NXP Semiconductors MC9S08SE8CTGR
- Part No.:
- MC9S08SE8CTGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08SE8CTGR.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08SE8CTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 bytes RAM, and integrated peripherals including SCI, 10-channel 10-bit ADC, two TPM modules, RTC, and KBI. It operates at up to 20 MHz CPU clock and 10 MHz bus frequency, supporting LIN communication and low-power stop modes. It is used in cost-sensitive industrial control and automotive body electronics.
For engineers reviewing the MC9S08SE8CTGR datasheet, MC9S08SE8CTGR pinout, MC9S08SE8CTGR application, or MC9S08SE8CTGR equivalent, this page delivers verified specifications, package mapping, functional pin roles, real-world use cases, and validated alternative options for design-in and supply continuity planning.
Technical Context
The MC9S08SE8CTGR implements the HCS08 CPU core with HC08 instruction set extension (BGND), supports up to 32 interrupt/reset sources, and features a flexible clock system combining internal ICS (FLL-based, 1–10 MHz bus) and external XOSC (31.25 kHz–16 MHz). Its memory subsystem includes block-protected flash with security options and on-chip RAM retaining data down to 0.6 V.
Peripheral integration includes full-duplex SCI with LIN master/slave break handling, 10-bit ADC with temperature sensor (1.7 mV/°C) and bandgap reference, dual TPM modules (TPM1: 2-channel, TPM2: 1-channel) supporting PWM, input capture, and buffered centered PWM, plus RTC with binary/decimal prescaler and 8-pin KBI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and 20 MHz max CPU clock |
| Flash / RAM | 8 KB in-circuit programmable flash with block protection; 512 bytes RAM with retention down to 0.6 V |
| Bus Frequency | Up to 10 MHz via internal ICS (FLL-controlled) or external crystal/resonator |
| ADC | 10-channel, 10-bit resolution; 2.5 μs conversion time; runs in Stop3 mode |
| Power Modes | Wait, Stop2 (typ. 1.4 μA @ 5 V), and Stop3 (typ. 1.61 μA @ 5 V) with RTC wakeup capability |
| Operating Voltage | 2.7 V to 5.5 V; LVD thresholds configurable at 2.56 V / 4.1 V (low/high range) |
| Temperature Range | –40 °C to +105 °C (industrial grade) |
Pinout & Package
MC9S08SE8CTGR is packaged in a 16-pin TSSOP (Case 948F-01), pin-compatible with other MC9S08SE8 variants in same footprint. Pin functions are software-configurable per port register settings, with internal pullups on RESET, IRQ, and BKGD/MS pins to reduce BOM count.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0–PTA3 | General-purpose I/O with alternate functions | KBIP0–KBIP3, TPM1CH0/CH1, ADP0–ADP3 - support keyboard interrupt, PWM, and analog inputs |
| PTA4 | BKGD/MS | Single-wire background debug interface pin; bi-directional when configured as BKGD |
| PTA5 | IRQ/TCLK/RESET | Interrupt request input, external timer clock, or active-low reset - internal pullup reduces external component need |
| PTB0–PTB3 | General-purpose I/O with alternate functions | RxD/TxD (SCI), KBIP4–KBIP7, TPM2CH0, ADP6–ADP9 - enable serial comms and analog sensing |
| VDD / VSS | Power supply / ground | Core digital supply (2.7–5.5 V); VDDA/VREFH and VSSA/VREFL internally bonded to VDD/VSS in 16-pin package |
Key Features
| Feature | Design Value |
|---|---|
| Single-wire BDM interface | Enables in-circuit debugging with one dedicated pin (PTA4), reducing debug footprint vs. JTAG |
| Integrated LIN-capable SCI | Supports LIN master extended break generation and slave extended break detection for automotive sub-networks |
| Stop3 mode with RTC wakeup | Ultra-low power state (1.61 μA typ.) with real-time counter running independently for timed wake-up events |
| Programmable port drive strength | Software-selectable high/low drive on all I/O ports enables optimization of EMI, slew rate, and current consumption |
| On-chip voltage regulator & LVD | Internal regulator stabilizes core logic; configurable low-voltage detect (2.56 V / 4.1 V thresholds) prevents erratic operation during brownout |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main MCU executing LIN slave protocol, reading switch inputs via KBI, driving relays/LEDs via GPIO, and monitoring battery voltage via ADC. Use Value: Integrated LIN SCI and ultra-low Stop3 current (1.61 μA) enable always-on monitoring without draining vehicle battery. |
Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and ambient light in factory settings. IC Role / Device Role / Timing Role: Data acquisition MCU sampling analog sensors via 10-bit ADC, logging timestamps via RTC, and transmitting over UART to gateway. Use Value: On-chip 1.7 mV/°C temperature sensor and bandgap reference eliminate external components; Stop3 mode extends battery life to >5 years. |
| Smart Appliance Control Board | Medical Diagnostic Handheld |
Use Scenario: Control unit for washing machine motor, water valves, and user interface with LED display and keypad. IC Role / Device Role / Timing Role: Real-time controller managing PWM-driven motor phases (via TPM), scanning 8-key matrix (KBI), and regulating power sequencing. Use Value: Dual TPM modules support edge-aligned and centered PWM for precise motor control; internal pullups on KBI pins reduce external resistor count by 8. |
Use Scenario: Portable blood glucose meter requiring accurate analog measurement, low-power standby, and USB-serial data upload. IC Role / Device Role / Timing Role: Precision analog front-end MCU acquiring sensor signals via 10-bit ADC with internal reference, managing button interrupts (KBI), and emulating UART over USB. Use Value: ADC auto-compare function triggers interrupt on threshold breach; internal bandgap reference (1.20 V ±10 mV) ensures consistent calibration across voltage/temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SH8CTJ | Same HCS08 core, 8 KB flash, but adds SPI and enhanced SCI; 20-pin TSSOP package | Requires PCB redesign due to 20-pin footprint and additional SPI routing | Select when SPI interface or higher I/O count is required; not drop-in compatible |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 48 MHz; 32-pin LQFP | Higher performance, richer peripheral set (USB, CAN), but larger footprint and higher power in active mode | Choose for future-proofing or when migrating from 8-bit to 32-bit architecture with toolchain continuity |
Compared with MC9S08SE8CTGR, MC9S08SH8CTJ offers expanded serial connectivity in a larger package, while S9KEAZ128AMLH provides scalable 32-bit performance at the cost of increased layout complexity and active power - both require firmware adaptation and hardware revision.
