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NXP Semiconductors MC9S08SH4MTGR

Part No.:
MC9S08SH4MTGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMC9S08SH4MTGR.pdf
Description:
IC MCU 8BIT 4KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,300

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Product details

Overview

MC9S08SH4MTGR from Freescale Semiconductor is an 8-bit HCS08 microcontroller with 4 KB Flash, 256 B RAM, and a 40-MHz CPU core. It integrates ADC (12-channel, 10-bit), SPI, I²C, SCI, two TPM modules, RTC, ACMP, and supports Stop3 mode for ultra-low-power operation. Used in battery-powered sensor nodes and industrial control panels requiring deterministic real-time response.

For engineers reviewing the MC9S08SH4MTGR datasheet, MC9S08SH4MTGR pinout, MC9S08SH4MTGR application, or MC9S08SH4MTGR equivalent, key selection criteria include Flash endurance (100k erase/write cycles), internal clock source accuracy (±2% over voltage/temperature), QFN-24 package thermal performance, and background debug interface compatibility with standard S08 tools.

Technical Context

The MC9S08SH4MTGR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Internal Clock Source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (0.2% resolution, ±2% deviation over -40°C to 125°C) to generate bus frequencies from 2 MHz to 20 MHz.

Peripherals operate across power modes: ADC and ACMP remain functional in Stop3 mode; RTC runs continuously on 1-kHz low-power oscillator; SCI supports LIN master break generation and wake-up on active edge; TPM modules support input capture, output compare, and edge- or center-aligned PWM.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 8-bit CPU, 40-MHz max operation - enables deterministic real-time control at sub-25 ns instruction cycle time
Flash Memory4 KB on-chip Flash - supports read/program/erase over full operating voltage (2.7–5.5 V) and temperature (-40°C to 125°C)
RAM256 B on-chip RAM - sufficient for stack, variables, and small buffers in deeply embedded firmware
ADC12-channel, 10-bit SAR ADC with 2.5 µs conversion - supports fast sampling of analog sensors without external timing circuitry
RTC8-bit real-time counter with binary/decimal prescaler - provides calendar/time-of-day functions using free-running 1-kHz internal oscillator
Power ModesTwo very low-power stop modes (Stop2/Stop3), reduced-power wait mode - achieves sub-1 µA current draw in Stop3 with RTC active
Clock SourcesExternal crystal (1–16 MHz) + internal ICS with FLL - eliminates need for external clock generator in cost-sensitive designs

Pinout & Package

MC9S08SH4MTGR is housed in a 24-pin QFN package (5 mm × 5 mm, 0.5 mm pitch) with exposed thermal pad. Pinout conforms to MC9S08SH8 family layout per datasheet Rev. 3 (June 2008), with identical signal mapping for all 24 pins.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDADSupply voltage inputsDual supply rails: VDD powers digital logic; VDDAD powers analog peripherals (ADC, ACMP) - requires separate filtering for noise immunity
VSS, VSSADGround returnsDigital and analog ground planes must be connected at single point near MCU to minimize coupling between domains
XTAL, EXTALCrystal oscillator terminalsSupports Pierce oscillator configuration with 31.25 kHz–16 MHz crystals - enables precise timing for communication or measurement
RESETActive-low reset inputAsynchronous reset with internal pull-up - allows external reset supervisor or manual reset button integration
BKGD/MSSingle-wire debug interfaceEnables in-circuit debugging and programming via background debug mode - no JTAG header required
PTA0–PTA7Port A general-purpose I/O8-bit port with configurable pull-ups, slew rate, and drive strength - supports ganged output and pin-interrupt capability
PTB0–PTB7Port B general-purpose I/O8-bit port; PTB[5:2] supports ganged output - simplifies LED array or relay bank control with single write
PTC0–PTC3Port C general-purpose I/O4-bit port; PTC[3:0] supports ganged output - ideal for compact status indicator groups

Key Features

FeatureDesign Value
FLASH Block ProtectionHardware-enforced protection of boot vector and user code sections prevents accidental overwrite during field updates
Low-Voltage DetectionSelectable trip points (e.g., 2.5 V, 3.0 V) trigger reset or interrupt - safeguards against brown-out corruption in wide-input-voltage systems
On-Chip Debug ModuleTwo comparators + nine trigger modes + eight-deep FIFO - enables precise trace-based debugging without external logic analyzer
Internal Bandgap ReferenceStable 1.2 V reference used by ADC and ACMP - eliminates need for external voltage reference in sensor front-end designs
SCI with LIN SupportLIN master extended break generation and slave extended break detection - enables direct integration into automotive body electronics networks

Applications

Industrial Sensor NodeSmart Thermostat Controller

Use Scenario: Battery-powered temperature/humidity sensor node transmitting data via UART to gateway every 30 seconds.

IC Role / Device Role / Timing Role: Main system controller managing ADC sampling, RTC-triggered wake-up, low-power sleep, and serial transmission.

Use Value: Stop3 mode draws <1 µA while RTC maintains accurate wake interval; internal bandgap reference ensures consistent ADC readings across battery discharge.

Use Scenario: Residential HVAC control unit monitoring room temperature, driving relays, and displaying status on segmented LCD.

IC Role / Device Role / Timing Role: Real-time system orchestrator handling sensor reads, PID computation, relay actuation, and display refresh.

Use Value: 40-MHz CPU delivers sub-millisecond loop execution; TPM modules generate precise PWM for fan speed control; ganged I/O reduces GPIO overhead for display segment drivers.

Automotive Body Control ModulePortable Medical Monitor

Use Scenario: Door lock/unlock module communicating over LIN bus with central body controller.

IC Role / Device Role / Timing Role: LIN slave node executing secure command parsing, solenoid driver control, and fault reporting.

