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NXP Semiconductors MC9S08SH16MTG
- Part No.:
- MC9S08SH16MTG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08SH16MTG.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,104
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Product details
Overview
MC9S08SH16MTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB flash, 1 KB RAM, and a 40-MHz CPU core. It integrates ADC, ACMP, SCI, SPI, I²C, TPM, RTC, and low-power stop3 mode, targeting embedded control in industrial sensors and automotive body electronics.
For engineers reviewing the MC9S08SH16MTG datasheet, MC9S08SH16MTG pinout, MC9S08SH16MTG application, or MC9S08SH16MTG equivalent, key selection criteria include flash size, stop3-mode operation, on-chip debug support, and 23 GPIOs with configurable slew rate and hysteresis.
Technical Context
The MC9S08SH16MTG implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) delivers bus frequencies from 2 MHz to 20 MHz using FLL with ±0.2% trimming resolution and ±2% deviation over voltage/temperature.
Peripherals include a 16-channel 10-bit ADC (2.5 μs conversion), two 2-channel TPM modules, real-time counter with 1-kHz low-power oscillator, and full-duplex SCI with LIN break generation/detection - all functional in stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max frequency, BGND instruction support |
| Flash Memory | 16 KB on-chip FLASH with read/program/erase over full operating voltage and temperature range |
| RAM | 1 KB on-chip RAM with security circuitry preventing unauthorized access |
| ADC | 16-channel, 10-bit resolution, 2.5 μs conversion time, includes temperature sensor and bandgap reference |
| Power Modes | Two very low power stop modes (stop2, stop3), reduced power wait mode, RTC active in all modes |
| Debug Interface | Single-wire background debug interface with one hardware breakpoint and on-chip ICE module (two comparators, nine trigger modes) |
| I/O Pins | 23 general-purpose I/O pins + 1 output-only pin; all inputs have hysteresis and configurable pull-up |
Pinout & Package
MC9S08SH16MTG is packaged in a 28-pin TSSOP (Thin Shrink Small Outline Package) with 0.65 mm pitch, compliant with JEDEC MO-153AC. Pin assignments match the MC9S08SH32 series pin-compatible family layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| XTAL, EXTAL | Crystal oscillator input/output | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators for precise timing |
| BKGD/MS | Background debug / mode select | Single-wire debug interface; also selects boot mode during reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset assertion and LVD-triggered reset |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with edge-sensitive interrupts, configurable drive strength and slew rate |
| PTB0–PTB7 | Port B general-purpose I/O | Ganged output option on PTB[5:2]; supports peripheral function multiplexing (SCI, SPI, TPM) |
| PTC0–PTC7 | Port C general-purpose I/O | Ganged output option on PTC[3:0]; supports ACMP and ADC channel inputs |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 low-power mode | RTC and selected peripherals remain active while CPU and most clocks halt - enables battery-powered wake-on-event operation |
| On-chip security | FLASH and RAM protection via security circuitry prevents unauthorized read/write access during debug or runtime |
| Integrated analog subsystem | 10-bit ADC with temperature sensor and internal bandgap reference eliminates need for external precision references |
| LIN-compliant SCI | Full-duplex NRZ SCI with master break generation and slave break detection - meets LIN 2.0 physical layer requirements |
| Configurable I/O | All GPIOs support programmable hysteresis, pull-up, slew rate, and drive strength - simplifies EMI mitigation and signal integrity tuning |
Applications
| Automotive Body Control | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized door module managing window lift, mirror adjustment, and interior lighting. IC Role / Device Role / Timing Role: Main system controller executing CAN/LIN gateway logic, PWM motor control, and ADC-based position sensing. Use Value: Stop3 mode enables ultra-low standby current (<1 μA) while maintaining RTC-triggered periodic wake-up for status polling. | Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and ambient light data. IC Role / Device Role / Timing Role: Data acquisition hub with integrated ADC, ACMP, and RTC - performs timed sampling and local threshold triggering. Use Value: On-chip 10-bit ADC with internal bandgap reference and temperature sensor eliminates external components, reducing BOM cost and board area. |
| Home Appliance Control | Medical Diagnostic Equipment |
Use Scenario: Smart washing machine control board managing motor drive, water level sensing, and user interface. IC Role / Device Role / Timing Role: Real-time motor timing controller using TPM PWM outputs and ACMP-based current sensing feedback. Use Value: Ganged I/O on PTB[5:2] and PTC[3:0] allows synchronized actuator enable/disable with single register write - improves software determinism. | Use Scenario: Portable blood glucose meter requiring precise analog measurement and low-power operation. IC Role / Device Role / Timing Role: Signal conditioning and digitization engine using ADC with automatic compare and internal temperature compensation. Use Value: ADC runs in stop3 mode with 2.5 μs conversion time and internal bandgap reference - ensures consistent accuracy across battery voltage drop. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SH32MTG | 32 KB FLASH, identical peripheral set and pinout; same 28-TSSOP package | Higher flash capacity supports larger firmware images and bootloader+application separation | Select when firmware exceeds 16 KB or future scalability is required without PCB change |
| S9S08SG16E2MTJ | Same core and memory size; enhanced ESD rating (±8 kV HBM), updated qualification per AEC-Q100 Rev G | Qualified for automotive underhood applications where extended temperature and robustness are mandatory | Select for new automotive designs requiring AEC-Q100 Grade 2 compliance and higher ESD immunity |
Compared with MC9S08SH16MTG, MC9S08SH32MTG offers double flash capacity in identical packaging, while S9S08SG16E2MTJ provides automotive-grade reliability at same memory size - enabling trade-offs between code growth headroom and qualification rigor.
