Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC9S08SH16MTJR

Part No.:
MC9S08SH16MTJR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SH16MTJR.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,138

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC9S08SH16MTJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip FLASH, 1 KB RAM, and a 40-MHz CPU core. It integrates ADC (16-channel, 10-bit), dual TPM PWM modules, SCI, SPI, I²C, RTC, and analog comparators - designed for cost-sensitive industrial control and sensor interface applications in 16-TSSOP package.

For engineers reviewing the MC9S08SH16MTJR datasheet, MC9S08SH16MTJR pinout, MC9S08SH16MTJR application, or MC9S08SH16MTJR equivalent, key selection criteria include FLASH size, stop-mode power consumption, peripheral mix (especially RTC + ACMP + ADC in STOP3), and TSSOP-16 footprint compatibility with space-constrained embedded designs.

Technical Context

The MC9S08SH16MTJR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) delivers bus frequencies from 2 MHz to 20 MHz using FLL with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature).

Peripherals operate across all power modes: ADC and ACMP remain functional in STOP3 mode; RTC runs continuously on 1-kHz internal oscillator; SCI supports LIN master break generation and wake-up on active edge - enabling low-power sensor polling and communication in battery-operated systems.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 8-bit CPU, 40-MHz max operation - enables deterministic real-time control at sub-μs interrupt latency
FLASH Memory16 KB on-chip FLASH with read/program/erase over full VDD and temperature range - supports field firmware updates without external memory
RAM1 KB on-chip RAM with security lock - sufficient for stack, variables, and small buffers in compact control loops
ADC16-channel, 10-bit, 2.5 μs conversion time with internal bandgap reference and temperature sensor - enables direct analog sensing without external references
Power ModesTwo very low-power stop modes (STOP2/STOP3), reduced-power wait mode - STOP3 draws <1 μA while retaining RTC, ACMP, and ADC functionality
Package16-pin TSSOP (4.4 mm × 5.0 mm, 0.65 mm pitch) - surface-mount compatible with automated assembly and thermal performance suitable for industrial ambient
Clock SourcesXOSC (31.25 kHz–16 MHz crystal/resonator) + ICS with FLL - allows flexible timing: high-accuracy external clock or low-cost self-contained operation

Pinout & Package

MC9S08SH16MTJR is housed in a 16-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm lead pitch, JEDEC MO-153 compliant. Pinout validated per Freescale MC9S08SH32 Series Data Sheet Rev. 3 (2014), Section 2.1 - applicable to MC9S08SH16 family members including MTJR variant.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltage (2.7–5.5 V)Primary power input; decoupling required within 10 mm of pin for stable core/peripheral operation
VSSGround referenceDigital ground return; must be connected to low-impedance PCB plane to minimize noise coupling into ADC/ACMP
XTALOscillator inputConnects to crystal/resonator; internal load capacitors enabled - eliminates need for external caps in basic configurations
EXTALOscillator outputDrives crystal/resonator; requires no external buffer - simplifies clock circuit layout
RESETActive-low reset inputAsynchronous reset assertion clears CPU registers and initializes peripherals; internal pull-up ensures defined state at power-up
BKGD/MSSingle-wire debug interfaceEnables background debug mode and programming via dedicated SWD line - no JTAG header needed
PTA0–PTA7Port A GPIOs8-bit bidirectional port with configurable pull-ups, slew rate, and drive strength - supports ganged writes and interrupt-on-change
PTB0–PTB7Port B GPIOs8-bit bidirectional port; PTB[5:2] support ganged output - reduces software overhead for multi-signal control (e.g., LED banks, relay drivers)

Key Features

FeatureDesign Value
STOP3 Mode OperationRTC, ACMP, and ADC remain fully functional while CPU and bus clocks halt - enables ultra-low-power wake-on-event sensing without external wake controller
Internal Clock Source (ICS)FLL-based clock generation with ±0.2% trimming resolution - eliminates need for external crystal in cost-sensitive applications where ±2% accuracy suffices
On-Chip Security CircuitryPrevents unauthorized read-out of FLASH and RAM contents - protects firmware IP in deployed devices against invasive or non-invasive attacks
SCI with LIN SupportFull-duplex NRZ with master extended break generation and slave extended break detection - enables single-wire automotive body electronics communication without additional transceivers
TPM PWM ModulesTwo independent 2-channel timer/pwm modules with edge- and center-aligned PWM - supports motor control, LED dimming, and digital power regulation from one MCU

Applications

Industrial Sensor NodeSmart Thermostat Controller

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and occupancy via analog sensors and digital interfaces.

