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NXP Semiconductors MC9S08SH32MTJ

Part No.:
MC9S08SH32MTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SH32MTJ.pdf
Description:
IC MCU 8BIT 32KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,930

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Product details

Overview

MC9S08SH32MTJ from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and a 40-MHz CPU core. It integrates ADC (16-channel, 10-bit), dual TPM PWM modules, SCI/LIN, SPI, I²C, ACMP, RTC, and supports stop3 mode for ultra-low-power operation in battery-powered sensor nodes.

For engineers reviewing the MC9S08SH32MTJ datasheet, MC9S08SH32MTJ pinout, MC9S08SH32MTJ application, or MC9S08SH32MTJ equivalent, this page delivers verified technical context, validated pin functions, real-world use cases, and two confirmed alternative microcontrollers for cost, footprint, or peripheral trade-offs.

Technical Context

The MC9S08SH32MTJ implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) delivers bus frequencies from 2 MHz to 20 MHz using FLL with ±0.2% trimming resolution and ±2% deviation over voltage/temperature.

Peripherals include two 2-channel TPM modules supporting input capture, output compare, and edge-/center-aligned PWM; a 10-bit ADC with 2.5 μs conversion time, temperature sensor, and internal bandgap reference; and SCI with LIN master/slave extended break handling - all operational in stop3 mode.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 S08CPUV3, 40-MHz max frequency, HC08 ISA + BGND instruction
FLASH Memory32 KB on-chip, read/program/erase across full VDD (2.7–5.5 V) and temperature range
RAM2 KB on-chip, secured against unauthorized access via hardware security circuitry
ADC16-channel, 10-bit resolution, 2.5 μs conversion time, includes temp sensor & bandgap reference
Power ModesRun, Wait, Stop2, Stop3; RTC runs in all modes using 1-kHz internal oscillator
CommunicationSCI (LIN-capable), SPI (master/slave, double-buffered), I²C (100 kbps, multi-master, 10-bit addr)
TimersTwo 2-channel TPM modules + 8-bit MTIM + 8-bit RTC with binary/decimal prescaler

Pinout & Package

MC9S08SH32MTJ is housed in a 28-pin TSSOP package (JEDEC MO-153AA), 9.7 mm × 4.4 mm × 1.2 mm body, 0.65 mm lead pitch, exposed pad optional. Pin functions are validated per Freescale MC9S08SH32 Rev. 3 datasheet Section 2.1.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation
XTAL, EXTALCrystal oscillator inputsSupports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators for precise clock source
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset signals or power-on reset assertion
BKGD/MSSingle-wire background debugEnables in-circuit debugging and programming without dedicated JTAG pins
PTA0–PTA7Port A general-purpose I/O8-bit port with configurable pull-up, slew rate, drive strength, and interrupt capability
PTB0–PTB7Port B general-purpose I/OIncludes ganged output option on PTB[5:2]; 8 interrupt-capable pins with selectable polarity
PTC0–PTC3Port C general-purpose I/OGanged output on PTC[3:0]; supports analog comparator output routing to TPM
AD0–AD15ADC input channels16 multiplexed analog inputs shared with GPIO; supports internal temp sensor and bandgap reference

Key Features

FeatureDesign Value
Stop3 ultra-low-power modeRTC continues running on 1-kHz internal oscillator; ADC, ACMP, SCI retain wake-up capability with <1 μA current draw
Integrated LIN-compliant SCIHardware support for LIN master break generation and slave break detection enables automotive body electronics integration without external transceivers
On-chip security circuitryPrevents unauthorized FLASH/RAM read-out via secure memory lock bits and illegal opcode/address detection
Double-buffered SPIEnables continuous full-duplex data transfer without CPU intervention during transmit/receive transitions
TPM PWM flexibilityEach of two TPM modules offers independent channel configuration for input capture, output compare, or edge-/center-aligned PWM with programmable dead-time

Applications

Automotive Body Control ModuleIndustrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in 12-V vehicle systems.

IC Role / Device Role / Timing Role: Main MCU executing LIN-slave protocol, managing GPIO-driven actuators, and monitoring switch inputs with debounced interrupts.

Use Value: Integrated LIN-SCI eliminates external transceiver; stop3 mode enables low-current sleep between LIN polling cycles.

Use Scenario: Battery-powered environmental monitor logging temperature, humidity, and light levels at 10-minute intervals.

IC Role / Device Role / Timing Role: System controller acquiring sensor data via ADC and ACMP, storing logs in FLASH, and transmitting via UART to gateway.

Use Value: On-chip temperature sensor and bandgap reference enable self-calibrated measurements; RTC + stop3 allow precise wake-up scheduling with sub-μA quiescent current.

Home Appliance Motor ControlMedical Diagnostic Handheld

Use Scenario: Fan speed regulation and thermal protection in smart HVAC blower units.

IC Role / Device Role / Timing Role: Real-time PWM generator for brushless DC motor commutation, with ADC feedback from current shunt and thermistor.

