NXP Semiconductors MC9S08SH16VWL
- Part No.:
- MC9S08SH16VWL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
MC9S08SH16VWL.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 28SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,576
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Product details
Overview
MC9S08SH16VWL from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip FLASH, 1 KB RAM, and a 40-MHz CPU core. It integrates ADC (10-bit, 16-channel), dual TPM PWM timers, SCI, SPI, I²C, ACMP, RTC, and low-power stop3 mode. Used in industrial sensor nodes and motor control subsystems requiring deterministic real-time response and code security.
For engineers reviewing the MC9S08SH16VWL datasheet, MC9S08SH16VWL pinout, MC9S08SH16VWL application, or MC9S08SH16VWL equivalent, key selection criteria include FLASH size vs. SH32 variants, TSSOP-28 package compatibility, ICS clock accuracy (±2% over voltage/temperature), stop3-mode peripheral retention (ADC, ACMP, RTC), and single-wire BDM debug support.
Technical Context
The MC9S08SH16VWL implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Internal Clock Source (ICS) uses a frequency-locked loop (FLL) trimmed for ±0.2% resolution and ±2% deviation across voltage and temperature.
Peripherals operate under precise clock domain control: ADC conversion time is 2.5 μs at max speed; SCI supports LIN master break generation and slave break detection; TPM modules deliver edge- or center-aligned PWM with input capture and output compare on all four channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV3 running at up to 40 MHz; executes HC08 ISA with BGND instruction for background debug entry. |
| Memory | 16 KB on-chip FLASH (read/program/erase over full VDD/temp range); 1 KB RAM; FLASH block protection enabled via FPROT register. |
| ADC | 10-bit, 16-channel SAR ADC with 2.5 μs conversion time; includes internal bandgap reference, temperature sensor, and automatic compare function; operates in stop3 mode. |
| Clock System | ICS with FLL supports bus frequencies from 2–20 MHz; XOSC accepts 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators; 1-kHz RTC oscillator runs in all modes. |
| Power Modes | Two very low-power stop modes (stop2, stop3), reduced-power wait mode; stop3 retains ADC, ACMP, RTC, and I/O state with wake-up on interrupt or RTC match. |
| Debug Interface | Single-wire background debug (BDM) interface; supports one hardware breakpoint during debugging plus two additional breakpoints in on-chip ICE module with eight-deep FIFO. |
Pinout & Package
MC9S08SH16VWL is housed in a 28-pin TSSOP (Thin Shrink Small Outline Package) with 0.65 mm pitch, JEDEC MO-153 compliant, body dimensions 9.7 × 4.4 mm. Pinout validated per Freescale MC9S08SH32 Series Data Sheet Rev. 3 (2014), Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD (core/analog I/O), VSS (digital/analog ground); decoupling required per Section 2.2.1. |
| XTAL, EXTAL | Clock input/output | Crystal/resonator connection for XOSC; supports 31.25 kHz–38.4 kHz or 1–16 MHz; optional external clock input on EXTAL. |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and programming; also selects active background mode on reset. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; triggers COP timeout, LVD, or illegal opcode recovery. |
| PTA0–PTA7 | Port A GPIO | 8-bit general-purpose port with configurable pull-up, slew rate, drive strength; PTA0–PTA1 support IRQ interrupts. |
| PTB0–PTB7 | Port B GPIO | 8-bit port; PTB[5:2] support ganged output; PTB0–PTB1 serve as SCI TX/RX; PTB2–PTB3 as I²C SCL/SDA. |
| PTC0–PTC7 | Port C GPIO | 8-bit port; PTC[3:0] support ganged output; PTC0–PTC1 serve as SPI MOSI/MISO; PTC2–PTC3 as TPM1 CH0/CH1. |
| AD0–AD7 | ADC analog inputs | Eight dedicated analog input pins (AD0–AD7); shared with PTA0–PTA7 and PTC0–PTC1; configured via APCTLx registers. |
Key Features
| Feature | Design Value |
|---|---|
| FLASH Security Circuitry | Prevents unauthorized read-out of FLASH and RAM contents via security byte lock; enables secure firmware updates in field-deployed devices. |