IC Role / Device Role / Timing Role: Central controller executing sensor acquisition, local decision logic, and wireless wakeup coordination - RTC provides precise 1-second sampling intervals; ACMP triggers wake on threshold breach.

Use Value: STOP3 mode draws <1 μA while maintaining RTC and ACMP operation - extends 2×AA battery life beyond 5 years without external wake circuitry.

Use Scenario: Residential HVAC control unit managing heating/cooling cycles, display backlight, and user input via buttons and rotary encoder.

IC Role / Device Role / Timing Role: Main system MCU handling UI responsiveness, PID loop execution, and relay/valve actuation - TPM modules generate smooth 100-Hz PWM for fan speed and LED brightness control.

Use Value: Integrated 16-channel ADC with internal bandgap reference eliminates external voltage reference IC - reduces BOM count and layout area by 2 components.

Motor Drive Interface BoardLegacy Equipment Retrofit Module

Use Scenario: Compact add-on board for BLDC motor commutation feedback, current sensing, and fault protection in small appliances.

IC Role / Device Role / Timing Role: Real-time motor controller interfacing Hall sensors (via GPIO), shunt resistor (via ADC), and gate drivers (via TPM PWM outputs) - MTIM provides precise timing for commutation sequencing.

Use Value: Dual TPM modules deliver 4 independent PWM outputs with synchronized dead-time insertion - enables 3-phase inverter control without external PWM generator IC.

Use Scenario: Drop-in replacement module adding digital monitoring and remote diagnostics to aging industrial machinery with 24-V DC control inputs.

IC Role / Device Role / Timing Role: Protocol bridge translating legacy discrete I/O signals into Modbus RTU over RS-485 - SCI handles UART framing; I²C manages EEPROM configuration storage.

Use Value: On-chip FLASH block protection prevents accidental firmware overwrite during field updates - ensures operational continuity during maintenance windows.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SH8MTJR8 KB FLASH, 512 B RAM - half the program memory and data space of MC9S08SH16MTJRSuitable only for simpler control tasks with minimal ISR complexity or calibration data storageSelect when firmware size is ≤6 KB and no future feature expansion is planned
S9KEAZ128AMLHARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, higher peripheral integration (CAN, USB, more timers)Requires toolchain migration and larger PCB footprint; supports advanced connectivity not available in HCS08Choose for new designs needing scalability, CAN bus, or long-term roadmap alignment beyond 8-bit architecture

Compared with MC9S08SH8MTJR, the MC9S08SH16MTJR provides double FLASH/RAM for complex control algorithms and calibration tables; versus S9KEAZ128AMLH, it offers lower power in STOP3, smaller footprint, and mature toolchain support - making it optimal for cost- and space-constrained legacy-compatible upgrades.

Availability

MC9S08SH16MTJR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart thermostat controllers, motor drive interface boards, and legacy equipment retrofit modules requiring stable component supply and long-lifecycle support.

Supply support for MC9S08SH16MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08SH16MTJR belongs to the HCS08 microcontroller family, engineered for cost-effective, low-power embedded control in space-constrained industrial and consumer applications - emphasizing peripheral integration, stop-mode efficiency, and debug simplicity.

FAQ

What is the maximum operating frequency of the MC9S08SH16MTJR CPU core?

The MC9S08SH16MTJR features an HCS08 CPU core rated for up to 40 MHz operation. This maximum frequency is achievable when powered within the specified 2.7–5.5 V supply range and operating across the full industrial temperature range (−40°C to +105°C). The actual bus frequency depends on the selected clock source and ICS configuration - for example, the internal clock source (ICS) supports bus frequencies from 2 MHz to 20 MHz using its FLL, while external crystal oscillators can enable full 40-MHz operation. The MC9S08SH16MTJR datasheet confirms this rating in Section 1.2 and electrical characteristics tables.

Does the MC9S08SH16MTJR support debugging via a standard interface?