Use Value: Dual TPM modules provide synchronized 3-phase PWM outputs; ACMP supports fast overcurrent trip with interrupt-driven shutdown.

Use Scenario: Portable blood glucose meter requiring accurate analog measurement, button interface, and LCD drive.

IC Role / Device Role / Timing Role: Signal acquisition MCU digitizing electrochemical sensor output, managing user input, and driving segmented LCD via GPIO.

Use Value: 10-bit ADC with internal bandgap reference ensures stable calibration across battery voltage drop; ganged GPIO writes simplify LCD segment updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SH16MTJ16 KB FLASH, 1 KB RAM; identical peripheral set, package, and pinoutSuitable where firmware size ≤16 KB and cost sensitivity outweighs future FLASH headroomSelect when BOM cost reduction is prioritized and code footprint is verified under 16 KB
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB FLASH, 16 KB RAM, higher performance but different architecture and toolchainRequires migration from HC08 assembly/C to ARM GCC; supports USB, more timers, and larger memory for feature-rich upgradesChoose for long-term roadmap extension beyond 8-bit constraints, accepting requalification effort

Compared with MC9S08SH16MTJ, the MC9S08SH32MTJ provides double the FLASH and RAM for complex control algorithms or field-upgradable firmware; versus S9KEAZ128AMLH, it retains legacy HC08 toolchain compatibility and lower power in stop3 mode, but lacks ARM ecosystem scalability.

Availability

MC9S08SH32MTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance motor control, and medical handheld devices requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08SH32MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08SH32MTJ belongs to the HCS08 microcontroller family, designed for cost-sensitive, low-power embedded control applications demanding high reliability, integrated analog peripherals, and robust development support in resource-constrained environments.

FAQ

What is the maximum operating frequency of the MC9S08SH32MTJ CPU core?

The MC9S08SH32MTJ features an HCS08 CPU core rated for a maximum bus frequency of 40 MHz. This is achieved using the internal clock source (ICS) with frequency-locked loop (FLL), which supports bus frequencies from 2 MHz to 20 MHz by default; higher frequencies require external crystal oscillator (XOSC) configuration up to 38.4 kHz or 1–16 MHz, enabling full 40-MHz operation when properly configured per Section 11.4 of the MC9S08SH32 Rev. 3 datasheet.

Does the MC9S08SH32MTJ support LIN communication natively?

Yes, the MC9S08SH32MTJ supports LIN communication natively through its SCI module, which includes hardware-level LIN master extended break generation and LIN slave extended break detection. This allows direct implementation of LIN 2.x protocols without external transceivers in slave-mode applications, and simplifies master-node timing compliance. The MC9S08SH32MTJ's SCI also supports wake-up on active edge, essential for low-power LIN network participation.

What power-saving modes are available on the MC9S08SH32MTJ, and which peripherals remain active in stop3 mode?

The MC9S08SH32MTJ supports Run, Wait, Stop2, and Stop3 modes. In Stop3 mode - its deepest low-power state - the 1-kHz internal RTC oscillator remains active, and peripherals including the ADC, ACMP, SCI, and TPM modules retain wake-up capability. This enables sub-microamp quiescent current while preserving critical sensing and communication readiness, making the MC9S08SH32MTJ suitable for battery-operated applications requiring periodic wake-up and event-triggered response.

How much on-chip FLASH and RAM does the MC9S08SH32MTJ include, and is it secured against unauthorized access?

The MC9S08SH32MTJ integrates 32 KB of on-chip FLASH memory and 2 KB of RAM. Both memory blocks are protected by dedicated security circuitry that prevents unauthorized read-out via background debug or illegal address access. FLASH block protection is configurable per sector, and the device implements illegal opcode detection with automatic reset - key features ensuring firmware integrity and IP protection in the MC9S08SH32MTJ.

What is the ADC resolution and conversion speed of the MC9S08SH32MTJ, and does it include a temperature sensor?

The MC9S08SH32MTJ features a 10-bit successive-approximation ADC with 16 input channels and a typical conversion time of 2.5 μs. It includes an integrated temperature sensor and internal bandgap voltage reference channel, both accessible as ADC inputs. The ADC operates in Run, Wait, and Stop3 modes, enabling accurate thermal monitoring and self-calibration even during ultra-low-power operation - a verified capability documented in Section 9.1.5 and Table 9-1 of the MC9S08SH32 Rev. 3 datasheet.

MC9S08SH32MTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH32MTJ FAQ

1.How can I place an order for MC9S08SH32MTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH32MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MC9S08SH32MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH32MTJ is usually 5 days.

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MC9S08SH32MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH32MTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH32MTJ?

For technical support, including MC9S08SH32MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH32MTJ requirements.

6.How does Aetrix verify that MC9S08SH32MTJ is sourced from the original manufacturer or authorized distributors?

All MC9S08SH32MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH32MTJ meets industry standards.

7.What is the process for return or replacement of MC9S08SH32MTJ?

All MC9S08SH32MTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH32MTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH32MTJ part is unused and in its original packaging.

Return procedure for MC9S08SH32MTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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