Availability
MC9S08SE8CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control boards, and medical diagnostic handhelds requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08SE8CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep heritage in microcontrollers dating back to Motorola and Freescale.
The MC9S08SE8 series belongs to NXP's legacy HCS08 portfolio, designed specifically for cost-optimized, low-power embedded control in automotive and industrial environments where reliability, small footprint, and LIN compatibility are critical.
FAQ
What is the maximum operating frequency of the MC9S08SE8CTGR CPU and bus?
The MC9S08SE8CTGR CPU supports up to 20 MHz operation, while the internal bus frequency is rated up to 10 MHz. This is achieved using either the internal ICS module (FLL-based, trimmed for ±0.2% resolution) or an external crystal/resonator (1–16 MHz). The bus clock must remain within specification to ensure reliable peripheral timing - exceeding 10 MHz may cause undefined behavior in TPM or ADC modules.
Does the MC9S08SE8CTGR support LIN communication natively?
Yes, the MC9S08SE8CTGR's SCI module supports LIN 2.x protocol natively: it generates extended breaks (13–18 bit dominant) in master mode and detects them in slave mode. The SCI also provides wakeup-on-active-edge capability, enabling low-power LIN slave operation. No external transceiver is required for basic LIN physical layer compliance - only a standard LIN transceiver IC (e.g., TJA1020) is needed for bus interfacing.
What power-saving modes does the MC9S08SE8CTGR offer, and what is the lowest current draw?
The MC9S08SE8CTGR supports Wait, Stop2, and Stop3 modes. Stop3 achieves the lowest active current: 1.61 μA typical at 5 V and –40 to 85 °C, with RTC running independently. An optional oscillator adder (S3IDDOSC = 5–8 μA) and LVD adder (S3IDDLVD = 122 μA) apply if those features are enabled. Stop3 is ideal for battery-backed applications requiring periodic wake-up without external timers.
Can the MC9S08SE8CTGR ADC operate during low-power modes?
Yes, the 10-bit ADC in the MC9S08SE8CTGR is explicitly specified to run in Stop3 mode, enabling analog measurements without exiting ultra-low-power state. It supports automatic compare, temperature sensing (1.7 mV/°C), and uses an internal bandgap reference channel (1.20 V ±10 mV). Conversion time remains 2.5 μs, and results are accessible via registers upon completion - critical for energy-constrained sensor polling.
Is the MC9S08SE8CTGR pin-compatible with other MC9S08SE8 package variants?
The MC9S08SE8CTGR (16-pin TSSOP) shares identical pin functions with the 28-pin SOIC/PDIP versions for pins 1–16, but lacks PTC0–PTC7, PTA6–PTA7, and PTC1–PTC6. Port mappings for PTA0–PTA5, PTB0–PTB3, and power pins are consistent. Software written for the 16-pin variant remains portable to larger packages, though hardware abstraction layers should isolate unused pin references to avoid runtime errors.
MC9S08SE8CTGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- LINbus, SCI
- Peripherals:
- LVD, POR, PWM
- Number of I/O:
- 14
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08SE8CTGR FAQ
1.How can I place an order for MC9S08SE8CTGR through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SE8CTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SE8CTGR reliable?
The price and inventory of MC9S08SE8CTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SE8CTGR is usually 5 days.
3.What payment methods are accepted for MC9S08SE8CTGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SE8CTGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08SE8CTGR?
MC9S08SE8CTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08SE8CTGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SE8CTGR?
For technical support, including MC9S08SE8CTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SE8CTGR requirements.
6.How does Aetrix verify that MC9S08SE8CTGR is sourced from the original manufacturer or authorized distributors?
All MC9S08SE8CTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SE8CTGR meets industry standards.
7.What is the process for return or replacement of MC9S08SE8CTGR?
All MC9S08SE8CTGR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SE8CTGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SE8CTGR part is unused and in its original packaging.
Return procedure for MC9S08SE8CTGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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