| Stop3 Mode Retention | ADC, ACMP, RTC, and GPIO retain state and functionality during stop3; enables ultra-low-power wake-up on analog threshold crossing or time event without full MCU restart. |
| Integrated Temperature Sensor | On-die sensor calibrated against internal bandgap reference; provides system-level thermal monitoring without external components. |
| LIN-Compatible SCI | SCI module supports LIN 2.0 extended break generation (master) and detection (slave); eliminates need for external LIN transceiver in basic network nodes. |
| Configurable I/O Drive Strength | All output pins support programmable drive strength and slew rate; reduces EMI and improves signal integrity on noisy industrial PCBs. |
Applications
| Industrial Motor Control Subsystem | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop speed regulation of 24V DC brush motors in HVAC actuators using PWM-driven H-bridge drivers. IC Role / Device Role / Timing Role: Real-time controller executing PID algorithm, generating center-aligned PWM via TPM modules, sampling current sense ADC channels, and managing fault shutdown via ACMP. Use Value: Stop3 mode enables <1.5 μA standby current while retaining ADC readiness for overcurrent detection; integrated RTC schedules periodic self-test without external timer IC. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity (via I²C sensor), and ambient light (via ADC channel), transmitting data via SCI UART to gateway. IC Role / Device Role / Timing Role: System-on-chip host managing sensor polling, data preprocessing, low-power scheduling, and serial telemetry; RTC provides accurate timestamping. Use Value: Single-wire BDM allows in-field firmware updates without adding debug headers; internal temperature sensor validates calibration drift of external sensors. |
| Automotive Body Control Module (BCM) Node | Home Appliance Power Supply Supervisor |
Use Scenario: Door lock actuator control with position feedback, anti-pinch detection, and LIN bus communication to central BCM. IC Role / Device Role / Timing Role: LIN slave node interpreting commands, driving solenoid drivers via PWM, sampling hall-effect position sensor via ADC, and detecting stall via ACMP voltage drop. Use Value: LIN-compatible SCI eliminates external transceiver cost; stop3 mode maintains LIN wakeup capability while drawing <2 μA from vehicle battery during sleep. | Use Scenario: Monitoring AC input voltage, DC bus ripple, and thermal cutoff in switch-mode power supplies for washing machines and refrigerators. IC Role / Device Role / Timing Role: Safety-critical supervisor detecting overvoltage (ACMP), overtemperature (ADC + internal sensor), and brownout (LVD), triggering immediate shutdown via GPIO-controlled relay. Use Value: Hardware-based LVD with selectable trip points ensures deterministic response below 2.7 V; FLASH block protect prevents accidental corruption of safety firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SH32VWL | 32 KB FLASH, same package and pinout; identical peripherals and clock architecture; higher memory headroom for complex control algorithms. | Preferred where firmware growth is anticipated or bootloader + application partitioning is required. | Select MC9S08SH32VWL when >16 KB code space is needed; pin-compatible and drop-in replacement for MC9S08SH16VWL in TSSOP-28 layout. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core; 128 KB FLASH, 16 KB RAM; higher performance but different toolchain, no BDM, SWD debug only. | Targeting next-generation designs requiring upgrade path to 32-bit, USB, or CAN; not suitable for direct migration. | Choose S9KEAZ128AMLH for new designs needing scalable architecture; not a functional or pin-compatible alternative to MC9S08SH16VWL. |
Compared with MC9S08SH32VWL, the MC9S08SH16VWL offers identical peripheral set and low-power behavior at lower FLASH capacity-ideal for cost-sensitive, memory-constrained applications. Versus S9KEAZ128AMLH, it delivers proven 8-bit determinism, smaller footprint, and legacy toolchain continuity, but lacks 32-bit throughput and modern interface options.
