Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC9S08SE8MTG

Part No.:
MC9S08SE8MTG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SE8MTG.pdf
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,419

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC9S08SE8MTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 8 KB flash, 512 bytes RAM, and integrated peripherals including SCI, 10-channel 10-bit ADC, two TPM modules, RTC, and KBI. It operates at up to 20 MHz CPU clock and 10 MHz bus frequency, supporting LIN communication and temperature sensing via on-chip sensor. It targets cost-sensitive industrial control and automotive body electronics.

For engineers reviewing the MC9S08SE8MTG datasheet, MC9S08SE8MTG pinout, MC9S08SE8MTG application, or MC9S08SE8MTG equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use cases, and validated alternative options for design-in and supply continuity planning.

Technical Context

The MC9S08SE8MTG implements the HCS08 CPU core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and single-wire background debug. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed 39.0625 kHz reference, enabling bus frequencies from 1–10 MHz with ±0.2% resolution at fixed voltage/temperature.

Peripherals include a full-duplex SCI with LIN master break generation and slave break detection, a 10-bit ADC with 2.5 μs conversion time and internal bandgap reference, and dual TPM modules-one 2-channel (TPM1) and one 1-channel (TPM2)-supporting input capture, output compare, edge-aligned PWM, and buffered centered PWM (CPWM).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 8-bit core with BGND instruction and 20 MHz max CPU clock
Memory 8 KB in-circuit programmable flash with block protection; 512 bytes RAM
ADC 10-channel, 10-bit resolution, 2.5 μs conversion time, runs in Stop3 mode
Timers TPM1: 2-channel 16-bit timer/PWM; TPM2: 1-channel 16-bit timer/PWM
Supply Voltage 2.7 V to 5.5 V operating range; supports 3 V and 5 V system designs
Power Modes Wait, Stop2 (≤45.8 μA @ –40 to 125°C), and Stop3 (≤76.1 μA @ –40 to 125°C)
Debug Interface Single-wire background debug (BKGD/MS pin), one hardware breakpoint

Pinout & Package

MC9S08SE8MTG is packaged in 16-pin TSSOP (Case 948F-01), with VDD/VSS power pins, PTA/PTB/PTC I/O ports, BKGD/MS debug interface, RESET, IRQ, EXTAL/XTAL oscillator inputs, and peripheral function multiplexing per Table 1 of Rev. 4 datasheet.

Pin/Terminal Circuit Role Design Meaning
1 (PTC5) General-purpose I/O / Port C bit 5 Software-configurable digital I/O with pullup/slew rate/drive strength control
2 (PTC4) General-purpose I/O / Port C bit 4 Shared with no alternate functions in 16-pin TSSOP package
3 (PTA5) IRQ / TCLK / RESET Active-low reset input with internal pullup; also serves as interrupt request and test clock
4 (PTA4) BKGD / MS Single-wire background debug interface; bidirectional during debug session
5 (VDD) Positive supply Main digital power rail (2.7–5.5 V); decoupling required per layout guidelines
6 (VDDA/VREFH) Analog supply / ADC reference high Separate analog domain supply; double-bonded to VDD in 16-pin TSSOP
7 (VSSA/VREFL) Analog ground / ADC reference low Separate analog ground; double-bonded to VSS in 16-pin TSSOP
8 (VSS) Digital ground Primary ground return for digital logic and I/O
9 (PTB7) EXTAL External crystal/resonator input for XOSC oscillator circuit
10 (PTB6) XTAL External crystal/resonator output for XOSC oscillator circuit
11 (PTB5) General-purpose I/O / Port B bit 5 No alternate function assigned in 16-pin TSSOP; configurable as digital I/O
12 (PTB4) TPM2CH0 Timer/PWM channel 0 output for TPM2 module
13 (PTA3) KBIP3 / ADP3 Keyboard interrupt input 3 or ADC channel 3 input
14 (PTA2) KBIP2 / ADP2 Keyboard interrupt input 2 or ADC channel 2 input
15 (PTA1) KBIP1 / TPM1CH1 / ADP1 Keyboard interrupt input 1, TPM1 channel 1, or ADC channel 1
16 (PTA0) KBIP0 / TPM1CH0 / ADP0 Keyboard interrupt input 0, TPM1 channel 0, or ADC channel 0

Key Features

Feature Design Value
Internal Clock Source (ICS) FLL-controlled with factory-trimmed 39.0625 kHz reference enables stable 1–10 MHz bus clocks without external crystal
Low-Power Operation Stop3 mode draws ≤76.1 μA at –40 to 125°C; RTC adder consumes only 500 nA, enabling years-long battery operation
LIN-Capable SCI Full-duplex NRZ SCI with hardware LIN master break generation and slave break detection for automotive body networks
Integrated Temperature Sensing On-chip 1.7 mV/°C temperature sensor with automatic ADC conversion reduces BOM count in thermal monitoring systems
Robust System Protection Configurable COP watchdog with independent 1 kHz clock, low-voltage detect (2.48–4.2 V thresholds), and illegal opcode/address reset

Applications

Automotive Body Control Module Industrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in entry-level vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing LIN slave protocol, reading switch inputs, driving relays and LEDs, and managing wake-on-event from BKGD or IRQ.

Use Value: Integrated LIN SCI, low-power Stop3 mode, and on-chip temperature sensor eliminate external transceivers and thermal ICs, reducing PCB area and BOM cost.

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity (via external sensor), and motion data.

IC Role / Device Role / Timing Role: Data acquisition controller sampling sensors via ADC, processing values, and transmitting over UART to gateway; enters Stop3 between readings.

Use Value: 76.1 μA Stop3 current and RTC-triggered wakeup enable multi-year battery life; 10-bit ADC with internal reference ensures consistent measurement accuracy.

