NXP Semiconductors MC9S08SH16CTGR

Overview

MC9S08SH16CTGR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip FLASH, 1 KB RAM, and a 40-MHz CPU core. It integrates ADC (10-bit, 16-channel), dual TPM PWM modules, SCI, SPI, I²C, RTC, and ACMP - all operating in Stop3 mode. Designed for cost-sensitive embedded control in automotive body electronics and industrial sensors.

For engineers reviewing the MC9S08SH16CTGR datasheet, MC9S08SH16CTGR pinout, MC9S08SH16CTGR application, or MC9S08SH16CTGR equivalent, key selection criteria include FLASH size (16 KB), bus frequency support (up to 20 MHz via ICS), low-power stop3 operation, integrated analog peripherals, and TSSOP-16 package compatibility.

Technical Context

The MC9S08SH16CTGR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature), enabling stable 2–20 MHz bus frequencies without external crystal.

Peripherals include two 2-channel TPM modules supporting input capture, output compare, and edge-/center-aligned PWM; a 10-bit ADC with 2.5 μs conversion time, temperature sensor, and internal bandgap reference; and an analog comparator (ACMP) with interrupt capability and optional routing to TPM - all functional in Stop3 mode for ultra-low-power wake-up applications.

Key Specifications

Pinout & Package

MC9S08SH16CTGR is housed in a 16-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm lead pitch and exposed pad for thermal performance. Pinout validated per Freescale MC9S08SH32 Series Data Sheet Rev. 3 (covers MC9S08SH16).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08SH32CTGR, the MC9S08SH16CTGR delivers identical peripheral functionality and power efficiency at lower FLASH capacity and unit cost - making it optimal for fixed-feature, volume-sensitive applications. Against S9KEAZ128AMLH, it trades raw performance and modern peripherals for proven 8-bit simplicity, smaller die size, and lower system-level BOM cost.

Availability

MC9S08SH16CTGR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance controllers, and portable medical devices requiring stable component supply across multi-year production cycles.

Supply support for MC9S08SH16CTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The HCS08 family - including MC9S08SH16CTGR - was designed for cost-effective, low-power embedded control in automotive body electronics and industrial automation where reliability, small footprint, and mixed-signal integration are critical.

FAQ

What is the maximum bus frequency supported by the MC9S08SH16CTGR?

The MC9S08SH16CTGR supports a maximum bus frequency of 20 MHz when using its internal clock source (ICS) with frequency-locked loop (FLL). This is achieved with proper configuration of the ICS module and external or internal reference trimming. The 40-MHz CPU core operates at twice the bus frequency, delivering efficient instruction throughput for real-time control tasks. MC9S08SH16CTGR maintains full peripheral functionality at this speed.

Does the MC9S08SH16CTGR include an integrated temperature sensor?

Yes, the MC9S08SH16CTGR includes an on-die temperature sensor accessible through its 10-bit ADC module. The sensor is calibrated and referenced to the internal bandgap voltage, enabling accurate ambient temperature measurement without external components. It operates in Run, Wait, and Stop3 modes, allowing thermal monitoring even during ultra-low-power states. MC9S08SH16CTGR's ADCSC1 and ADCSC2 registers control sensor activation and conversion sequencing.

What debug interface does the MC9S08SH16CTGR use?

The MC9S08SH16CTGR uses a single-wire background debug mode (BDM) interface via the BKGD/MS pin. This allows full in-circuit debugging, flash programming, and breakpoint setting with minimal hardware overhead - no JTAG header or additional pins required. The on-chip debug module supports one hardware breakpoint and two additional breakpoints via the ICE module. MC9S08SH16CTGR's BDM implementation is compatible with standard Freescale/NXP BDM tools and open-source interfaces like OSBDM.

Is the MC9S08SH16CTGR pin-compatible with other devices in the SH series?

Yes, the MC9S08SH16CTGR in the 16-pin TSSOP package (CTGR suffix) shares identical pinout with MC9S08SH32CTGR and MC9S08SH8CTGR. All three devices use the same 16-pin assignment for power, I/O, reset, debug, and oscillator signals - enabling hardware design reuse across FLASH size variants. MC9S08SH16CTGR maintains register-level compatibility, allowing software portability with only FLASH size and security configuration adjustments.

What low-power modes are available on the MC9S08SH16CTGR?

The MC9S08SH16CTGR supports multiple low-power modes: Wait mode (CPU halted, peripherals active), Stop2 (deep sleep with fast wake-up), and Stop3 (ultra-low-power mode with RTC, ADC, and ACMP operational). Stop3 draws sub-microamp current while retaining RAM and selected peripheral context. All modes are entered via STOP instruction and exited by interrupt or reset. MC9S08SH16CTGR's SPMSC1 and SPMSC2 registers configure and monitor these states.