Yes, the MC9S08SH16MTJR supports in-circuit debugging through a single-wire background debug (BDM) interface using the BKGD/MS pin. This interface enables full read/write memory access, breakpoint setting (one hardware breakpoint plus two more via on-chip debug module), and real-time register inspection without halting peripheral operation. The on-chip debug module also includes an 8-deep FIFO for change-of-flow tracing and supports both tag and force breakpoints. No external JTAG adapter is required - the MC9S08SH16MTJR is compatible with standard Freescale/NXP BDM debug tools such as the OSBDM v4 and S32DS IDE.

Can the MC9S08SH16MTJR operate in ultra-low-power modes while retaining analog functionality?

Yes, the MC9S08SH16MTJR supports STOP3 mode - a very low-power state where the CPU and bus clocks are halted but the RTC, ADC, and ACMP remain fully operational. In STOP3, typical current consumption is less than 1 μA at 3.3 V and 25°C, with full retention of RAM and peripheral registers. The ADC can perform conversions triggered by internal or external events, and the ACMP can generate interrupts on signal threshold crossings - enabling wake-up without external components. This capability is documented in Sections 3.6.1 and 9.4.7 of the MC9S08SH32 Series Data Sheet, which applies directly to the MC9S08SH16MTJR.

What peripheral communication interfaces are integrated into the MC9S08SH16MTJR?

The MC9S08SH16MTJR integrates four serial communication peripherals: SCI (UART with LIN master/slave support), SPI (full-duplex or single-wire, master/slave capable), I²C (up to 100 kbps, multi-master, 7-bit/10-bit addressing), and a real-time counter (RTC) with external clock input option. All are accessible via dedicated pins and supported by interrupt-driven operation. The SCI module includes LIN-specific features like extended break generation/detection and wake-up on active edge; the I²C module supports broadcast mode and programmable slave address. These interfaces are detailed in Chapters 14–16 and Appendix A of the MC9S08SH32 Series Data Sheet, confirmed applicable to MC9S08SH16MTJR.

Is the MC9S08SH16MTJR pin-compatible with other members of the SH-series microcontrollers?

The MC9S08SH16MTJR in 16-TSSOP package shares identical pinout with MC9S08SH8MTJR and MC9S08SH4MTJR - all three variants use the same 16-pin mapping for power, reset, debug, oscillator, and GPIO functions. However, it is not pin-compatible with 20-TSSOP, 28-SOIC, or 28-TSSOP SH-series variants due to differing pin counts and assignments. Peripheral availability (e.g., number of TPM channels or ADC inputs) varies between FLASH sizes, but pin-level signal routing remains consistent across the 16-TSSOP family. This compatibility is verified in Section 2.1 (Device Pin Assignment) of the MC9S08SH32 Series Data Sheet.

MC9S08SH16MTJR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH16MTJR FAQ

1.How can I place an order for MC9S08SH16MTJR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH16MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH16MTJR reliable?

The price and inventory of MC9S08SH16MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH16MTJR is usually 5 days.

3.What payment methods are accepted for MC9S08SH16MTJR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH16MTJR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08SH16MTJR?

MC9S08SH16MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH16MTJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH16MTJR?

For technical support, including MC9S08SH16MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH16MTJR requirements.

6.How does Aetrix verify that MC9S08SH16MTJR is sourced from the original manufacturer or authorized distributors?

All MC9S08SH16MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH16MTJR meets industry standards.

7.What is the process for return or replacement of MC9S08SH16MTJR?

All MC9S08SH16MTJR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH16MTJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH16MTJR part is unused and in its original packaging.

Return procedure for MC9S08SH16MTJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S08SH16MTJR Tags

  • MC9S08SH16MTJR
  • MC9S08SH16MTJR PDF
  • MC9S08SH16MTJR Datasheet
  • MC9S08SH16MTJR Specifications
  • MC9S08SH16MTJR Images
  • NXP Semiconductors
  • NXP Semiconductors MC9S08SH16MTJR
  • Buy MC9S08SH16MTJR
  • MC9S08SH16MTJR Price
  • MC9S08SH16MTJR Distributor
  • MC9S08SH16MTJR Supplier
  • MC9S08SH16MTJR Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER