADC | KBIP7 input with edge/level detection; also serves as ADC channel ADP7 |
| 14 (PTB2) | Keyboard interrupt / ADC | KBIP6 input; also serves as ADC channel ADP6; shares pin with KBI and ADC subsystems |
| 15 (PTB1) | SCI transmit / ADC | TxD output for SCI; also ADC channel ADP5; supports LIN master break generation |
| 16 (PTB0) | SCI receive / ADC | RxD input for SCI; also ADC channel ADP4; supports LIN slave break detection and wakeup |
Key Features
| Feature | Design Value |
|---|---|
| Single-wire background debug (BDC) | Enables in-circuit debugging via PTA4 (BKGD) without JTAG header; reduces PCB footprint and test cost |
| Stop3 ultra-low-power mode | 0.45 µA typical current draw at 3 V/25 °C with RTC and ACMP active - extends battery life in always-on sensing |
| Integrated temperature sensor | 1.7 mV/°C analog output routed to ADC; eliminates external sensor for thermal monitoring in compact designs |
| LIN-capable SCI module | Full-duplex NRZ interface with hardware LIN break generation/detection - enables automotive body electronics integration |
| Flash security circuitry | Prevents unauthorized read-out of flash and RAM contents; protects firmware IP in production devices |
| Configurable I/O drive strength | Per-pin selection of high/low drive strength on all outputs except PTA5 - optimizes EMI and power for each signal path |
Applications
| Smart Utility Metering | Industrial Sensor Node |
|---|---|
|
Use Scenario: Battery-powered gas/water meter with pulse counting, temperature compensation, and periodic RF wake-up. IC Role / Device Role / Timing Role: Primary controller managing ADC sampling, RTC-based scheduling, and SCI-driven RF module handshaking. Use Value: Stop3 mode enables >10-year battery life; integrated temperature sensor calibrates flow readings without added components. |
Use Scenario: Wireless vibration sensor on rotating machinery with onboard FFT preprocessing and event-triggered transmission. IC Role / Device Role / Timing Role: Real-time data acquisition node using ADC and ACMP to detect threshold breaches and initiate wake-up sequences. Use Value: 6 µs stop3 wakeup ensures rapid response to mechanical anomalies; 12-bit ADC resolution captures subtle waveform changes. |
| Automotive Body Control | Home Appliance Interface |
|
Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN communication to central ECU. IC Role / Device Role / Timing Role: LIN slave node executing local actuation logic while synchronizing with master timing via SCI. Use Value: Hardware LIN break detection reduces CPU overhead; 14 GPIOs support direct switch/sensor/actuator interfacing. |
Use Scenario: Touchless control panel for HVAC or kitchen appliances using capacitive proximity sensing and LED feedback. IC Role / Device Role / Timing Role: Front-end interface processor handling KBI-driven key scanning, PWM dimming, and ADC-based ambient light sensing. Use Value: Keyboard interrupt with configurable edge/level detection simplifies touch-button firmware; hysteresis prevents false triggers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08QL4CTJ | Same die, 20-pin TSSOP package with 18 GPIOs (including PTC0–PTC3 and PTA1–PTA3) | Requires larger PCB footprint; enables additional I/O for complex sensor fusion or multi-peripheral coordination | Select CTJ when more GPIOs or peripheral flexibility (e.g., extra ADC channels, TPM repositioning) are needed. |
| S9KEAZ128AMLH | ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, higher performance but larger die and 64-pin LQFP package | Targets applications needing RTOS, USB, or advanced math; consumes more power in active mode | Choose S9KEAZ128AMLH only if migrating to ARM ecosystem or requiring >4 KB code space and deterministic interrupt latency. |
Compared with MC9S08QL4CTG, MC9S08QL4CTJ offers expanded I/O in a larger package without changing firmware, while S9KEAZ128AMLH provides architectural scalability at the cost of power efficiency and board area - making MC9S08QL4CTG optimal for cost- and size-sensitive 8-bit control.
Availability
MC9S08QL4CTG is available at Aetrix Electronics and suitable for smart metering, industrial sensor nodes, automotive body electronics, and home appliance interfaces requiring stable component supply and long-term manufacturability.
Supply support for MC9S08QL4CTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in low-power microcontrollers and embedded security.
The MC9S08QL4CTG belongs to NXP's S08QL series - engineered specifically for energy-constrained, cost-sensitive embedded control where ultra-low standby current, integrated analog peripherals, and robust debug capability are critical.
FAQ
What is the maximum operating frequency of the MC9S08QL4CTG?
The MC9S08QL4CTG supports a maximum CPU frequency of 20 MHz at 3.6 V across its full temperature range (–40 °C to +85 °C). Bus frequency is derived from the internal clock source (ICS) or external oscillator (XOSC), with ICS delivering up to 10 MHz and XOSC supporting up to 16 MHz crystal/resonator inputs. The MC9S08QL4CTG maintains full functionality at lower voltages down to 1.8 V, though maximum frequency scales with supply voltage.
Does the MC9S08QL4CTG support LIN communication?
Yes, the MC9S08QL4CTG supports LIN communication through its SCI module, which includes hardware-level LIN master extended break generation and LIN slave extended break detection. This allows the MC9S08QL4CTG to serve as either a LIN master or slave node without software bit-banging, reducing CPU load and improving protocol timing accuracy in automotive body electronics and industrial networks.
What are the power consumption characteristics of the MC9S08QL4CTG in stop mode?
In stop3 mode (no clocks active), the MC9S08QL4CTG draws 0.45 µA typical at 3 V and 25 °C, with a maximum of 0.8 µA under those conditions. At 85 °C, the maximum stop3 current rises to 5.8 µA. The device achieves 6 µs typical wakeup time from stop3, enabling rapid response to interrupts while maintaining multi-year battery life in duty-cycled applications like utility meters and wireless sensors.
How many ADC channels does the MC9S08QL4CTG have, and what is their resolution?
The MC9S08QL4CTG includes an 8-channel, 12-bit successive-approximation ADC with 2.5 µs conversion time. All channels share a common sample-and-hold and support automatic comparison against programmable thresholds. The ADC operates across the full 1.8–3.6 V supply range and remains functional in stop3 mode, enabling low-power periodic sensing. An internal temperature sensor (1.7 mV/°C) and bandgap reference channel are also integrated.
Is the MC9S08QL4CTG pin-compatible with other devices in the S08QL family?
The MC9S08QL4CTG is pin-compatible with the MC9S08QL4CTJ (20-pin TSSOP) in shared pins (1–4, 7–16), but the CTJ variant adds four additional I/Os (PTC0–PTC3) on pins 9–12. It is not pin-compatible with MC9S08QL8 variants due to differences in flash/RAM allocation and internal register mapping, though firmware is largely portable within the S08QL series. Always verify pin assignments using the official MC9S08QL8 Series Data Sheet Rev. 1.
MC9S08QL4CTG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- LINbus, SCI
- Peripherals:
- LVD, PWM, WDT
- Number of I/O:
- 14
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08QL4CTG FAQ
1.How can I place an order for MC9S08QL4CTG through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08QL4CTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08QL4CTG reliable?
The price and inventory of MC9S08QL4CTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08QL4CTG is usually 5 days.
3.What payment methods are accepted for MC9S08QL4CTG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08QL4CTG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08QL4CTG?
MC9S08QL4CTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08QL4CTG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08QL4CTG?
For technical support, including MC9S08QL4CTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08QL4CTG requirements.
6.How does Aetrix verify that MC9S08QL4CTG is sourced from the original manufacturer or authorized distributors?
All MC9S08QL4CTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08QL4CTG meets industry standards.
7.What is the process for return or replacement of MC9S08QL4CTG?
All MC9S08QL4CTG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08QL4CTG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08QL4CTG part is unused and in its original packaging.
Return procedure for MC9S08QL4CTG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08QL4CTG Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