Home Appliance Control Board Smart HVAC Actuator

Use Scenario: Main control unit for microwave oven managing keypad scan, display driver, safety interlocks, and cooking timers.

IC Role / Device Role / Timing Role: Real-time coordinator using TPM PWM for fan speed control, KBI for matrix keypad scanning, and RTC for cooking countdown.

Use Value: Keyboard interrupt module (KBI) with 8-pin support simplifies matrix decoding; software-selectable drive strength prevents EMI on relay drivers.

Use Scenario: Position feedback and motor control for damper actuators in residential HVAC systems.

IC Role / Device Role / Timing Role: Closed-loop controller reading potentiometer via ADC, generating PWM output via TPM, and communicating status over SCI to main controller.

Use Value: Edge-aligned and centered PWM modes allow precise motor phase control; internal bandgap reference ensures stable ADC performance across supply variations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S08SG8E2MTJ Same HCS08 core, 8 KB flash, but adds SPI interface and higher ADC sample rate (1.3 μs); 20-pin SOIC package Required when SPI-based sensor or memory expansion is needed; not pin-compatible with MC9S08SE8MTG's 16-pin TSSOP Select if SPI connectivity or faster ADC is critical; requires PCB redesign due to different pin count and layout
MC9RS08KA8CWJ RSA08 core (simplified HCS08 derivative), 8 KB flash, no TPM modules, only SCI and ADC; 16-pin SOIC Suitable for ultra-low-cost UART-only control tasks without PWM or timer-intensive functions Choose for cost-sensitive, non-timing-critical applications where TPM and RTC are unnecessary

Compared with S9S08SG8E2MTJ and MC9RS08KA8CWJ, the MC9S08SE8MTG uniquely balances LIN-capable SCI, dual TPM modules, RTC, and Stop3 power efficiency in a compact 16-pin TSSOP-making it optimal for space-constrained automotive and industrial nodes requiring mixed-signal timing control.

Availability

MC9S08SE8MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance control boards, and smart HVAC actuators requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08SE8MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08SE8MTG belongs to the legacy HCS08 microcontroller family, designed for cost-effective, low-power embedded control in automotive body electronics and industrial automation where LIN communication and mixed-signal integration are essential.

FAQ

What is the maximum bus frequency supported by the MC9S08SE8MTG?

The MC9S08SE8MTG supports a maximum bus frequency of 10 MHz, achieved when the internal clock source (ICS) is configured with the FLL enabled and the DCO output trimmed to 20 MHz (divided by 2). This is confirmed in Section 3.8 of the Rev. 4 datasheet under ICS Frequency Specifications, where fdco_t is specified as 16–20 MHz in low-range DRS=00 mode.

Does the MC9S08SE8MTG support LIN communication natively?

Yes, the MC9S08SE8MTG supports LIN communication natively through its SCI module, which includes hardware-assisted LIN master extended break generation and LIN slave extended break detection. These features are explicitly listed in the "Peripherals" section of the Rev. 4 datasheet and require no external transceiver for basic LIN node functionality.

What power modes does the MC9S08SE8MTG offer, and what is the lowest current consumption?

The MC9S08SE8MTG offers Wait, Stop2, and Stop3 power-saving modes. The lowest active current is in Stop3 mode: 76.1 μA maximum at –40 to 125°C (Table 8, row 5). With RTC enabled, the adder is only 500 nA - making it suitable for battery-powered applications requiring infrequent wakeups.

Can the MC9S08SE8MTG operate without an external crystal?

Yes, the MC9S08SE8MTG can operate without an external crystal using its internal clock source (ICS) with the FLL enabled. The factory-trimmed internal reference (39.0625 kHz) allows bus frequencies from 1–10 MHz, eliminating the need for external timing components in cost-sensitive designs.

What is the ADC resolution and conversion time of the MC9S08SE8MTG?

The MC9S08SE8MTG features a 10-bit successive-approximation ADC with a typical conversion time of 2.5 μs. This specification is stated in the "Peripherals" section of the Rev. 4 datasheet and verified in Table 11 under ADC Operating Conditions, where fADCK ranges up to 8.0 MHz in high-speed mode.

MC9S08SE8MTG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
LINbus, SCI
Peripherals:
LVD, POR, PWM
Number of I/O:
14
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SE8MTG FAQ

1.How can I place an order for MC9S08SE8MTG through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SE8MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SE8MTG reliable?

The price and inventory of MC9S08SE8MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SE8MTG is usually 5 days.

3.What payment methods are accepted for MC9S08SE8MTG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SE8MTG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08SE8MTG?

MC9S08SE8MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SE8MTG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SE8MTG?

For technical support, including MC9S08SE8MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SE8MTG requirements.

6.How does Aetrix verify that MC9S08SE8MTG is sourced from the original manufacturer or authorized distributors?

All MC9S08SE8MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SE8MTG meets industry standards.

7.What is the process for return or replacement of MC9S08SE8MTG?

All MC9S08SE8MTG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SE8MTG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SE8MTG part is unused and in its original packaging.

Return procedure for MC9S08SE8MTG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S08SE8MTG Tags

  • MC9S08SE8MTG
  • MC9S08SE8MTG PDF
  • MC9S08SE8MTG Datasheet
  • MC9S08SE8MTG Specifications
  • MC9S08SE8MTG Images
  • NXP Semiconductors
  • NXP Semiconductors MC9S08SE8MTG
  • Buy MC9S08SE8MTG
  • MC9S08SE8MTG Price
  • MC9S08SE8MTG Distributor
  • MC9S08SE8MTG Supplier
  • MC9S08SE8MTG Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER