NXP Semiconductors MC9S08SH32MTJR
- Part No.:
- MC9S08SH32MTJR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08SH32MTJR.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,911
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08SH32MTJR from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and a 40-MHz CPU core. It integrates ADC (10-bit, 16-channel), dual TPM PWM modules, SCI/SPI/IIC interfaces, RTC, and analog comparators - deployed in industrial sensor nodes and motor control subsystems requiring deterministic real-time response.
For engineers reviewing the MC9S08SH32MTJR datasheet, MC9S08SH32MTJR pinout, MC9S08SH32MTJR application, or MC9S08SH32MTJR equivalent, key selection criteria include stop3-mode power consumption (1.5 µA), internal clock source accuracy (±2% over voltage/temperature), 23 GPIOs with configurable slew rate, and single-wire background debug support for space-constrained embedded designs.
Technical Context
The MC9S08SH32MTJR implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its ICS module uses a frequency-locked loop (FLL) with precision-trimmed internal reference (0.2% resolution) to generate bus frequencies from 2 MHz to 20 MHz.
Peripherals operate across all power modes: ADC and ACMP remain functional in stop3 mode; RTC runs continuously on a free-running 1-kHz on-chip oscillator; SCI supports LIN master break generation and wake-up on active edge - enabling low-power communication in automotive body electronics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV3, 40-MHz max operation - enables deterministic 100-ns instruction cycle timing for real-time control loops. |
| FLASH Memory | 32 KB on-chip FLASH with block protection and full-voltage erase - supports field firmware updates without external programming hardware. |
| RAM | 2 KB on-chip RAM with security lock - prevents unauthorized access during debugging or runtime via dedicated security circuitry. |
| ADC | 16-channel, 10-bit SAR ADC with 2.5 µs conversion time and internal temperature sensor - delivers calibrated thermal monitoring without external components. |
| Power Modes | Stop3 mode draws 1.5 µA typical; RTC runs independently on 1-kHz oscillator - sustains timekeeping and wake-up capability with no external crystal. |
| Clock Sources | ICS with FLL + internal reference (±2% deviation over temp/voltage); XOSC supports 1–16 MHz crystals - eliminates need for high-precision external oscillators in cost-sensitive designs. |
| I/O Pins | 23 general-purpose I/O pins with hysteresis, configurable pull-ups, slew rate, and drive strength - simplifies interface to diverse sensors, actuators, and legacy logic families. |
Pinout & Package
MC9S08SH32MTJR is housed in a 28-pin TSSOP package (JEDEC MO-153AA), 9.7 mm × 4.4 mm × 1.2 mm, lead pitch 0.65 mm, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply domains: VDD powers digital core and I/O; VSS provides common return - requires local decoupling per datasheet layout guidelines. |
| XTAL, EXTAL | Crystal oscillator input/output | Supports Pierce oscillator configuration with 1–16 MHz crystals or ceramic resonators - enables precise timing for serial protocols and RTC calibration. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external push-button or supervisor IC assertion - ensures reliable initialization under brownout or ESD events. |
| BKGD/MS | Single-wire background debug / mode select | Enables in-circuit debugging and programming via BDM interface; also selects boot mode - eliminates need for separate JTAG header in production PCBs. |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit bidirectional port with interrupt capability on each pin; supports ganged output for PTB[5:2] and PTC[3:0] - reduces software overhead in LED matrix or relay bank control. |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port with selectable polarity interrupts; includes dedicated SCI transmit/receive pins (PTB1/PTB0) - simplifies UART wiring for diagnostics or host communication. |
| PTC0–PTC7 | Port C general-purpose I/O | 8-bit port with analog comparator inputs (ACMP0+/−), ADC channel inputs (AD0–AD7), and TPM outputs - enables mixed-signal signal conditioning and PWM-driven actuation on same port. |
Key Features
| Feature | Design Value |
|---|---|
| Stop3-mode operation with RTC active | Enables ultra-low-power sleep with periodic wake-up using only on-chip 1-kHz oscillator - eliminates external RTC chip and associated BOM cost. |
| On-chip security circuitry | Prevents unauthorized read-out of FLASH and RAM contents during debug or runtime - meets basic IP protection requirements for firmware licensing. |
| Single-wire BDM interface | Reduces debug footprint to one signal plus ground - ideal for space-constrained modules where SWD/JTAG headers are impractical. |
| Integrated temperature sensor | Provides factory-calibrated die temperature measurement via ADC channel - removes need for external thermistor or digital sensor in thermal management systems. |
| LIN-compliant SCI module | Generates extended breaks for LIN master and detects them as slave - supports automotive body control networks without external LIN transceiver. |
Applications
| Industrial Sensor Node | Automotive Body Control |
|---|---|
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data at 10-second intervals. IC Role / Device Role / Timing Role: Central controller managing sensor polling, ADC sampling, LIN/SCI communication, and stop3-mode power cycling. Use Value: 1.5 µA stop3 current and integrated RTC enable 5+ year battery life; on-chip temperature sensor eliminates external calibration component. | Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting via LIN cluster. IC Role / Device Role / Timing Role: LIN slave node executing command decoding, PWM motor control, and fault monitoring. Use Value: LIN-compliant SCI with extended break detection allows direct connection to vehicle LIN bus; dual TPM modules drive two independent motors with center-aligned PWM. |
| Small-Appliance Motor Control | Smart HVAC Actuator |
Use Scenario: Brushless DC fan controller in air purifier requiring speed regulation and thermal shutdown. IC Role / Device Role / Timing Role: Real-time motor commutation engine using TPM PWM outputs and ADC feedback from current sense and thermistor. Use Value: 2.5 µs ADC conversion time supports 20 kHz current-loop sampling; ACMP with bandgap reference enables fast overcurrent detection (<1 µs response). | Use Scenario: Damper actuator in ducted HVAC system requiring position feedback, torque limiting, and scheduled operation. IC Role / Device Role / Timing Role: Position controller interfacing potentiometer (ADC), driving bi-directional motor (TPM PWM), and scheduling cycles via RTC. Use Value: Ganged I/O on PTB/PTC allows simultaneous direction and enable control; RTC with decimal prescaler supports precise 15-minute ventilation schedules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SH16MTJR | 16 KB FLASH, 1 KB RAM, identical peripheral set and pinout - functionally compatible but halved program memory capacity. | Suitable for simpler firmware with <16 KB code footprint; not viable for OTA-upgradable or feature-rich implementations. | Select when BOM cost reduction outweighs future firmware scalability needs and memory headroom is verified. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, enhanced ADC (12-bit, 16 ch), but different architecture and toolchain. | Requires migration from HC08 assembly/C to ARM GCC; supports higher performance and RTOS but increases design complexity. | Choose for new designs needing >32 KB code space, USB, or future-proofing - not a drop-in replacement. |
Compared with MC9S08SH16MTJR, the MC9S08SH32MTJR offers double FLASH and RAM for complex control algorithms; versus S9KEAZ128AMLH, it retains legacy toolchain compatibility and lower power in stop3 mode but lacks ARM ecosystem advantages.
