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NXP Semiconductors MC9S08SH32MTG

Part No.:
MC9S08SH32MTG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SH32MTG.pdf
Description:
IC MCU 8BIT 32KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,829

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Product details

Overview

MC9S08SH32MTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and a 40-MHz CPU core. It integrates ADC (16-channel, 10-bit), dual TPM PWM modules, SCI/LIN, SPI, I²C, RTC, and analog comparators - designed for cost-sensitive industrial control and automotive body electronics requiring low-power operation and robust debug support.

For engineers reviewing the MC9S08SH32MTG datasheet, MC9S08SH32MTG pinout, MC9S08SH32MTG application, or MC9S08SH32MTG equivalent, key selection criteria include FLASH endurance over voltage/temperature, stop3-mode peripheral retention (ADC, ACMP, RTC), single-wire BDM debug interface, and ICS clock source precision (±0.2% trimmed, ±2% over temp/voltage).

Technical Context

The MC9S08SH32MTG implements the HCS08 CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with trimmable internal reference, enabling bus frequencies from 2 MHz to 20 MHz without external crystal.

Peripherals operate in multiple low-power modes: ADC and ACMP retain functionality in stop3 mode; RTC runs continuously on 1-kHz internal oscillator; SCI supports LIN master break generation and wake-up on active edge. Security circuitry prevents unauthorized access to FLASH and RAM contents.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 CPUV3, 40-MHz max frequency, HC08 ISA + BGND instruction
Memory32 KB FLASH (read/program/erase across full VDD/temp), 2 KB RAM
ADC16-channel, 10-bit resolution, 2.5 μs conversion time, includes temperature sensor & bandgap reference
TimersTwo 2-channel TPM modules (input capture/output compare/PWM), 8-bit MTIM, 8-bit RTC with 1-kHz internal oscillator
CommunicationSCI (LIN-capable), SPI (master/slave, double-buffered), I²C (100 kbps, multi-master, 10-bit addressing)
Power ModesRun, Wait, Stop2, Stop3; stop3 retains ADC, ACMP, RTC, and I/O state with ultra-low current draw
DebugSingle-wire background debug interface (BDM), on-chip ICE module with 8-deep FIFO and tag/force breakpoints

Pinout & Package

MC9S08SH32MTG is housed in a 28-pin TSSOP package (JEDEC MO-153, 7.8 mm × 4.4 mm, 0.65 mm pitch) with 23 GPIOs, 1 output-only pin, 8 interrupt-capable inputs, and dedicated pins for XOSC, RESET, BKGD/MS, VDD/VSS, and analog references.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation
XOSC, EXTAL, XTALCrystal/resonator interfaceSupports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; optional external clock input
BKGD/MSBackground debug / mode selectSingle-wire BDM communication and MCU mode configuration during reset
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset signals or COP timeout
PTA0–PTA7Port A general-purpose I/O8-bit port with configurable pull-ups, slew rate, drive strength, and interrupt capability
PTB0–PTB7Port B general-purpose I/OIncludes ganged output option on PTB[5:2]; supports peripheral function multiplexing (TPM, SCI, etc.)
PTC0–PTC7Port C general-purpose I/OGanged output on PTC[3:0]; analog input channels AD0–AD7 mapped here
VREFH, VREFLAnalog reference inputsExternal or internal (bandgap) reference selection for ADC and ACMP operation

Key Features

FeatureDesign Value
FLASH security block protectionPrevents unauthorized read/write/erase of protected memory blocks via hardware-enforced lock bits
Stop3-mode peripheral retentionEnables ADC conversions, analog comparator decisions, and RTC tick generation while drawing sub-1 μA current
ICS clock trimmingFactory-trimmed internal reference achieves ±0.2% resolution and ±2% deviation over full temperature/voltage range
LIN-compliant SCIGenerates extended-break frames (13+ bit dominant) as LIN master and detects them as slave - no external transceiver required
On-chip temperature sensorIntegrated diode-based sensor calibrated to ±3°C accuracy, accessible via dedicated ADC channel
Ganged I/O writesSingle register write updates PTB[5:2] or PTC[3:0] simultaneously - reduces firmware overhead in lighting or relay control

Applications

Automotive Body Control ModuleIndustrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing real-time motor control, LIN communication with slave nodes, and ADC-based switch monitoring.

Use Value: Stop3 mode enables periodic wake-up for battery current monitoring using on-chip temperature sensor and ADC without external components.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity (via analog sensor), and ambient light.

IC Role / Device Role / Timing Role: System controller managing sensor acquisition, data logging to FLASH, and wireless wakeup via SCI or I²C host interface.

Use Value: RTC with 1-kHz internal oscillator provides precise time-stamping and scheduled wake-up intervals while consuming <1 μA in stop3 mode.

Smart Appliance SubsystemMedical Diagnostic Handheld

Use Scenario: User interface and safety interlock logic in washing machines, dishwashers, or HVAC controllers.

IC Role / Device Role / Timing Role: Safety-critical supervisor handling door switch validation, water level sensing (ADC), and motor phase timing (TPM PWM).

Use Value: Dual TPM modules generate synchronized center-aligned PWM for brushless fan/motor control while COP watchdog ensures fail-safe shutdown.

Use Scenario: Portable blood glucose meter or pulse oximeter requiring low-power operation and analog signal conditioning.

IC Role / Device Role / Timing Role: Signal acquisition MCU digitizing electrochemical sensor output via 10-bit ADC with internal bandgap reference.

Use Value: On-chip bandgap reference and temperature sensor enable calibration compensation without external components, reducing BOM count and layout area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08SG32E1MTJSame HCS08 core, 32 KB FLASH, but 20-pin TSSOP; lacks RTC and one TPM module; no LIN SCI supportSuitable for space-constrained designs where LIN and real-time scheduling are not requiredSelect when footprint reduction and basic control suffice - verify peripheral mapping against MC9S08SH32MTG's 28-pin I/O count and LIN capability
MC9S08AC32CFUEEnhanced HCS08 variant with 32 KB FLASH, 2 KB RAM, but adds CAN 2.0B controller and higher ESD rating (±8 kV); same 28-TSSOP packageRequired for automotive networks needing CAN bus integration alongside legacy LIN/SCIChoose when CAN protocol support is mandatory - note that CAN module consumes additional I/O and increases code size vs. pure LIN use cases

Compared with S9S08SG32E1MTJ and MC9S08AC32CFUE, the MC9S08SH32MTG uniquely balances LIN-compliant communication, stop3-mode analog peripheral retention, and compact 28-TSSOP packaging - making it optimal for cost-sensitive, low-power body electronics where CAN is unnecessary but precise timing and sensor integration are critical.

Availability

MC9S08SH32MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance subsystems, and portable medical diagnostics requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08SH32MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the acquisition of Freescale Semiconductor in 2015.

The MC9S08SH32MTG belongs to the legacy HCS08 microcontroller family, designed specifically for cost-optimized, low-power embedded control in automotive body electronics and industrial automation where deterministic timing, LIN compliance, and robust debug are essential.

FAQ

What is the maximum operating frequency of the MC9S08SH32MTG CPU core?

The MC9S08SH32MTG features an HCS08 CPUV3 core rated for up to 40 MHz operation. This maximum frequency is achievable when using the internal clock source (ICS) with FLL enabled and appropriate bus prescaling. The actual bus frequency ranges from 2 MHz to 20 MHz depending on ICS configuration and system requirements - all within guaranteed electrical specifications per the Rev. 3 datasheet.

Does the MC9S08SH32MTG support LIN communication natively?

Yes, the MC9S08SH32MTG's SCI module supports LIN 2.x physical layer functions natively: it can generate extended-break frames (≥13 dominant bits) as a LIN master and detect them as a LIN slave without external transceiver hardware. This capability is confirmed in Section 14.1.1 of the Rev. 3 datasheet and requires only proper software configuration of the SCI baud rate and break detection registers.

Can the MC9S08SH32MTG retain ADC functionality during low-power modes?

Yes, the MC9S08SH32MTG maintains full ADC operation - including conversions, automatic compare, and temperature sensor readings - in stop3 mode. This is explicitly documented in Sections 9.4.7 and 3.6.1 of the Rev. 3 datasheet. The ADC continues sampling using the internal 1-kHz RTC oscillator or other configured clocks, enabling battery-monitoring applications with minimal current draw.

What debug interface does the MC9S08SH32MTG provide?

The MC9S08SH32MTG implements a single-wire background debug mode (BDM) interface compliant with Freescale/NXP BDM specification v3.0. It supports breakpoint setting, memory inspection, register read/write, and flash programming via the BKGD/MS pin. An on-chip ICE module with two comparators, nine trigger modes, and an 8-deep FIFO enables advanced in-circuit emulation - all detailed in Chapter 17 of the Rev. 3 datasheet.

Is the MC9S08SH32MTG pin-compatible with other HCS08 devices in the SH-series?

No, the MC9S08SH32MTG is not universally pin-compatible across the SH-series. While it shares the 28-TSSOP package with MC9S08SH16MTG, differences in peripheral mapping (e.g., TPM channel assignments, ADC channel routing) and pin functions (e.g., PTA7 usage) require verification against individual device datasheets. Pin compatibility must be confirmed per specific variant - the Rev. 3 datasheet covers both MC9S08SH32 and MC9S08SH16 but notes functional variations in Chapter 2.

MC9S08SH32MTG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH32MTG FAQ

1.How can I place an order for MC9S08SH32MTG through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH32MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH32MTG reliable?

The price and inventory of MC9S08SH32MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH32MTG is usually 5 days.

3.What payment methods are accepted for MC9S08SH32MTG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH32MTG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08SH32MTG?

MC9S08SH32MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH32MTG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH32MTG?

For technical support, including MC9S08SH32MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH32MTG requirements.

6.How does Aetrix verify that MC9S08SH32MTG is sourced from the original manufacturer or authorized distributors?

All MC9S08SH32MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH32MTG meets industry standards.

7.What is the process for return or replacement of MC9S08SH32MTG?

All MC9S08SH32MTG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH32MTG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH32MTG part is unused and in its original packaging.

Return procedure for MC9S08SH32MTG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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