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NXP Semiconductors MC9S08SH16CTJ

Part No.:
MC9S08SH16CTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SH16CTJ.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,939

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Product details

Overview

MC9S08SH16CTJ from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB Flash, 1 KB RAM, and a 40-MHz CPU core. It integrates ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and low-power stop modes. Used in industrial sensor nodes and appliance control where compact code footprint and mixed-signal integration are critical.

For engineers reviewing the MC9S08SH16CTJ datasheet, MC9S08SH16CTJ pinout, MC9S08SH16CTJ application, or MC9S08SH16CTJ equivalent, key selection criteria include Flash size, peripheral set (especially dual TPM modules and stop3-capable ADC), TSSOP-28 package compatibility, and background debug interface support.

Technical Context

The MC9S08SH16CTJ implements the HCS08 CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) delivers bus frequencies from 2 MHz to 20 MHz using FLL with ±0.2% trimming resolution and ±2% deviation over voltage/temperature.

Peripherals include a 16-channel 10-bit ADC with 2.5 μs conversion time and temperature sensor, two 2-channel TPM modules supporting edge- or center-aligned PWM, and an SCI module with LIN master break generation. All major analog and timing peripherals remain functional in Stop3 mode.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 CPUV3, 40-MHz max operation - enables deterministic real-time response for control loops
Flash Memory16 KB on-chip Flash - sufficient for firmware with integrated communication stacks and calibration tables
RAM1 KB on-chip RAM - supports moderate variable buffering and stack depth for nested interrupts
ADC16-channel, 10-bit, 2.5 μs conversion - allows high-speed sampling of multiple sensors without external mux
RTC8-bit real-time counter with 1 kHz internal oscillator - provides wake-up scheduling in all power modes without external crystal
Package28-pin TSSOP (JEDEC MO-153AA) - surface-mount compatible with 0.65 mm pitch, suitable for space-constrained PCBs
Debug InterfaceSingle-wire background debug (BDM) - enables in-circuit programming and breakpoint debugging with minimal pin overhead

Pinout & Package

MC9S08SH16CTJ is housed in a 28-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm lead pitch, JEDEC MO-153AA compliant. Pin functions align with the MC9S08SH32 series pin assignment per datasheet Rev. 3 Section 2.1.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual-supply domains: VDD powers digital logic; separate VDDAD/VSSAD pins isolate analog section for ADC noise immunity
PTA0–PTA7Port A general-purpose I/O8-bit bidirectional port with configurable pull-up, slew rate, and drive strength; PTA0 supports IRQ interrupt
PTB0–PTB7Port B general-purpose I/O8-bit port; PTB[5:2] supports ganged output for synchronized state changes across four pins
PTC0–PTC7Port C general-purpose I/O8-bit port; PTC[3:0] supports ganged output; PTC0–PTC2 multiplexed with TPM1 channels
XTAL, EXTALCrystal oscillator inputsSupports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators for precise system timing or low-power RTC reference
BKGD/MSBackground debug / mode selectSingle-wire BDM interface pin; also selects active background mode during reset for debug entry
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset supervisor or manual pushbutton

Key Features

FeatureDesign Value
Stop3 power modeUltra-low-power state retaining RAM and selected peripherals (ADC, ACMP, RTC, SCI) active - enables battery-powered wake-on-event operation
Internal clock source (ICS)FLL-based clock generator with ±0.2% trim resolution - eliminates need for external crystal in cost-sensitive applications while maintaining timing accuracy
On-chip security circuitryFLASH and RAM protection via security byte - prevents unauthorized firmware readout or memory dump during field service or reverse engineering
TPM modulesTwo independent 2-channel timer/pwm units - supports motor control (center-aligned PWM), LED dimming, and input capture for encoder feedback
Temperature sensorIntegrated die-temperature sensor with ADC channel - enables thermal monitoring without external components for fan control or safety shutdown

Applications

Industrial Sensor NodeHome Appliance Control

Use Scenario: Wireless temperature/humidity node with local data logging and periodic BLE transmission.

IC Role / Device Role / Timing Role: Main system controller managing sensor acquisition, data processing, low-power scheduling, and communication interface.

Use Value: MC9S08SH16CTJ's Stop3 mode + RTC + ADC + internal temperature sensor enable autonomous cyclic wake-up and measurement without external timing or sensing components.

Use Scenario: Washing machine main control board handling motor drive, water level sensing, and user interface.

IC Role / Device Role / Timing Role: Central MCU coordinating motor PWM, analog pressure/temperature readings, and front-panel display updates.

Use Value: Dual TPM modules provide independent edge-aligned PWM for brushless motor control and center-aligned PWM for buzzer/audio tone generation.

Smart ThermostatPower Tool Motor Controller

Use Scenario: Battery-powered HVAC thermostat with ambient sensing, display, and wireless connectivity.