Availability
MC9S08SH16VWL is available at Aetrix Electronics and suitable for industrial motor control subsystems, smart sensor nodes, automotive body electronics, and home appliance power supervisors requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08SH16VWL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and NXP's standard products division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08SH16VWL belongs to the HCS08 microcontroller family designed for cost-sensitive, low-power embedded control applications demanding high reliability, code security, and mixed-signal integration in harsh environments.
FAQ
What is the maximum bus frequency supported by the MC9S08SH16VWL?
The MC9S08SH16VWL supports a maximum bus frequency of 20 MHz via its Internal Clock Source (ICS) module. This is achieved using the frequency-locked loop (FLL) with internal or external reference; the 40-MHz CPU core derives its clock from this bus clock through a divide-by-2 prescaler. Operation at 20 MHz requires proper decoupling and crystal stability per Section 2.2.2 of the datasheet. The MC9S08SH16VWL must not be operated beyond this limit to ensure timing compliance.
Does the MC9S08SH16VWL support in-circuit debugging?
Yes, the MC9S08SH16VWL supports in-circuit debugging via a single-wire background debug (BDM) interface. It includes an on-chip debug module with two hardware breakpoints beyond the primary BDM breakpoint, an eight-deep FIFO for flow tracing, and tag/force breakpoint capability. Debugging requires compatible tools such as the P&E Micro USB-ML-12 or Cyclone Pro; no external JTAG adapter is needed. The MC9S08SH16VWL debug interface is fully functional across all operating modes including wait and stop3.
Can the MC9S08SH16VWL operate in ultra-low-power modes with ADC active?
Yes, the MC9S08SH16VWL supports ADC operation in stop3 mode - its deepest low-power state. In stop3, the ADC remains powered and functional, enabling wake-up on conversion completion or automatic compare match. This allows battery-operated systems to sample sensors periodically while consuming less than 2 μA total current. The MC9S08SH16VWL's stop3 mode retains RAM, I/O states, and peripheral configurations, eliminating boot overhead on wake-up.
What package type is used for the MC9S08SH16VWL?
The MC9S08SH16VWL is packaged in a 28-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm lead pitch, compliant with JEDEC MO-153. This surface-mount package measures 9.7 mm × 4.4 mm and is RoHS-compliant. It shares pinout compatibility with other members of the MC9S08SHxx series in TSSOP-28, including MC9S08SH32VWL, enabling layout reuse across memory variants. The MC9S08SH16VWL does not offer SOIC or QFP variants in this specific ordering code.
Is the internal temperature sensor in the MC9S08SH16VWL factory-calibrated?
Yes, the internal temperature sensor in the MC9S08SH16VWL is factory-calibrated and referenced to the internal bandgap voltage. Calibration data is stored in FLASH at fixed addresses and accessible via software; typical accuracy is ±3°C over –40°C to +105°C. The sensor operates in run, wait, and stop3 modes, and readings require ADC conversion on dedicated channel AD7. This eliminates external sensor cost in thermal monitoring applications - a key design value of the MC9S08SH16VWL.
MC9S08SH16VWL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 23
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08SH16VWL FAQ
1.How can I place an order for MC9S08SH16VWL through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SH16VWL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SH16VWL reliable?
The price and inventory of MC9S08SH16VWL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH16VWL is usually 5 days.
3.What payment methods are accepted for MC9S08SH16VWL?
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MC9S08SH16VWL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08SH16VWL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SH16VWL?
For technical support, including MC9S08SH16VWL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH16VWL requirements.
6.How does Aetrix verify that MC9S08SH16VWL is sourced from the original manufacturer or authorized distributors?
All MC9S08SH16VWL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH16VWL meets industry standards.
7.What is the process for return or replacement of MC9S08SH16VWL?
All MC9S08SH16VWL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH16VWL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SH16VWL part is unused and in its original packaging.
Return procedure for MC9S08SH16VWL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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