Availability
MC9S08SH32MTJR is available at Aetrix Electronics and suitable for industrial sensor nodes, automotive body control modules, small-appliance motor controllers, and smart HVAC actuators requiring stable component supply across multi-year production cycles.
Supply support for MC9S08SH32MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's microcontroller heritage.
The MC9S08SH32MTJR belongs to the HCS08 family - designed for cost-sensitive, ultra-low-power embedded control applications where deterministic real-time response, minimal external components, and long-term supply stability are critical.
FAQ
What is the maximum operating frequency of the MC9S08SH32MTJR CPU core?
The MC9S08SH32MTJR features an HCS08 CPU core rated for up to 40 MHz operation. This corresponds to a 25 ns instruction cycle time, enabling deterministic execution of time-critical control tasks such as motor commutation and sensor sampling. The actual bus frequency is derived from the internal clock source (ICS) or external crystal and is configurable from 2 MHz to 20 MHz per the ICS module specification. MC9S08SH32MTJR achieves this performance while maintaining compatibility with legacy HC08 software tools.
Does the MC9S08SH32MTJR support in-circuit debugging, and what interface is used?
Yes, the MC9S08SH32MTJR supports in-circuit debugging via a single-wire background debug mode (BDM) interface using the BKGD/MS pin. This interface enables full-speed execution control, breakpoint setting (one hardware breakpoint plus two more in the on-chip debug module), and memory inspection without halting system clocks. MC9S08SH32MTJR does not require a dedicated JTAG header, reducing PCB footprint and BOM cost compared to multi-pin debug solutions.
What power-saving modes are available on the MC9S08SH32MTJR, and which peripherals remain active in stop3 mode?
The MC9S08SH32MTJR supports two very low-power stop modes (stop2 and stop3), plus reduced-power wait mode. In stop3 mode - drawing just 1.5 µA typical - the real-time counter (RTC) continues running on its dedicated 1-kHz internal oscillator, and both the ADC and analog comparators (ACMP) remain fully operational. MC9S08SH32MTJR also retains RAM contents and security state, allowing rapid wake-up with preserved context for battery-powered applications.
Can the MC9S08SH32MTJR operate without an external crystal, and what clock accuracy is achievable?
Yes, the MC9S08SH32MTJR can operate entirely from its internal clock source (ICS) module, which uses a frequency-locked loop (FLL) with a precision-trimmed internal reference. This delivers ±2% frequency deviation over full temperature and voltage ranges, and ±1.5% with internal temperature compensation enabled. MC9S08SH32MTJR thus eliminates the need for external crystals in cost-sensitive or space-constrained designs while maintaining sufficient accuracy for UART communication and RTC scheduling.
What analog features are integrated into the MC9S08SH32MTJR, and how are they utilized in sensor applications?
The MC9S08SH32MTJR integrates a 16-channel, 10-bit ADC with 2.5 µs conversion time, an on-die temperature sensor, internal bandgap reference, and two analog comparators (ACMP) with interrupt capability and routing to TPM modules. These features allow direct interfacing with thermistors, potentiometers, current-sense resistors, and voltage dividers. MC9S08SH32MTJR's ADC automatic compare function and ACMP edge-triggered interrupts enable responsive threshold detection - essential for overtemperature shutdown, end-stop sensing, and battery voltage monitoring without CPU intervention.
MC9S08SH32MTJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08SH32MTJR FAQ
1.How can I place an order for MC9S08SH32MTJR through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08SH32MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08SH32MTJR reliable?
The price and inventory of MC9S08SH32MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH32MTJR is usually 5 days.
3.What payment methods are accepted for MC9S08SH32MTJR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH32MTJR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08SH32MTJR?
MC9S08SH32MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08SH32MTJR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08SH32MTJR?
For technical support, including MC9S08SH32MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH32MTJR requirements.
6.How does Aetrix verify that MC9S08SH32MTJR is sourced from the original manufacturer or authorized distributors?
All MC9S08SH32MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH32MTJR meets industry standards.
7.What is the process for return or replacement of MC9S08SH32MTJR?
All MC9S08SH32MTJR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH32MTJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08SH32MTJR part is unused and in its original packaging.
Return procedure for MC9S08SH32MTJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08SH32MTJR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

.jpg)