Use Value: Integrated LIN-compliant SCI eliminates external transceiver; low-voltage detection prevents erratic behavior during vehicle cranking (9–16 V range).

Use Scenario: Handheld pulse oximeter acquiring analog photodiode signals, computing SpO₂, and storing trend data.

IC Role / Device Role / Timing Role: Signal acquisition processor running ADC in burst mode, applying digital filtering, and managing flash logging.

Use Value: 10-bit ADC with 2.5 µs conversion captures rapid photoplethysmogram waveforms; 100k-cycle Flash endurance supports long-term patient data retention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08SH8MTGR8 KB Flash, 512 B RAM, same peripheral set and pinout - direct upgrade path with doubled memory capacityRequired where firmware complexity exceeds 4 KB or data logging needs exceed 256 B RAM bufferSelect MC9S08SH8MTGR when future-proofing for feature expansion or longer data history without PCB change
S9S08SG48E1MTJR48-pin LQFP, 48 KB Flash, enhanced I²C/SPI timing, higher temp grade (−40°C to 105°C) - not pin-compatibleSuitable for more complex control tasks with larger code footprint and extended ambient temperature requirementsChoose S9S08SG48E1MTJR only when migrating to higher I/O count, greater memory, or wider industrial temperature range

Compared with MC9S08SH4MTGR, MC9S08SH8MTGR offers immediate memory scalability within identical QFN-24 packaging and toolchain compatibility, while S9S08SG48E1MTJR trades pin compatibility for significantly expanded resources and thermal robustness - making it appropriate only for new designs targeting higher complexity.

Availability

MC9S08SH4MTGR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart thermostat controllers, and automotive body control modules requiring stable component supply and long-term production continuity.

Supply support for MC9S08SH4MTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and consumer markets.

The MC9S08SHx series targets cost-sensitive, low-power 8-bit control applications - emphasizing integrated analog peripherals, ultra-low-power stop modes, and single-wire debug for rapid development in resource-constrained environments.

FAQ

What is the maximum operating frequency of the MC9S08SH4MTGR?

The MC9S08SH4MTGR features a 40-MHz HCS08 CPU core, enabling instruction execution at 25 ns per cycle. Its internal clock source (ICS) supports bus frequencies from 2 MHz to 20 MHz using the frequency-locked loop (FLL), and external crystal oscillators up to 16 MHz. The 40-MHz core rating reflects peak processing capability under optimal conditions, and the MC9S08SH4MTGR maintains full functionality across its specified voltage (2.7–5.5 V) and temperature (−40°C to 125°C) ranges.

Does the MC9S08SH4MTGR support in-circuit debugging?

Yes, the MC9S08SH4MTGR includes a single-wire background debug interface (BKGD/MS pin) compliant with the HCS08 standard. This interface supports breakpoint setting, memory inspection, register read/write, and flash programming without halting real-time operation. The on-chip debug module contains two comparators, nine trigger modes, and an eight-deep FIFO for change-of-flow tracing - all accessible via standard S08 debug tools such as P&E Micro's Cyclone or SEGGER J-Link with appropriate adapter.

What power-saving modes does the MC9S08SH4MTGR offer?

The MC9S08SH4MTGR provides three primary low-power modes: Wait mode (CPU halted, peripherals active), Stop2 (deep sleep with partial peripheral retention), and Stop3 (ultra-low-power state drawing <1 µA while maintaining RTC operation). In Stop3, the 1-kHz internal low-power oscillator continues running to sustain real-time wake-up intervals, and both ADC and ACMP retain functionality - allowing sensor sampling without full wake-up. These modes are controlled via the System Power Management Status and Control registers (SPMSC1/SPMSC2).

Is the MC9S08SH4MTGR pin-compatible with other devices in the SHx family?

Yes, the MC9S08SH4MTGR shares identical pin assignment and electrical characteristics with the MC9S08SH8MTGR and MC9S08SH16MTGR in the 24-QFN package variant. All SHx QFN-24 devices use the same mechanical outline (98ASA00474D per Freescale QFN Addendum Rev. 0, July 2014) and signal mapping per datasheet Rev. 3. This allows direct substitution of MC9S08SH4MTGR with MC9S08SH8MTGR for memory upgrades without PCB redesign - provided firmware accommodates the increased Flash/RAM resources.

What analog peripherals are integrated into the MC9S08SH4MTGR?

The MC9S08SH4MTGR integrates a 12-channel, 10-bit successive-approximation ADC with 2.5 µs conversion time, automatic compare function, and built-in temperature sensor; plus a dual-input analog comparator (ACMP) with selectable interrupt edges and routing capability to TPM modules. Both peripherals operate in Stop3 mode. An internal 1.2 V bandgap reference serves ADC and ACMP, eliminating external reference components. Analog supplies (VDDAD/VSSAD) are separated from digital rails to ensure noise immunity in mixed-signal applications.

MC9S08SH4MTGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08SH4MTGR FAQ

1.How can I place an order for MC9S08SH4MTGR through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08SH4MTGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08SH4MTGR reliable?

The price and inventory of MC9S08SH4MTGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08SH4MTGR is usually 5 days.

3.What payment methods are accepted for MC9S08SH4MTGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08SH4MTGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08SH4MTGR?

MC9S08SH4MTGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08SH4MTGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08SH4MTGR?

For technical support, including MC9S08SH4MTGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08SH4MTGR requirements.

6.How does Aetrix verify that MC9S08SH4MTGR is sourced from the original manufacturer or authorized distributors?

All MC9S08SH4MTGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08SH4MTGR meets industry standards.

7.What is the process for return or replacement of MC9S08SH4MTGR?

All MC9S08SH4MTGR units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08SH4MTGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08SH4MTGR part is unused and in its original packaging.

Return procedure for MC9S08SH4MTGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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