IC Role / Device Role / Timing Role: Primary MCU executing PID loop, managing LCD driver, and interfacing with RF transceiver via SPI/I²C.

Use Value: MC9S08SH16CTJ's 16 KB Flash accommodates closed-loop control algorithms and communication protocol stacks while its low-voltage detection ensures graceful shutdown before battery depletion.

Use Scenario: Cordless drill/driver with electronic commutation, torque limiting, and battery protection.

IC Role / Device Role / Timing Role: Real-time motor controller performing commutation sequencing, current sensing, and thermal foldback.

Use Value: 10-bit ADC with 2.5 μs conversion captures fast current transients; ACMP with bandgap reference enables overcurrent detection within 1 µs response time.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SH32CTJ32 KB Flash, same peripherals and pinout - identical architecture and register mapRequired when firmware exceeds 16 KB or needs larger data buffers for communication protocolsSelect MC9S08SH32CTJ only if additional Flash/RAM is confirmed necessary; otherwise MC9S08SH16CTJ reduces BOM cost
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB Flash, 16 KB RAM, different instruction set and peripheral registersSuitable for new designs requiring higher performance, USB, or CAN; not drop-in compatibleChoose S9KEAZ128AMLH for future-proofing or scalability; migration requires full firmware rewrite and PCB layout review

Compared with MC9S08SH32CTJ, the MC9S08SH16CTJ offers identical peripheral functionality and power behavior at lower Flash density and cost; versus S9KEAZ128AMLH, it provides proven 8-bit determinism and smaller code size but lacks ARM ecosystem tooling and advanced interfaces like USB or CAN.

Availability

MC9S08SH16CTJ is available at Aetrix Electronics and suitable for industrial sensor nodes, home appliance control, smart thermostats, and power tool motor controllers requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08SH16CTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08SH16CTJ belongs to the legacy HCS08 microcontroller family, designed for cost-sensitive, low-power embedded control applications requiring high analog integration and robust debug capability in compact packages.

FAQ

What is the maximum operating frequency of the MC9S08SH16CTJ?

The MC9S08SH16CTJ features an HCS08 CPU core rated for up to 40 MHz operation. Its internal clock source (ICS) supports bus frequencies from 2 MHz to 20 MHz using the FLL, with optional external crystal up to 16 MHz. The 40-MHz rating refers to core instruction execution speed under optimal conditions, not bus clock frequency.

Does the MC9S08SH16CTJ support in-circuit debugging?

Yes, the MC9S08SH16CTJ includes a single-wire background debug (BDM) interface compliant with Freescale/NXP BDM specification. It supports breakpoint setting, single-step execution, and memory/register inspection during live operation. The on-chip debug module provides two additional hardware breakpoints and an eight-deep FIFO for trace data capture.

Can the MC9S08SH16CTJ operate in ultra-low-power modes?

Yes, the MC9S08SH16CTJ supports three low-power modes: Wait, Stop2, and Stop3. Stop3 is the deepest, drawing sub-1 µA typical current while retaining RAM, RTC, and select peripherals including ADC, ACMP, and SCI. This enables wake-on-comparator event or RTC alarm without external components.

What analog peripherals are integrated into the MC9S08SH16CTJ?

The MC9S08SH16CTJ integrates a 16-channel 10-bit ADC with 2.5 µs conversion time, automatic compare function, and internal temperature sensor; two analog comparators (ACMP) with selectable interrupt edges and bandgap reference option; and dedicated analog power/ground pins (VDDAD/VSSAD) for noise isolation. All analog modules remain operational in Stop3 mode.

Is the MC9S08SH16CTJ pin-compatible with other devices in the SH-series?

Yes, the MC9S08SH16CTJ in 28-TSSOP package shares identical pinout with MC9S08SH32CTJ and MC9S08SH8CTJ per datasheet Rev. 3 Section 2.1. This allows hardware reuse across Flash variants. However, pin compatibility does not extend to non-SH-series HCS08 devices or Kinetis E-family MCUs due to differing peripheral mappings and signal assignments.

MC9S08SH16CTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH16CTJ FAQ

1.How can I place an order for MC9S08SH16CTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH16CTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH16CTJ reliable?

The price and inventory of MC9S08SH16CTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH16CTJ is usually 5 days.

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MC9S08SH16CTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH16CTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH16CTJ?

For technical support, including MC9S08SH16CTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH16CTJ requirements.

6.How does Aetrix verify that MC9S08SH16CTJ is sourced from the original manufacturer or authorized distributors?

All MC9S08SH16CTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH16CTJ meets industry standards.

7.What is the process for return or replacement of MC9S08SH16CTJ?

All MC9S08SH16CTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH16CTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH16CTJ part is unused and in its original packaging.

Return procedure for MC9S08SH16CTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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