Availability
MC9S08SH16MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance control, and portable medical devices requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08SH16MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The HCS08 family, including MC9S08SH16MTG, was designed for cost-sensitive, low-power embedded control applications requiring high integration, robust debug capability, and automotive-grade reliability.
FAQ
What is the maximum bus frequency supported by the MC9S08SH16MTG?
The MC9S08SH16MTG supports a maximum bus frequency of 20 MHz, achieved via its internal clock source (ICS) with frequency-locked loop (FLL). This is enabled by precision trimming of the internal reference, delivering ±0.2% resolution and ±2% deviation over voltage and temperature - sufficient for deterministic real-time control in automotive and industrial applications. The MC9S08SH16MTG does not require external crystal for basic operation due to this calibrated internal source.
Does the MC9S08SH16MTG support debugging in-circuit without dedicated JTAG hardware?
Yes, the MC9S08SH16MTG features a single-wire background debug interface (BDM) that enables full in-circuit debugging using only the BKGD/MS pin. It supports breakpoint setting, on-chip emulation with two comparators and nine trigger modes, and an eight-deep FIFO for flow tracing - eliminating need for external JTAG adapters. This capability is integral to the MC9S08SH16MTG design and requires no additional debug silicon.
Can the MC9S08SH16MTG operate in ultra-low-power modes while retaining real-time wake-up capability?
Yes, the MC9S08SH16MTG supports stop3 mode, where the CPU and most clocks halt while the real-time counter (RTC) continues running from a dedicated 1-kHz internal oscillator. This enables cyclic wake-up without external components and maintains <1 μA typical current draw - a core capability confirmed in the MC9S08SH16MTG datasheet's power-saving section and validated across temperature/voltage ranges.
What analog features are integrated into the MC9S08SH16MTG?
The MC9S08SH16MTG integrates a 16-channel, 10-bit ADC with 2.5 μs conversion time, automatic compare function, internal temperature sensor, and bandgap reference channel - all operational in stop3 mode. It also includes two analog comparators (ACMP) with selectable interrupt edges and routing to TPM, supporting threshold detection without CPU intervention. These functions are fully documented in the MC9S08SH16MTG peripheral chapters.
Is the MC9S08SH16MTG pin-compatible with other members of the HCS08 SH-series?
Yes, the MC9S08SH16MTG shares identical pinout with MC9S08SH32MTG and MC9S08SH8MTG in the 28-TSSOP package, as confirmed in the shared "MC9S08SH32 Series Data Sheet" covering all variants. This allows direct substitution within the same footprint when flash requirements change - though users must verify software compatibility and security register settings for each variant's specific memory map.
MC9S08SH16MTG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 13
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08SH16MTG FAQ
1.How can I place an order for MC9S08SH16MTG through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SH16MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SH16MTG reliable?
The price and inventory of MC9S08SH16MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH16MTG is usually 5 days.
3.What payment methods are accepted for MC9S08SH16MTG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH16MTG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08SH16MTG?
MC9S08SH16MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08SH16MTG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SH16MTG?
For technical support, including MC9S08SH16MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH16MTG requirements.
6.How does Aetrix verify that MC9S08SH16MTG is sourced from the original manufacturer or authorized distributors?
All MC9S08SH16MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH16MTG meets industry standards.
7.What is the process for return or replacement of MC9S08SH16MTG?
All MC9S08SH16MTG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH16MTG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SH16MTG part is unused and in its original packaging.
Return procedure for MC9S08SH16MTG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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